초록 ▼

A hybrid cooling system for cooling electronic devices includes a heat generating electronic device and an endless metal belt in sliding contact with a surface of the device for removing heat by conduction. The system also includes a fan or jet and an airfoil with and without a movable surface and/o

A hybrid cooling system for cooling electronic devices includes a heat generating electronic device and an endless metal belt in sliding contact with a surface of the device for removing heat by conduction. The system also includes a fan or jet and an airfoil with and without a movable surface and/or flap for simultaneously directing a flow of coolant across the electronic device and/or the endless metal belt. An additional cooling element and cooling fins are also disclosed. Further, a method for cooling such devices is disclosed.

대표청구항 ▼

1. A cooling system for cooling an integrated circuit chip comprising a heat generating chip having a heat emanating surface, conduction means including an endless heat absorbing belt having a first surface with a surface area larger than the heat emanating surface in sliding contact with said heat

1. A cooling system for cooling an integrated circuit chip comprising a heat generating chip having a heat emanating surface, conduction means including an endless heat absorbing belt having a first surface with a surface area larger than the heat emanating surface in sliding contact with said heat emanating surface and means for moving said surface of said endless belt across said heat emanating surface in sliding contact therewith, a fan for simultaneously moving a flow of air across said endless belt and a negatively cambered airfoil disposed in the flow of air for increasing the speed of air flowing across said endless belt and for altering the air pressure distribution on said endless belt and in which said negatively cambered airfoil includes a moving skin of heat absorbing and heat dissipating material.2. A cooling system for cooling an integrated circuit chip in accordance with claim 1 in which said heat absorbing and heat dissipating material is a metal.3. A hybrid cooling system for a heat generating electronic device having an outer surface, said system comprising:a heat transfer element in the form of an endless belt having a first surface with a surface area larger than the outer surface of the electronic device and with a portion of said first surface in sliding contact with an outer surface of the electronic device;means for moving said heat transfer element relative to the outer surface of the electronic device to bring different portions of the firs surface of the heat transfer element in sliding contact with the electronic device to thereby remove heat from the electronic device;an airfoil having a leading edge and a trailing edge, a first surface remote from the electronic device and a second convex surface opposite from the electronic device and separated therefrom by a portion of said heat transfer element and a predetermined space; andmeans for forcing a unidirectional flow of a gaseous cooling medium toward said leading edge and between said convex surface and said heat transfer device to define a convergent-divergent duct shape to increase the flow speed and alter the pressure distribution on the heat transfer element, and in which said airfoil includes a movable skin of heat absorbing/heat dissipating material.4. A hybrid cooling system for a heat generating electronic device having an outer surface according to claim 3 which includes a coolant and wherein said endless belt passes through said coolant.5. A hybrid cooling system for a heat generating electronic device according to claim 4 which includes a C-shaped channel guide for positioning said endless belt with respect to said heat emanating surface.6. A method for cooling an integrated circuit chip comprising the steps of:a) providing a heat generating integrated circuit chip having a heat emanating surface;b) provides an endless belt of a heat absorbing material;c) bringing a portion of the endless belt in sliding contact with a surface of an integrated circuit chip;d) moving the endless belt in sliding contact with the surface of the integrated circuit chip across the integrated circuit chip to thereby remove heat from the chip;e) providing a negatively cambered airfoil having a leading edge, a trailing edge and a convex surface opposite from the endless belt and separated therefrom by a predetermined space;f) moving a mass of unidirectional gaseous coolant between the airfoil and the endless belt to thereby remove heat from the endless belt; and,g) providing the airfoil with a movable heat absorbing/heat dissipating skin and moving the movable skin around the airfoil to dissipate heat therefrom.7. A method for cooling an integrated circuit chip according to claim 6 which includes the step of proving a coolant and passing the endless belt through the coolant.8. A hybrid cooling system for a heat generating electronic device according to claim 6 in which said airfoil includes cooling fins.9. A hybrid cooling system for a heat generating electronic device according to claim 6 in which said airfoil includes a movable flap for producing more favorable velocity, pressure and/or temperature profiles.10. A method for cooling an integrated circuit chip comprising the steps of:a) providing a heat generating integrated circuit chip having a heat emanating surface;b) providing an endless belt of heat absorbing and heat dissipating material with a surface area larger than the surface area of the heat emanating surface;c) bringing the surface area of the endless belt into sliding contact with the heat emanating surface and moving the surface of the endless belt in sliding contact across the heat emanating surface to thereby remove heat from the integrated circuit chip by conductance;d) simultaneously directing a flow of air across the endless belt to thereby remove heat therefrom by convection;e) altering the speed of the airflow across the endless belt and varying the pressure on the belt by providing a negatively cambered airfoil and disposing the airfoil in the airflow above the integrated circuit chip; andf) providing the airfoil with a heat absorbing/heat dissipating skin and moving the skin to thereby dissipate heat from the integrated circuit chip.