[특허]Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages

[미국특허] Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/02
출원번호	US-0632550 (2003-08-02)
발명자 / 주소	Karnezos, Marcos
출원인 / 주소	ChipPAC, Inc.
대리인 / 주소	Haynes Beffel &
인용정보	피인용 횟수 : 77 인용 특허 : 32

초록 ▼

A semiconductor multi-package module having stacked first and second packages, each package including a die attached to a substrate, in which the first and second substrates are interconnected by wire bonding, and wherein at least one said package comprises a stacked die package. Also, a method for making a semiconductor multi-package module, by providing a stacked die molded first package including a first package substrate, affixing a second molded package including a second substrate onto an upper surface of the first package, and forming z-interconnects between the first and second substrates.

대표청구항 ▼

1. A multi-package module comprising stacked lower and upper packages, the lower package including a die attached to and electrically connected to a lower substrate and the upper package including a die attached to and electrically connected to an upper substrate, wherein the upper and lower substrates are interconnected by wire bonding, wherein at least one said package comprises a stacked die package, and wherein at least one said stacked die package is encapsulated.2. The multi-package module of claim 1 wherein the lower package comprises a stacked die package.3. The multi-package module of claim 1 wherein each of the lower package and the upper package comprises a stacked die package.4. The multi-package module of claim 1 wherein the upper package comprises a stacked die package.5. The multi-package module of claim 1 wherein adjacent stacked die in the stacked die package are separated by a spacer.6. The multi-package module of claim 1, further comprising a heat spreader over the upper package.7. A method for making a multi-package module, comprisingproviding a first package, providing a second package, each said package comprising a die attached to and electrically interconnected to a substrate, at least one of said first package and said second package comprising a stacked die package, wherein at least one said stacked die package is encapsulated, stacking the second package over the first package, and forming electrical interconnects between the first package and the second package by wire bonding. 8. The method of claim 7 wherein providing said package comprising a stacked die package comprising testing stacked die packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said stacked die package.9. The method of claim 7 wherein providing a second package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said second package.10. The method of claim 7 wherein providing said package comprising a stacked die package comprises providing an unsingulated strip of stacked die packages.11. The method of claim 7 wherein providing said package comprising a stacked die package comprises providing a package comprising a first die affixed to a package substrate, a second die affixed over the first die, and wire bond interconnects between said first and second die and said substrate.12. The method of claim 11 wherein providing said package comprising a stacked die package comprises providing a package further comprising a spacer interposed between said first and said second die.13. The method of claim 7, further comprising providing a heat spreader.14. The method of claim 7, further comprising attaching second-level interconnect balls onto the first package substrate.15. The method of claim 7, further comprising encapsulating the stacked packages on the module in a molding compound.16. A mobile device comprising the multi-package module of claim 1.17. A computer comprising the multi-package module of claim 1.

이 특허에 인용된 특허 (32) 인용/피인용 타임라인 분석

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[미국특허] Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 원문보기

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[미국특허] Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 원문보기

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