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[미국특허] Microelectronic contact structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-013/24
출원번호 US-0328083 (2002-12-23)
발명자 / 주소
  • Grube, Gary W.
  • Mathieu, Gaetan L.
  • Madsen, Alec
출원인 / 주소
  • FormFactor, Inc.
인용정보 피인용 횟수 : 50  인용 특허 : 40

초록

An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermed

대표청구항

1. An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis, the structure comprising:a plurality of laminated structural layers, each of the layers comprised of a structural material; a substantially rigid base portion at a proximal end of the structure; a resilie

이 특허에 인용된 특허 (40) 인용/피인용 타임라인 분석

  1. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.
  2. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  3. Johnston Charles J. (Walnut CA) Swart Mark A. (Upland CA), Electrical test probe having rotational control of the probe shaft.
  4. Alcoe David James ; Caletka David Vincent, Electronic component test apparatus with rotational probe and conductive spaced apart means.
  5. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
  6. Cray Seymour R. (Chippewa Falls WI) Krajewski Nicholas J. (Elk Mound WI), Flying leads for integrated circuits.
  7. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density probe.
  8. Ainslie Norman G. (Croton-on-Hudson NY) Krzanowski James E. (Watertown MA) Palmateer Paul H. (Wappingers Falls NY), High melting point process for Au:Sn:80:20 brazing alloy for chip carriers.
  9. Jones Mark R. ; Khoury Theodore A., High performance integrated circuit chip package.
  10. Levy Paul S. (Chandler AZ), High-frequency coaxial interface test fixture.
  11. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.
  12. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Interface card for a probe card assembly.
  13. Lee Shaw Wei (10410 Miller Ave. Cupertino CA 95014), Known good die test apparatus and method.
  14. Ho Yu Q. (Kanata CAX) Jolly Gurvinder (Orleans CAX) Emesh Ismail T. (Cumberland CAX), Method for forming interconnect structures for integrated circuits.
  15. Belmont Andre,FRX ; Reynaud Vincent,FRX ; Daniau William,FRX, Method for making cards with multiple contact tips for testing semiconductor chips.
  16. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.
  17. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
  18. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
  19. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Micro contact pin structure with a piezoelectric element and probe card using the same.
  20. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.
  21. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.
  22. Sugihara Osamu (Nagasaka JPX), Microprobe provided circuit substrate and method for producing the same.
  23. Lewis Stephan P. (Hermosa Beach CA), Multiple mode buckling beam probe assembly.
  24. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.
  25. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.
  26. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card and method of forming a probe card.
  27. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.
  28. Trenary Dale T. (San Jose CA), Probe card for integrated circuit chip.
  29. Mizuta Masaharu,JPX, Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same.
  30. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.
  31. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Semiconductor structure and method of manufacture.
  32. Leas James M. (South Burlington VT) Koss Robert W. (Burlington VT) Walker George F. (New York NY) Perry Charles H. (Poughkeepsie NY) Van Horn Jody J. (Underhill VT), Semiconductor wafer test and burn-in.
  33. Reymond Welles K. (Waterbury CT), Spring biased tapered contact elements for electrical connectors and integrated circuit packages.
  34. Kuan Chi-Te,TWX, Structure of a terminal.
  35. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Tandem loop contact for an electrical connector.
  36. Schmid Rainer,DEX ; Giringer Klaus,DEX ; Gauss Ulrich,DEX ; Deusch Heinz,DEX, Test head for microstructures with interface.
  37. Faure Louis H. (Poughkeepsie NY) Spoor Terence W. (Marlboro NY), Test probe assembly using buckling wire probes within tubes having opposed overlapping slots.
  38. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
  39. Shiraishi Shogo (Kitakyushu JPX), Universal probe card for use in a semiconductor chip die sorter test.
  40. Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.

