초록 ▼

When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of th

When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of the circuit board and the bumps. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together.

대표청구항 ▼

What is claimed is: 1. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board o

What is claimed is: 1. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; and said hardening, said leveling and said correcting being achieved at approximately the same time, wherein said thermosetting resin includes conductive particles. 2. The method as claimed in claim 1, wherein said particles comprise nickel particles plated with gold. 3. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; and said hardening, said leveling and said correcting being achieved at approximately the same time, wherein, prior to said aligning, said thermosetting resin, in the form of a solid thermosetting resin sheet having a shape dimension smaller than an outside dimension of connection between said electrodes of said electronic component, is applied to said circuit board, and said hardening with heat comprises applying said heat to said sheet, and wherein prior to said aligning, conductive adhesive is applied to said bumps. 4. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; and said hardening, said leveling and said correcting being achieved at approximately the same time, wherein, prior to said aligning, said thermosetting resin, in the form of a solid thermosetting resin sheet having holes formed at positions corresponding either to said bumps or to said electrodes of said circuit board and extending in a direction of extension of said bumps, with particles being embedded and electrically continuous in said holes, said particles comprising resin balls having surfaces plated with gold, nickel particles, conductive particles made of silver, silver-palladium or gold, conductive paste, or gold balls, is applied to said electrodes of said circuit board by positional alignment, and said bonding is executed by said hardening said sheet by application of heat thereto while conducting said pressing by forcing said electronic component toward said circuit board. 5. A method of mounting an electronic component, said method comprising: aligning in position electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board during correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; wherein, prior to said aligning, said thermosetting resin, in the form of a solid thermosetting resin sheet having holes formed at positions corresponding to said electrodes of said circuit board and extending in a direction of extension of said electrodes, with particles being embedded and electrically continuous in said holes, said particles comprising resin balls having surfaces plated with gold, nickel particles, conductive particles made of silver, silver-palladium or gold, conductive paste, or gold balls, is applied to said electrodes of said circuit board by positional alignment, and said bonding is executed by said hardening said sheet by application of heat thereto while conducting said pressing by forcing said electronic component toward said circuit board; and wherein each of said particles has a size greater than a thickness of a passivation film to be coated on at least said electrodes of said electronic component and smaller than a thickness of one of said electrodes of said circuit board, and said bonding further is executed by applying ultrasonic vibrations to said electronic component. 6. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; said hardening, said leveling and said correcting being achieved at approximately the same time; and applying conductive paste to said bumps, hardening said conductive paste to function as part of said bumps, and, during said bonding, forcing the thus hardened conductive paste through said thermosetting resin and forming electrical connections between said hardened conductive paste and said electrodes of said circuit board. 7. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; and said hardening, said leveling and said correcting being achieved at approximately the same time, wherein said thermosetting resin comprises a thermosetting resin sheet having an anisotropic conductive film, and wherein said conductive film includes conductive nickel particles plated with gold. 8. The method according to claim 5, further comprising correcting any warping of said electronic component and leveling said bumps at approximately the same time as hardening said thermosetting resin and correcting any warping of said circuit board. 9. The method according to claim 5, wherein hardening said thermosetting resin comprises applying heat of from 140째 C. to 230째 C. for from about several seconds to twenty seconds. 10. The method according to claim 5, wherein said circuit board is selected from the group consisting of a multilayer ceramic board, a glass cloth base epoxy copper clad laminate board, an aramid unwoven fabric board, a glass cloth base polymide resin copper clad laminate board, and flexible printed circuit board. 11. The method according to claim 5, wherein hardening with heat said thermosetting resin while achieving the mutual pressing between said electronic component and said circuit board, during correcting of any warping of said circuit board, results in softening of said thermosetting resin. 12. The method according to claim 5, wherein aligning in position electrodes of said electronic component with electrodes of a circuit board comprises aligning said electrodes of said electronic component with said electrodes on said circuit board while holding said electronic component with a heated bonding tool, softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board comprises transferring heat from said heated bonding tool to said thermosetting resin, and achieving mutual pressing between said electronic component and said circuit board comprises using said heated bonding tool to force said electronic component against said thermosetting resin. 13. A method of mounting an electronic component, said method comprising: aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin; softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof; and said hardening, said leveling and said correcting being achieved at approximately the same time, wherein said solid thermosetting resin includes an inorganic filler. 14. The method according to claim 5, wherein said solid thermosetting resin includes an inorganic filler. 15. The method according to claim 5, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 16. The method according to claim 15, further comprising correcting any warping of said electronic component and leveling said bumps at approximately the same time as hardening said thermosetting resin and correcting any warping of said circuit board. 17. The method according to claim 15, wherein hardening said thermosetting resin comprises applying heat of from 140째 C. to 230째 C. for from about several seconds to twenty seconds. 18. The method according to claim 15, wherein said circuit board is selected from the group consisting of a multilayer ceramic board, a glass cloth base epoxy copper clad laminate board, an aramid unwoven fabric board, a glass cloth base polymide resin copper clad laminate board, and flexible printed circuit board. 19. The method according to claim 15, wherein hardening with heat said thermosetting resin while achieving the mutual pressing between said electronic component and said circuit board, during correcting of any warping of said circuit board, results in softening of said thermosetting resin. 20. The method according to claim 15, wherein aligning in position electrodes of said electronic component with electrodes of a circuit board comprises aligning said electrodes of said electronic component with said electrodes on said circuit board while holding said electronic component with said heated bonding tool, softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board comprises transferring heat from said heated bonding tool to said thermosetting resin, and achieving mutual pressing between said electronic component and said circuit board comprises using said heated bonding tool to force said electronic component against said thermosetting resin. 21. The method according to claim 15, wherein said solid thermosetting resin includes an inorganic filler. 22. The method according to claim 1, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 23. The method according to claim 2, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 24. The method according to claim 3, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 25. The method according to claim 4, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 26. The method according to claim 6, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 27. The method according to claim 7, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing. 28. The method according to claim 13, wherein softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin, while achieving mutual pressing between said electronic component and said circuit board, comprises using a heated bonding tool to perform the mutual pressing.