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특허 상세정보

Wafer-level hermetic micro-device packages

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/44   
미국특허분류(USC) 438/107; 438/116
출원번호 US-0713475 (2003-11-14)
발명자 / 주소
대리인 / 주소
    Howson &
인용정보 피인용 횟수 : 21  인용 특허 : 19
초록

A method for manufacturing a hermetically sealed micro-device package encapsulating a micro-device. The package includes a transparent window allowing light to pass into and out of a cavity containing the micro-device. A first frame-attachment area is prepared on semiconductor substrate having a micro-device operably disposed thereupon, the first frame-attachment area having a plan that circumscribes the micro-device. A second frame-attachment area is prepared on a sheet of transparent material, the second frame-attachment area having a plan that circums...

대표
청구항

1. A method for manufacturing a hermetically sealed micro-device package encapsulating a micro-device and including a transparent window allowing light to pass into and out of a cavity containing the micro-device, the method comprising the following steps:preparing, on a semiconductor substrate having a micro-device operably disposed thereupon, a first frame-attachment area having a plan that circumscribes the micro-device; preparing, on a sheet of transparent material, a second frame-attachment area having a plan that circumscribes a window aperture por...

이 특허에 인용된 특허 (19)

  1. Tatoh Nobuyoshi,JPX. Air-tightly sealed container for photosemiconductor, and photosemiconductor module. USP1999085945721.
  2. Kim, Tae Jun; Song, Yoo Sun. Chip on board package for optical mice and lens cover for the same. USP2003116653724.
  3. Halvorson ; Jr. Harold ; Juhlin Gary S. ; Lewis David M. ; Davies James H.,CAX ; Benoit Richard A. ; Luchetti Robert J. ; Greenberg Peter C.. Clear wall panel system. USP2000116141925.
  4. Kock Hendrikus G. (Eindhoven NLX). Coupler comprising a light source and lens. USP1982104355323.
  5. Hauser, Christian; Winderl, Johann; Pohl, Jens. Device for packaging electronic components. USP2003026521988.
  6. Thomas, Sunil. Flip-chip assembly of protected micromechanical devices. USP2003126656768.
  7. Alkhimov Anatoly P. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Papyrin Anatoly N. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Kosarev Vladimir F. (Novosibirsk SUX) Nesterovich Nikolai I. (No. Gas-dynamic spraying method for applying a coating. USP1994045302414.
  8. Martin, John R.; Harney, Kieran H.. Hermetic seals for large optical packages and the like. USP2003106639313.
  9. Stark, David H.. Hermetically sealed micro-device package with window. USP2003096627814.
  10. Lamberts, Christoph. Holding rail for holding glass profile elements. USP2003126668500.
  11. Van Steenkiste Thomas H. ; Smith John R. ; Teets Richard E. ; Moleski Jerome J. ; Gorkiewicz Daniel W.. Kinetic spray coating method and apparatus. USP2000106139913.
  12. Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX. Mass reflowable windowed package. USP2001026191359.
  13. Yang Thomas (Hsin-Chu TWX). Method for manufacturing a hybrid circuit charge-coupled device image sensor. USP1995065423119.
  14. Glenn Thomas P.. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device. USP1999095949655.
  15. Tower Steven A. ; Mravic Brian. Optical component package with a hermetic seal. USP2000026020628.
  16. Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.. Packaging of electro-microfluidic devices. USP2003046548895.
  17. Baret, Guy. Process for the manufacture of components on glass substrates that have to be sealed, such as flat display screens of the plasma-panel type. USP2003036537121.
  18. Mehra Madhav (Rochester NY) Jackson Todd (Pittsford NY). Static control overlayers on opto-electronic devices. USP1992065118924.
  19. Berger, Jr., Allen. Window assembly for opening closures. USP2004076763638.

이 특허를 인용한 특허 피인용횟수: 21

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Mignard, Marc Maurice; Khazeni, Kasra. Dielectric enhanced mirror for IMOD display. USP2015069057872.
  3. Okandan, Murat; Nielson, Gregory N.. Dynamically reconfigurable photovoltaic system. USP2016129531322.
  4. Stark, David H.; Honor, Patrick Michael. Edge seal assemblies for hermetic insulating glass units and vacuum insulating glass units. USP2017019546513.
  5. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  6. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  7. Wood, Alan G.; Kirby, Kyle K.; Farnworth, Warren M.; Akram, Salman. Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages. USP2010017645635.
  8. Wood, Alan G.; Kirby, Kyle K.; Farnworth, Warren M.; Akram, Salman. Image sensor packages and frame structure thereof. USP2010097791184.
  9. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP20181110119327.
  10. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  11. Yang, Xiao; Chen, Dongmin. Method and system for hermetically sealing packages for optics. USP2012108288851.
  12. Lin,Cheng Chun. Method for packaging a liquid crystal panel. USP2007107289186.
  13. Crockett, Mark; Lane, John W.; Kirchhoff, Vincent; Josephson, Marcel E.; Gao, Hong P.; Manjunath, Bhaswan. Method of diffusion bonding a fluid flow apparatus. USP2010097798388.
  14. Hong,Suk Kee; Lee,Yeong Gyu; Park,Heung Woo. Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same. USP2006077078804.
  15. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and gas-restrictive coating layer. USP2017019540863.
  16. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  17. Zhu, Lijun; Shah, Jignesh H.; Hu, Hairo; Ding, Yaogeng; Vanniasinkam, Joseph. Optical multiplexer and transmitter. USP2010027661889.
  18. Liu, Chien-Hung. Photosensitizing chip package and manufacturing method thereof. USP2011128076744.
  19. Paulson, Hans; Husom, Vidar A.; Goujon, Nicolas. Sensor assembly. USP2015089103930.
  20. Yang, Xiao; Chen, Dongmin. System for hermetically sealing packages for optics. USP2011098022520.
  21. Sunwoo,Kook Hyun; Kwon,Jong Oh; Lee,Joo Ho. Wafer level package fabrication method using laser illumination. USP2007077241966.