IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0366991
(2003-02-14)
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발명자
/ 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
Blakely, Sokoloff, Taylor &
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인용정보 |
피인용 횟수 :
5 인용 특허 :
5 |
초록
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In one embodiment, the invention provides an enclosure for a mobile computing system. The enclosure comprises a hollow body shaped and dimensioned to house a processing module, and a display module for a tablet personal computer, wherein the hollow body is defined by a top panel, a bottom panel, and
In one embodiment, the invention provides an enclosure for a mobile computing system. The enclosure comprises a hollow body shaped and dimensioned to house a processing module, and a display module for a tablet personal computer, wherein the hollow body is defined by a top panel, a bottom panel, and a peripheral side panel, wherein the top and bottom panels are fabricated to have zones of increased, and reduced thicknesses which correspond to areas of the processing module have produced, and greater height, respectively.
대표청구항
▼
What is claimed is: 1. A method for fabricating an enclosure for a mobile computing system, the method comprising: determining a height by which electronic components of an electronic assembly fabricated on a substrate stand proud of the substrate; and fabricating an enclosure to house the substrat
What is claimed is: 1. A method for fabricating an enclosure for a mobile computing system, the method comprising: determining a height by which electronic components of an electronic assembly fabricated on a substrate stand proud of the substrate; and fabricating an enclosure to house the substrate with minimum clearance, the enclosure comprising a top panel, a bottom panel, and peripheral side panels interconnecting the top and bottom panels, wherein at least one of the top and bottom panels comprises a zone of reduced thickness that coincides with a portion of the electronic assembly of increased height, a zone of greater thickness that coincides with a portion of the electronic assembly of reduced height, and a strengthening beam, wherein at least one of the top and bottom panels further comprises a heat sink having a heat spreading component changing size in cross-sectional area along its height. 2. The method of claim 1, wherein the top and bottom panels comprise a plurality of said zones of reduced and increased thicknesses. 3. The method of claim 1, wherein the strengthening beam is integrally formed with the at least one of the top and bottom panels. 4. The method of claim 3, wherein the at least one of the top and bottom panels comprises a plurality of said strengthening beams, and wherein the strengthening beams are interconnected to provide greater rigidity. 5. An enclosure for a mobile computing system, the enclosure comprising: a hollow body shaped and dimensioned to house a processing module, and a display module for a tablet personal computer, wherein the hollow body is defined by a top panel, a bottom panel, and peripheral side panels, wherein the top and bottom panels is fabricated to have zones of increased, and reduced thicknesses which correspond to areas of the processing module of reduced, and greater height, respectively, and comprises strengthening formations to increase a rigidity thereof, wherein at least one of the top and bottom panels further comprises a heat sink having a heat spreading component changing size in cross-sectional area along its height. 6. The enclosure of claim 5, wherein the strengthening formations include strengthening beams disposed in an interconnected pattern. 7. The enclosure of claim 6, wherein the strengthening beams are integrally formed with the top and bottom panels. 8. The enclosure of claim 5, wherein the heat sink comprises the heat spreading component fast with at least one of the top and bottom panels, and a heat absorbing block fast with the heat spreading component, wherein the heat spreading component has a lower thermal conductivity than the heat absorbing block, and wherein a height of the heat sinking mechanism permits the heat absorbing block to be in physical contact with the heat producing component. 9. The enclosure of claim 8, wherein the heat spreading component decreases in the cross-sectional area along its height and in a direction towards the heat absorbing component. 10. The enclosure of claim 8, wherein the heat spreading component has a frusto-conical shape. 11. The enclosure of claim 8, wherein sides of the heat spreading component make an angle of between 30 and 60 degrees with respect to a horizontal plane containing the heat absorbing block. 12. The enclosure of claim 11, wherein the sides of the heat spreading component make an angle of 45 degrees with respect to the horizontal plane. 13. A system comprising: a processing module including a plurality of electronic components mounted on a substrate; and an enclosure to house the processing module, the enclosure comprising top and bottom walls and peripheral side walls that together define a hollow body, wherein at least one of the top and bottom walls comprises zones of increased and reduced thicknesses which correspond to portions of the processing module of reduced, and increased height, respectively, and a strengthening beam to increase a rigidity thereof, wherein at least one of the top and bottom panels comprises a heat sink having a heat spreading component changing size in cross-sectional area along its height. 14. The system of claim 13, further comprising a plurality of strengthening beams arranged in an interconnected pattern for greater rigidity. 15. The system of claim 13, wherein the heat sink comprises the heat spreading component fast therewith, and a heat absorbing block fast with the heat spreading component, wherein a thermal conductivity of the heat spreading component block is less than a thermal conductivity of the heat absorbing block, and a height of the heat sink allows the heat absorbing block to be in physical contact with a heat producing component of the processing module. 16. The system of claim 15, wherein walls of the heat spreading component are inclined relative to a horizontal plane containing the heat absorbing block at an angle of 45 degrees. 17. A method for fabricating an enclosure for a mobile computing system, the method comprising: constructing a top and a bottom panel including fabricating a frame comprising a plurality of interconnected beams for each of the top and bottom panels; covering the frame with a sheet material; and fabricating side walls interconnecting the top and bottom panels, wherein at least one of the top and bottom panels further comprises a heat sink having a heat spreading component changing size in a cross-sectional area along its height. 18. The method claim 17, wherein the at least one of the top and bottom panels comprises zones of increased thickness each coinciding with a portion of an electronic assembly to be housed in the enclosure of reduced height, and zones of reduced thickness, each coinciding with a portion of the electronic assembly of increased height. 19. The method of claim 1, wherein the heat sink comprises a heat spreading component fast with at least one of the top and bottom panels, and a heat absorbing block fast with the heat spraeding component, wherein the heat spreading component has a lower thermal conductivity than the heat absorbing block, and wherein a height of the heat sink permits the heat absorbing block to be in physical contact with the electronic component.
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