초록 ▼

An optical semiconductor product includes an integrated circuit chip having an optical sensor in its front face. The chip is attached to a support plate and electrical interconnection is made therebetween. A protective ring is fastened to the front face of the chip, around and at some distance from

An optical semiconductor product includes an integrated circuit chip having an optical sensor in its front face. The chip is attached to a support plate and electrical interconnection is made therebetween. A protective ring is fastened to the front face of the chip, around and at some distance from the optical sensor. A ring of encapsulating material is deposited to surround the periphery of the chip and lie between the front face of the support plate (2) and the protective ring.

대표청구항 ▼

1. An optical semiconductor device comprising:an integrated circuit chip having an optical sensor in its front face;a support plate to one front face of which is fastened a rear face of the integrated circuit chip;means for electrically connecting the integrated circuit chip to the support plate;a s

1. An optical semiconductor device comprising:an integrated circuit chip having an optical sensor in its front face;a support plate to one front face of which is fastened a rear face of the integrated circuit chip;means for electrically connecting the integrated circuit chip to the support plate;a surrounding protector fastened to the front face of the integrated circuit chip around and at some distance from the optical sensor; andan encapsulation ring made of an encapsulation material surrounding the periphery of the chip and lying between the front face of the support plate and the surrounding protector; andan auxiliary ring fastened to the front face of the support plate, at some distance from the periphery of the chip, the encapsulation ring filling between the surrounding protector and the auxiliary ring.2. The device according to claim 1, wherein the electrical connection means comprises linking wires connected, on the one hand, to electrical connection pads produced on the front face of the chip, outside the surrounding protector and, on the other hand, to electrical connection pads of the front face of the support plate, these wires being embedded in the encapsulation ring.3. The device according to claim 1, further including:an annular lens holder associated with the surrounding protector.4. The device according to claim 3, wherein the annular lens holder includes a window placed in front of the front face of the chip aligned with the optical sensor.5. The device according to claim 4, wherein the window is carried by an annular window holder associated with the surrounding protector.