[특허]Method and system for compensating thermally induced motion of probe cards

[미국특허] Method and system for compensating thermally induced motion of probe cards 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-031/00
출원번호	US-0159560 (2002-05-31)
발명자 / 주소	Martens, Rod Eldridge, Benjamin N. Grube, Gary W. Matsubayashi, Ken S. Larder, Richard A. Shinde, Makarand Mathieu, Gaetan L.
출원인 / 주소	FormFactor, Inc.
인용정보	피인용 횟수 : 19 인용 특허 : 14

초록 ▼

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

대표청구항 ▼

1. In combination:a probe card for testing die on a wafer; a shape memory alloy element connected to said probe card; wherein said shape memory alloy utilizes thermal energy to deflect a portion of said probe card to control the geometric shape of said probe card. 2. The combination of claim 1 wherein said shape memory alloy element is located at least partially generally along a surface of said probe card.3. The combination of claim 1 wherein said shape memory alloy element comprises and alloy of nickel and titanium.4. The combination of claim 1 and further including at least one strain sensor located near said shape memory alloy element for monitoring strain corresponding to deflection of said probe card.5. The combination of claim 1 comprising at least a first shape memory element and a second shape memory element oriented generally perpendicular to said first shape memory element.6. The combination of claim 1 wherein said shape memory alloy includes at least a first shape memory element and a second shape memory element located generally on opposite top and bottom surfaces of said probe card.7. The combination of claim 6 comprising at least a first shape memory element and a second shape memory element oriented generally perpendicular to said first shape memory element.8. In combination:a probe card for testing a die on a wafer; and, at least one strain sensor on said probe card for monitoring strain corresponding to deflection of said probe card, and further comprising a first shape memory alloy element on said probe card heatable in response to output from said strain sensor. 9. The combination of claim 8 and further including at least one strain sensor located near and oriented generally parallel to said first shape memory alloy element for monitoring strain corresponding to deflection of said probe card.10. The combination of claim 8 wherein said strain sensor is oriented generally radially outward from a center portion of said probe card.11. The combination of claim 8 wherein said strain sensor is oriented generally parallel with a peripheral edge of said probe card.12. The combination of claim 8 comprising at least a first shape memory element and a second shape memory element oriented generally perpendicular to said first shape memory element.13. The combination of claim 12 comprising at least a first shape memory element and a second shape memory element located generally on opposite top and bottom surfaces of said probe card.14. The combination of claim 8 comprising a shape memory alloy element including at least a first shape memory element and a second shape memory element located generally on opposite top and bottom surfaces of said probe card and utilizing thermal energy in response to strain sensor output to deflect a portion of said probe card to control the geometric shape of said probe card.

이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

Bialobrodski Marian R. ; Lupan Marius R., Automatic probe card planarization system.
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Kister January, High temperature probe card for testing integrated circuits.
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Cadieux Robert R. ; Correia George C. ; Hill Gary R. ; Ingraham Anthonty P., Method and apparatus for testing integrated circuit chips.
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Nelson Randall D. (Sun Lakes AZ) Westbrook Gregory L. (Chandler AZ), Method and means for controlling movement of a chuck in a test apparatus.
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Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
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Miyazaki Tsutomu (Ooita JPX) Tozawa Shin (Ooita JPX) Etoh Hisahiko (Ooita JPX), Method of testing semiconductor devices using a probe card.
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Sano Kunio (Yamanashi-ken JPX), Probe apparatus.
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Carlin Scott J. (Austin TX) Roberts ; Jr. Samuel (Austin TX), Probe card apparatus having a heating element and process for using the same.
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Kimura Hidetoshi (Nirasaki JPX) Utsunomiya Tetsuya (Kofu JPX) Mochizuki Chiaki (Yamanashi JPX), Probe card assembly and method of manufacturing probe card assembly.
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Geldermans Pieter (Poughkeepsie NY), Probe device having probe heads and method of adjusting distances between probe heads.
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Kuji Motohiro (Yamanashi-ken JPX) Yoshioka Haruhiko (Yamanashi-ken JPX) Akaike Shinji (Kofu JPX) Takahashi Shigeaki (Yamanashi-ken JPX), Probe system and probe method.
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Iino Shinji,JPX ; Yoshioka Haruhiko,JPX, Prober and probe method.
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Ideta Yasushi,JPX ; Washitani Akihiro,JPX ; Umetsu Tsunenori,JPX ; Kaneko Keiko,JPX ; Kobayashi Kunio,JPX, Semiconductor device socket.
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Sato Mitsuya (Yokohama JPX), Wafer prober and a probe card to be used therewith.
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이 특허를 인용한 특허 (19) 인용/피인용 타임라인 분석

