초록 ▼

A MEMS module is provided comprising at least one MEMS device adhesively bonded to a substrate or wafer, such as a CMOS die, carrying pre-processed electronic circuitry. The at least one MEMS device, which may comprise a sensor or an actuator, may thus be integrated with related control, readout/sig

A MEMS module is provided comprising at least one MEMS device adhesively bonded to a substrate or wafer, such as a CMOS die, carrying pre-processed electronic circuitry. The at least one MEMS device, which may comprise a sensor or an actuator, may thus be integrated with related control, readout/signal conditioning, and/or signal processing circuitry.An example of a method pursuant to the invention comprises the adhesive bonding of a pre-processed electronics substrate or wafer to a layered structure preferably in the form of a silicon-on-insulator (SOI) substrate. The SOI is then bulk micromachined to selectively remove portions thereof to define the MEMS device. Prior to release of the MEMS device, the device and the associated electronic circuitry are electrically interconnected, for example, by wire bonds or metallized vias.

대표청구항 ▼

1. A MEMS module comprising:at least one MEMS device including a movable element;a substrate having a surface carrying electronic circuitry, the at least one MEMS device overlying at least a portion of the electronic circuitry;an organic adhesive bond joining the at least one MEMS device and the cir

1. A MEMS module comprising:at least one MEMS device including a movable element;a substrate having a surface carrying electronic circuitry, the at least one MEMS device overlying at least a portion of the electronic circuitry;an organic adhesive bond joining the at least one MEMS device and the circuitry-carrying surface of the substrate; andelectrical conductors connecting the at least one MEMS device with the electronic circuitry.2. The module of claim 1 in which:the substrate includes an extension carrying electrical contacts connected to the electronic circuitry, the contacts being adapted to connect the module to a higher assembly.3. The module of claim 1 in which:the electrical conductors connecting the at least one MEMS device with the electronic circuitry comprises wire bonds.4. The module of claim 1 in which:the electrical conductors connecting the at least one MEMS device with the electronic circuitry comprises plated-through vias.5. The module of claim 1 in which:the electronic circuitry-carrying substrate comprises a CMOS die.6. The module of claim 1 in which:the module comprises a plurality of MEMS devices; andthe electronic circuitry-carrying substrate comprises a CMOS wafer, the electronic circuitry comprising a plurality of electronic circuits.7. The module of claim 1 in which:the at least one MEMS device is formed on an SOI substrate.8. The module of claim 1 in which:the at least one MEMS device comprised at least one MEMS sensor and/or at least one MEMS actuator.9. The module of claim 1 in which:the at least one MEMS device is selected from the group consisting of an electrical switch, an electromechanical motor, an accelerometer, a capacitor, a pressure transducer, an electrical current sensor, a gyro and a magnetic sensor.10. The module of claim 1 in which:the organic adhesive bond comprises an epoxy.11. The module of claim 1 in which:the organic adhesive bond is selected from the group consisting of epoxy, polyimide, silicone, acrylic, polyurethane, polybenzimidazole, polyquinoraline and benzocyclobutene.12. The module of claim 1 further comprising:a cover enclosing the MEMS device.13. The module of claim 1 in which:the at least one MEMS device overlies the entire area occupied by the electronic circuitry.