이 특허를 인용한 특허 (50) 인용/피인용 타임라인 분석

  1. Mathieu, Gaetan L., Air bridge structures and methods of making and using air bridge structures.
  2. Mathieu,Gaetan L., Air bridge structures and methods of making and using air bridge structures.
  3. Fang, Treliant; Harburn, Michael; Yaglioglu, Onnik, Anchoring carbon nanotube columns.
  4. Northey, William A., Battery contact.
  5. Tai, Yung Yu, Battery contact.
  6. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
  7. Chen, Richard T.; Kruglick, Ezekiel J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
  8. Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
  9. Chen, Jimmy K.; Fang, Treliant; Harburn, Michael; Khandros, Igor Y.; Martens, Rodney I.; Mathieu, Gaetan L.; Slocum, Alexander H.; Yaglioglu, Onnik, Carbon nanotube spring contact structures with mechanical and electrical components.
  10. Fjelstad, Joseph C., Connector constructions for electronic applications.
  11. Fjelstad, Joseph C., Connector constructions for electronic applications.
  12. Chang, I-Chang, Contact pin structure.
  13. Fang, Treliant; Gritters, John K.; Yaglioglu, Onnik, Elastic encapsulated carbon nanotube based electrical contacts.
  14. Weiland, Achim; Boehm, Gunther, Electrical contact element for contacting an electrical component under test and contacting apparatus.
  15. Neidich, Douglas A.; Taylor, Paul R., Interposer assembly with flat contacts.
  16. Kister, January, Knee probe having reduced thickness section for control of scrub motion.
  17. Kister, January, Layered probes with core.
  18. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.
  19. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
  20. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
  21. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
  22. Grube, Gary W.; Mathieu, Gaetan L.; Madsen, Alec, Microelectronic contact structure.
  23. Di Stefano, Thomas H., Miniature electrical ball and tube socket assembly with self-capturing multiple-contact-point coupling.
  24. Di Stefano, Thomas H., Miniature electrical ball and tube socket assembly with self-capturing multiple-contact-point coupling.
  25. Di Stefano, Thomas H., Miniature electrical ball and tube socket assembly with self-capturing multiple-contact-point coupling.
  26. Di Stefano, Thomas H., Miniature electrical socket assembly with self-capturing multiple-contact-point coupling.
  27. Kister, January, Multiple contact probes.
  28. Kister, January, Multiple contact probes.
  29. Breinlinger, Keith J.; Eldridge, Benjamin N.; Hobbs, Eric D.; Armstrong, Michael J.; Gritters, John K., Non-linear vertical leaf spring.
  30. Chen,Ping, Press-fit pin.
  31. Kister, January, Probe bonding method having improved control of bonding material.
  32. Fan, Li; Kelly-Greene, Darcy K.; Milovic, Edward J.; Nagai, Gensaku; Selvaraj, Mukesh K.; Zhang, Jim, Probe card assembly for testing electronic devices.
  33. Eldridge, Benjamin N.; Gritters, John K.; Martens, Rodney I.; Slocum, Alexander H.; Yaglioglu, Onnik, Probe card assembly with carbon nanotube probes having a spring mechanism therein.
  34. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers.
  35. Kister, January; Shtarker, Alex, Probe retention arrangement.
  36. Kister, January; Shtarker, Alex, Probe retention arrangement.
  37. Kister, January, Probe skates for electrical testing of convex pad topologies.
  38. Fan, Li; Xu, Rui, Probe with cantilevered beam having solid and hollow sections.
  39. Kister, January, Probes with high current carrying capability and laser machining methods.
  40. Kister, January, Probes with offset arm and suspension structure.
  41. Hobbs, Eric D., Rotating contact element and methods of fabrication.
  42. Chabineau-Lovgren, Scott; Sargeant, Steve B.; Swart, Mark A., Scrub inducing compliant electrical contact.
  43. Di Stefano,Thomas H.; Faraci,Anthony B.; Karavakis,Konstantine; Di Stefano,Peter T., Self-cleaning socket for microelectronic devices.
  44. Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.
  45. Crafts, Douglas E.; Bhardwaj, Jyoti K., Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures.
  46. Yasumura, Gary; Wiedemann, William F.; Fjelstad, Joseph C.; Segaram, Para K.; Grundy, Kevin P., Torsionally-induced contact-force conductors for electrical connector systems.
  47. Chen, Richard T.; Arat, Vacit; Folk, Chris; Cohen, Adam L., Two-part microprobes for contacting electronic components and methods for making such probes.
  48. Kister, January, Vertical guided layered probe.
  49. Kister, January, Vertical probe array arranged to provide space transformation.
  50. Kister, January, Vertical probe array arranged to provide space transformation.

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