Eldridge, Benjamin N.; Hobbs, Eric D.; Mathieu, Gaetan L.; Shinde, Makarand S.; Slocum, Alexander H., Apparatus and method for adjusting an orientation of probes.
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McFarland, Andrew W.; Yasumura, Kevin Youl; Hobbs, Eric D.; Breinlinger, Keith J., Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies.
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Eldridge, Benjamin N.; Grube, Gary W.; Hobbs, Eric D.; Mathieu, Gaetan L.; Shinde, Makarand S.; Slocum, Alexander H.; Sporck, A. Nicholas; Watson, Thomas N., Apparatus and method for managing thermally induced motion of a probe card assembly.
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Eldridge,Benjamin N.; Grube,Gary W.; Hobbs,Eric D.; Mathieu,Gaetan L.; Shinde,Makarand S.; Slocum,Alexander H.; Sporck,A. Nicholas; Watson,Thomas N., Apparatus and method for managing thermally induced motion of a probe card assembly.
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Hobbs, Eric D.; Kawamata, Nobuhiro; McFarland, Andrew W.; Reynolds, Carl V.; Urakawa, Yoichi, Apparatus for testing devices.
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Parrish,Frank B.; Behziz,Arash, Automatic testing equipment instrument card and probe cabling system and apparatus.
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Yasumura, Kevin Y.; Blomgren, Timothy; Chang, Jacob C.; Huebner, Michael W., Increasing thermal isolation of a probe card assembly.
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Breinlinger, Keith J.; Hobbs, Eric D., Mechanical decoupling of a probe card assembly to improve thermal response.
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Hobbs, Eric D.; Mathieu, Gaetan L.; Zalar, Frank M., Method and apparatus for multilayer support substrate.
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Eldridge, Benjamin N.; Grube, Gary W.; Matsubayashi, Ken S.; Larder, Richard A.; Shinde, Makarand S.; Mathieu, Gaetan L., Method and system for compensating thermally induced motion of probe cards.
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Eldridge,Benjamin N.; Grube,Gary W.; Matsubayashi,Ken S.; Larder,Richard A.; Shinde,Makarand S.; Mathieu,Gaetan L., Method and system for compensating thermally induced motion of probe cards.
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Martens, Rod; Eldridge, Benjamin N.; Grube, Gary W.; Matsubayashi, Ken S.; Larder, Richard A.; Shinde, Makarand S.; Mathieu, Gaetan L., Method and system for compensating thermally induced motion of probe cards.
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Martens,Rod; Eldridge,Benjamin N.; Grube,Gary W.; Matsubayashi,Ken S.; Larder,Richard A.; Shinde,Makarand; Mathieu,Gaetan L., Method and system for compensating thermally induced motion of probe cards.
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Mathieu,Gaetan L.; Khandros,Igor Y.; Reynolds,Carl V., Methods for making plated through holes usable as interconnection wire or probe attachments.
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Parrish, Frank B.; Brecht, Brian; Castellano, Derek, Modularized device interface with grounding insert between two strips.
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Sasaki, Shunsuke; Nakayama, Hiroshi, Probe card for semiconductor wafer.
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Hobbs, Eric D.; McFarland, Andrew W., Stiffener assembly for use with testing devices.
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Hobbs, Eric D.; McFarland, Andrew W., Stiffener assembly for use with testing devices.
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Hobbs, Eric D., Thermocentric alignment of elements on parts of an apparatus.
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연합인증

[미국특허] Method and system for compensating thermally induced motion of probe cards 원문보기

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이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (19) 인용/피인용 타임라인 분석

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[미국특허] Method and system for compensating thermally induced motion of probe cards 원문보기

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이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (19) 인용/피인용 타임라인 분석

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