[특허]Electronic device packaging

[미국특허] Electronic device packaging 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/02
출원번호	US-0075706 (2002-02-13)
발명자 / 주소	Featherby, Michael DeHaven, Jennifer L.
출원인 / 주소	Sony Corporation Sony Electronics, Inc.
대리인 / 주소	Redwood Patent Law
인용정보	피인용 횟수 : 10 인용 특허 : 70

초록 ▼

A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.

대표청구항 ▼

1. A hermeticseal for an electronic circuit die comprising:an inorganic layer for preventing moisture from reaching the electronic circuit die; an organic layer outside the inorganic layer for protecting the inorganic layer; and a plastic package. 2. The apparatus of claim 1 wherein the inorganic layer is outside the plastic package.3. The apparatus of claim 2 wherein the inorganic layer is inside the plastic package.4. A hermetic seal for an electronic circuit die comprising:an inorganic layer for preventing moisture from reaching the electronic circuit die; an organic layer outside the inorganic layer for protecting the inorganic layer; a lead; and a wire; wherein the inorganic layer contacts the lead. 5. A hermetic seal for an electronic circuit die comprising:an inorganic layer for preventing moisture from reaching the electronic circuit die; and an organic layer outside the inorganic layer for protecting the inorganic layer, the organic layer comprising a material consisting of para-xylyene, hybrid solgel, and polymeric materials. 6. A hermetically sealed device comprising:an electronic circuit die; an inorganic layer outside the electronic circuit die; an organic layer outside the inorganic material; a wire; and a lead; wherein the inorganic layer contacts the lead. 7. A hermetically sealed device comprising:an electronic circuit die; an inorganic layer outside the electronic circuit die; and an organic layer outside the inorganic material, the organic layer comprising a material consisting of para-xylyene, hybrid solgel, and polymeric materials. 8. A hermetically sealed device comprising:an electronic circuit die; an inorganic layer outside the electronic circuit die; an organic layer outside the inorganic material; a wire; a lead; and a plastic package. 9. The hermetically sealed device of claim 8 wherein the plastic package contacts the inorganic layer.10. The hermetically sealed device of claim 8 wherein the plastic package contacts the organic layer.

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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
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[미국특허] Electronic device packaging 원문보기

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[미국특허] Electronic device packaging 원문보기

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