[미국특허]
Optical package substrate and optical device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G02B-006/30
G02B-006/26
출원번호
US-0308091
(2002-12-03)
우선권정보
JP-0370151 (2001-12-04)
발명자
/ 주소
Korenaga, Tsuguhiro
Itoh, Nobuki
Tojo, Masaaki
Wada, Toshihiko
출원인 / 주소
Matsushita Electric Industrial Co., Ltd.
대리인 / 주소
Wenderoth, Lind &
인용정보
피인용 횟수 :
10인용 특허 :
8
초록▼
An optical package substrate and a molding method therefor which provide for easy production, easy mounting of optical elements such as photodiodes and lasers, good functionality, productivity and economy, and an optical device incorporating the package substrate. On the surface of an optical packag
An optical package substrate and a molding method therefor which provide for easy production, easy mounting of optical elements such as photodiodes and lasers, good functionality, productivity and economy, and an optical device incorporating the package substrate. On the surface of an optical package substrate, a guide groove used for the positioning of an optical fiber and a tapered face adjoining the guide groove are provided, the tapered face being formed to have a predetermined angle. A mirror for reflecting light is formed on the tapered face. An optical fiber is affixed in the guide groove. A surface reception type photodiode, which is placed in a position for receiving light deflected by the mirror, is mounted above the tapered face. By providing a positioning marker for a light receiving element on the optical package substrate, it becomes particularly easy to mount the surface reception type photodiode through passive alignment.
대표청구항▼
1. An optical package substrate for mounting at least one of an optical component and an optical element thereon, said optical package substrate comprising:a stage portion having a light receiving/emitting element mounted thereon, said stage portion being operable to fix an optical axis of said ligh
1. An optical package substrate for mounting at least one of an optical component and an optical element thereon, said optical package substrate comprising:a stage portion having a light receiving/emitting element mounted thereon, said stage portion being operable to fix an optical axis of said light receiving/emitting element, and said stage portion being formed on a surface of said substrate; and an optical path deflection section operable to deflect an optical path by reflection, said optical path deflection section being formed on the surface of said substrate so as to be in a position intersecting the optical axis of said light receiving/emitting element mounted on said stage portion. 2. The optical package substrate according to claim 1, wherein a thin film element having a mirror property is provided on said optical path deflection section.3. The optical package substrate according to claim 1, wherein a diffraction grating operable to create different optical paths for different optical wavelengths is provided on said optical path deflection section.4. The optical package substrate according to claim 1, wherein said optical path deflection section has a curvature for converging a plurality of incident rays through reflection.5. The optical package substrate according to claim 1, wherein said optical package substrate comprises glass.6. The optical package substrate according to claim 1, wherein said optical package substrate is molded by pressing a die against a substrate material which is softened by being heated to a high temperature to transcribe an inverted pattern of the die onto the substrate material, the die being obtained through microdischarge machining using a normal-grinding tool and an arbitrary fine-grinding tool, which is produced through microdischarge machining.7. The optical package substrate according to claim 5, wherein said optical package substrate is molded by pressing a die against a substrate material which is softened by being heated to a high temperature to transcribe an inverted pattern of the die onto the substrate material, the die being obtained through microdischarge machining using a normal-grinding tool and an arbitrary fine-grinding tool, which is produced through microdischarge machining.8. The optical package substrate according to claim 1, further comprising a waveguide section formed on the surface of said substrate, said waveguide section corresponding to an optical waveguide core pattern having an optical axis coinciding with an optical axis of said light receiving/emitting element mounted on said stage portion.9. The optical package substrate according to claim 8, wherein a thin film element having a mirror property is provided on said optical path deflection section.10. The optical package substrate according to claim 8, wherein a diffraction grating operable to create different optical paths for different optical wavelengths is provided on said optical path deflection section.11. The optical package substrate according to claim 8, wherein said optical path deflection section has a curvature for converging a plurality of incident rays through reflection.12. The optical package substrate according to claim 8, wherein said optical package substrate comprises glass.13. The optical package substrate according to claim 8, wherein the optical package substrate is molded by pressing a die against a substrate material which is softened by being heated to a high temperature to transcribe an inverted pattern of the die onto the substrate material, the die being obtained through microdischarge machining using a normal-grinding tool and an arbitrary fine-grinding tool, which is produced through microdischarge machining.14. The optical package substrate according to claim 12, wherein the optical package substrate is molded by pressing a die against a substrate material which is softened by being heated to a high temperature to transcribe an inverted pattern of the die onto the substrate material, the die being obtained through microdischarge machining using a normal-grinding tool and an arbitrary fine-grinding tool, which is produced through microdischarge machining.15. An optical device having at least one of an optical component and an optical element mounted on an optical package substrate,wherein said optical package substrate comprises: a stage portion having a light receiving/emitting element mounted thereon, said stage portion being operable to fix an optical axis of said light receiving/emitting element, and said stage portion being formed on a surface of said substrate; and an optical path deflection section operable to deflect an optical path by reflection, said optical path deflection section being formed on the surface of said substrate so as to be in a position intersecting the optical axis of said light receiving/emitting element mounted on said stage portion wherein said light receiving/emitting element is affixed to said stage portion on said optical package substrate. 16. The optical device according to claim 15, further comprising a surface mounting type light receiving/emitting element which is optically coupled to said light receiving/emitting element affixed to said stage portion through the optical path deflected by said optical path deflection section.17. The optical device according to claim 15,wherein said optical package substrate further comprises a waveguide section formed on the surface of said substrate, said waveguide section corresponding to an optical waveguide core pattern having an optical axis coinciding with an optical axis of said light receiving/emitting element mounted on said stage portion; and wherein said optical device further comprises a predetermined substrate, wherein a core material having a refractive index which is higher than a refractive index of said optical package substrate is filled in said waveguide section of said optical package substrate, and thereafter, an adhesive having a refractive index which is lower than the refractive index of the core material is used to attach said predetermined substrate to said waveguide section. 18. The optical device according to claim 17, further comprising a surface mounting type light receiving/emitting element which is optically coupled to said optical waveguide defined in said waveguide section through the optical path deflected by said optical path deflection section.
Backlin Lennart,SEX ; Backlund Ylva,SEX ; Elderstig H.ang.kan,SEX ; Lindgren Stefan,SEX ; Steijer Odd,SEX, Method and arrangement for coupling a wave guide to a component.
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