초록 ▼

A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and pow

A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.

대표청구항 ▼

1. A bi-level heat sink comprising:a first base portion having a first side and a second side, said first side defining at least one open channel for receiving a portion of at least one heat pipe;a second base portion having a first side and a second side, said first side of said second base portion

1. A bi-level heat sink comprising:a first base portion having a first side and a second side, said first side defining at least one open channel for receiving a portion of at least one heat pipe;a second base portion having a first side and a second side, said first side of said second base portion defining at least one open channel corresponding to said at least one open channel in said first base portion for receiving a corresponding portion of said at least one heat pipe;an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said at least one heat pipes; andat least one fin structure positioned upon said second sides of said first base portion and said second base portion.2. An assembly formed with the bi-level heat sink according to claim 1 wherein said first side of said first base portion thermally engages a processor and said first side of said second base portion thermally engages a heat generating component.3. An assembly formed with the bi-level heat sink according to claim 1 wherein said first side of said first base portion thermally engages a heat generating component and said first side of said second base portion thermally engages a processor.4. A bi-level heat sink comprising:a first base portion having a first side and a second side, said first side defining an open channel for receiving a portion of at least one heat pipe;a second base portion having a first side and a second side, said first side of said second base defining an open channel corresponding to said open channel in said first base portion and each receiving a corresponding portion of said at least one heat pipe;an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said at least one heat pipes; andat least one fin structure positioned upon said second sides of said first base portion and said second base portion.5. A heat sink comprising:a first base portion having a first side and a second side, said first side defining an open channel for receiving a portion of two heat pipes;a second base portion having a first side and a second side, said first side of said second base defining an open channel corresponding to said open channel in said first base portion and each receiving a corresponding portion of said two heat pipes;an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said two heat pipes; andat least one fin structure positioned upon said second side of said first base portion and said second base portion.6. A bi-level heat sink comprising:a first base portion having a first side and a second side, said first side defining an open channel for receiving a portion of two heat pipes;a second base portion having a first side and a second side, said first side of said second base defining an open channel corresponding to said open channel in said first base portion and each receiving a corresponding portion of said two heat pipes;an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said two heat pipes; anda fin structure located on said second side of each of said first base portion and said second base portion.7. An assembly comprising:a processor having a first height;a component adjacent to said processor, said component being a heat source and having a second height;a bi-level heat sink positioned in thermal engagement with said processor and said heat generating component, and including:a first base portion having a first side and a second side, said first side defining an open channel for receiving a portion of two heat pipes;a second base portion having a first side and a second side, said first side of said second base defining an open channel corresponding to said open channel in said first base portion and each receiving a corresponding portion of said two heat pipes;an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said two heat pipes; anda fin structure located on said second side of each of said first base portion and said second base portion.8. An assembly according to claim 7 wherein said first side of said first base portion thermally engages said processor and said first side of said second base portion thermally engages said heat generating component.9. An assembly according to claim 7 wherein said first side of said first base portion thermally engages said heat generating component and said first side of said second base portion thermally engages said processor.