초록 ▼

A butt joined electronic assembly has first and second matching coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective inde

A butt joined electronic assembly has first and second matching coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second matching coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.

대표청구항 ▼

1. A butt joined opto-electronic assembly for millimeter wavelength frequencies comprising:a first carrier having an open end face and an opto-electrical element positioned on the carrier with an opto-electrical device formed on at least one horizontal surface of the opto-electrical element and coup

1. A butt joined opto-electronic assembly for millimeter wavelength frequencies comprising:a first carrier having an open end face and an opto-electrical element positioned on the carrier with an opto-electrical device formed on at least one horizontal surface of the opto-electrical element and coupled to receive an optical signal from an optical waveguide secured to the carrier;a second carrier having an open end face and an electrical element positioned on the carrier with an electrical device formed on at least one horizontal surface of the electrical element;first and second matched coplanar transmission structures with one of the matched coplanar transmission structures formed on at least one horizontal surface of the opto-electrical element and the other matched coplanar transmission structure formed on at least one horizontal surface of the electrical element with each of the first and second matched coplanar transmission structures being electrically coupled to one of the respective opto-electrical and electrical devices, the first and second matched coplanar transmission structures being independently aligned in three mutually perpendicular planes and positioned in a proximate abutting relationship;the first and second carriers being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single assembly by a securing member with the first and second carriers being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the first and second matched coplanar transmission structures; andsubstantially flat electrical conductors electrically coupling the first and second matched coplanar transmission structures together.2. The butt joined opto-electronic assembly as recited in claims 1 wherein first and second matched coplanar transmission structures have sub-millimeter lateral separation.3. The butt joined opto-electronic assembly as recited in claim 1 further comprising at least a first mounting dielectric substrate having an end face, with the mounting dielectric substrate mounted on at least one of the open end face carriers and having one of the opto-electrical and electrical elements positioned thereon.4. The butt joined opto-electronic assembly as recited in claim 3 further comprising at least a second mounting dielectric substrate having an end face, with the second mounting dielectric substrate mounted on the other open end face carrier and having the other of the opto-electrical and electrical elements positioned thereon.5. The butt joined opto-electronic assembly as recited in claim 1 wherein the first and second carriers further comprise first and second housings with each housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with the opto-electrical element positioned in the cavity of the first housing and the electrical element positioned in the cavity of the second housing.6. The butt joined opto-electronic assembly as recited in claim 1 wherein the securing member comprises first and second removable attachment members with the first removable attachment member secured to one of the side surfaces of the first and second carriers adjacent to their open end faces and the second removable attachment member secured to the other side surfaces of the first and second carriers adjacent to their open end faces with each removable attachment member having first and second links secured to the respective side surfaces of the first and second carriers with each link having a base and at least a first extension member, two of the extension members projecting past one of the open end faces to overlap the other two extension members, the overlapping extension members being secured together to join the carriers together as a single assembly.7. A butt joined opto-electronic module for millimeter wavelength frequencies comprising:a first housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing and an opto-electrical element positioned in the cavity of the housing having an opto-electrical device formed on at least one horizontal surface of the opto-electrical element and coupled to receive an optical signal from an optical waveguide secured to the first housing;a second housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing and an electrical element positioned in the cavity of the housing having an electrical device formed on at least one horizontal surface of the electrical element;first and second matched coplanar transmission structures with one of the matched coplanar transmission structures formed on at least one horizontal surface of the opto-electrical element and the other matched coplanar transmission structure formed on at least one horizontal surface of the electrical element with each of the first and second matched coplanar transmission structures being electrically coupled to one of the respective opto-electrical and electrical devices, the first and second matched coplanar transmission structures being independently aligned in three mutually perpendicular planes and positioned in a proximate abutting relationship;the first and second housings being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single module by a securing member with the first and second housings being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the first and second matched coplanar transmission structures; andsubstantially flat electrical conductors electrically coupling the first and second matched coplanar transmission structures together.8. The butt joined opto-electronic module as recited in claim 7 wherein the securing member comprises first and second removable attachment members with the first removable attachment member secured to the one of the sidewalls of the first and second housings adjacent to their open end faces and the second removable attachment member secured to the other sidewalls of the first and second housings adjacent to their open end face with each removable attachment member having first and second links secured to the respective sidewalls of the first and second housings with each link having a base and at least a first extension member, two of the extension members projecting past the open end faces to overlap the other two extension members, the overlapping extension members being secured together to join the housings together as a single module.9. A buff joined opto-electronic module for millimeter wavelength frequencies comprising:a first housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing and an opto-electrical element positioned in the cavity of the housing having an opto-electrical device formed on at least one horizontal surface of the opto-electrical element and coupled to receive an optical signal from an optical waveguide secured to the first housing;a second housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing and an electrical element positioned in the cavity of the housing having an electrical device formed on at least one horizontal surface of the electrical element;first and second matched coplanar transmission structures with one of the matched coplanar transmission structures formed on at least one horizontal surface of the opto-electrical element and the other matched coplanar transmission structure formed on at least one horizontal surface of the electrical element with each of the first and second matched coplanar transmission structures being electrically coupled to one of the respective opto-electrical and electrical devices, the first and second matched coplanar transmission structures being independently aligned in three mutually perpendicular planes and positioned in a proximate abutting relationship;first and second removable attachment members with the first removable attachment member secured to the one of the sidewalls of the first and second housings adjacent to their open end faces and the second removable attachment member secured to the other sidewalls of the first and second housings adjacent to their open end faces with each removable attachment member having first and second links secured to the respective sidewalls of the first and second housings with each link having a base and at least a first extension member, two of the extension members projecting past the open end faces to overlap the other two extension members, the overlapping extension members being secured together to join the housings together as a single module;the first and second housings being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single module by the first and second removable attachment members with the first and second housings being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the first and second matched coplanar transmission structures; andsubstantially flat electrical conductors electrically coupling the first and second matched coplanar transmission structures together.10. The butt joined opto-electronic module as recited in claim 7 or 9 wherein first and second matched coplanar transmission structures have sub-millimeter lateral separation.11. The butt joined opto-electronic module as recited in claim 7 or 9 further comprising at least a first mounting dielectric substrate having an end face, with the first mounting dielectric substrate mounted in one of the cavities of the first and second housings and having one of the opto-electrical and electrical elements positioned thereon.12. The butt joined opto-electronic module as recited in claim 11 further comprising at least a second mounting dielectric substrate having an end face, with the second mounting dielectric substrate mounted in the cavity of the other housing and having the other of the opto-electrical and electrical elements positioned thereon.13. The butt joined opto-electronic module as recited in claim 7 or 9 wherein each of the first and second housings further comprise a removable top cover mounted on the end wall and the sidewalls bounding the cavity.14. The butt joined opto-electronic module as recited in claim 7 or 9 further comprising a removable top cover mounted on the end walls and the sidewalls bounding the cavities of the first and second housings.15. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the opto-electrical device comprises an optical-to-electrical converter.16. The butt joined opto-electronic assembly/module as recited in claim 15 wherein the optical-to-electrical converter comprises a photodiode.17. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the opto-electrical device comprises a semiconductor laser.18. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the opto-electrical device comprises an optical modulator.19. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the electrical device comprises at least a first sampling diode.20. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the electrical device comprises a laser driver.21. The butt joined opto-electronic assembly/module as recited in claim 6 or 8 or 9 wherein solder is applied to the overlapping extension members.22. The butt joined opto-electronic assembly/module as recited in claim 6 or 8 or 9 wherein an adhesive is applied to the overlapping extension members.23. The butt joined opto-electronic assembly/module as recited in claim 22 wherein the adhesive is an epoxy.24. The butt joined opto-electronic assembly/module as recited in claim 23 wherein the epoxy is an ultraviolet cured epoxy.25. The butt joined opto-electronic assembly/module as recited in claim 6 or 8 or 9 wherein strong adhesion low melting temperature metal is applied to the overlapping extension members.26. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the substantially flat electrical conductors are wedge bonded electrical conductors.