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ESD protected suspension interconnect 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G11B-021/21
출원번호 US-0194643 (2002-07-11)
발명자 / 주소
  • Coon,Warren
출원인 / 주소
  • Magnecomp Corporation
인용정보 피인용 횟수 : 16  인용 특허 : 37

초록

ESD is prevented in a disk drive suspension electrical interconnect having plural pairs of conductive traces supported by an insulative film by disposing a material having a lower resistivity than the insulative film but not so low that the conductive traces are shunted. The material is disposed in

대표청구항

What is claimed is: 1. A disk drive suspension assembly comprising a signal conductor and a spring element for biasing a slider into operating proximity with a disk, said assembly having a surface tending to develop an electrostatic discharge potential, and a surface resistivity modifying agent at

이 특허에 인용된 특허 (37)

  1. Kimock Fred M. (Macungie PA) Knapp Bradley J. (Allentown PA) Finke Steven J. (Kutztown PA) Galdieri John V. (New Tripoli PA), Abrasion wear resistant coated substrate product.
  2. Martin Lawrence L. ; O'Neill David G. ; David Moses M., Abrasive article having a diamond-like coating layer and method for making same.
  3. Selifanov Oleg Vladimirovich (Apt. 52 ; Bldg. 6 Sosny Minsk BYX 220109 ) Tochitsky Eduard Ivanovich (Apt. 188 ; Bldg. 15 Kulman Str. Minsk BYX 220100 ) Akulich Valerii Vladimirovich (Apt. 40 ; Block , Abrasive material for precision surface treatment and a method for the manufacturing thereof.
  4. Giglia Robert D. (Rye NY) Clasen Richard H. (West Redding CT), Articles coated with adherent diamondlike carbon films.
  5. Kube, Todd W.; Blakeslee, Bruce Lynn; Chang, Alexander Wei, Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film.
  6. Banholzer William F. (Scotia NY) Johnson Roger N. (Hagaman NY) Leonard Gary L. (Schenectady NY) Mehan Richard L. (Scotia NY) Spiro Clifford L. (Niskayuna NY), CVD diamond coating annulus components and method of their fabrication.
  7. Litington, Alan H., Carbon coated infra red reflectors.
  8. Green Geoffrey W. (Malvern GB2) Lettington Alan H. (Worcester GB2), Coating insulating materials by glow discharge.
  9. Angelopoulos Marie ; Brusic Vlasta A. ; Graham Teresita Ordonez ; Purushothaman Sampath ; Saraf Ravi F. ; Shaw Jane Margaret ; Roldan Judith Marie ; Viehbeck Alfred, Composition containing a polymer and conductive filler and use thereof.
  10. Tomaswick Kathleen M. (Kittanning PA) LaCamera Alfred F. (Penn Township ; Allegheny County PA), Container body having improved gas barrier properties.
  11. Cohen Stephen A. (Wappingers Falls NY) Edelstein Daniel C. (New Rochelle NY) Grill Alfred (White Plains NY) Paraszczak Jurij R. (Pleasantville NY) Patel Vishnubhai V. (Yorktown NY), Diamond-like carbon for use in VLSI and ULSI interconnect systems.
  12. Subrahmanyam, Jai N.; Palmer, Darrell D.; Chue, Jack M., ESD-protected head gimbal assembly for use in a disk drive.
  13. Gerber Joel A. (Saint Paul MN) Gits Peter A. (White Bear Lake MN), Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board.
  14. Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY), Electronic package assembly method.
  15. Anschel Morris (Binghamton NY) Sammakia Bahgat G. (Johnson City NY), Electronic package with heat spreader member.
  16. Golike Ralph C. (Wilmington DE) Huang Hua-Feng (Mendenhall PA) Llevat Herminio C. (Newark DE), Electronics protective packaging film.
  17. Mekdhanasarn Boonmi ; Lo Randy Hsiao-Yu ; Ichikawa Steve M. ; Ahmed Abdul Rahim, Electrostatic discharge protection package.
  18. Arya Satya P. ; Hughbanks Timothy Scott ; Voldman Steven Howard ; Wallash Albert John, Electrostatic discharge protection system for MR heads.
  19. Himes Adam K. ; Schulz Kevin J. ; Sluzewski David A. ; Qualey David G., Flex circuit head interconnect with insulating spacer.
  20. Robert S. Dodsworth, Flexible circuit with electrostatic damage limiting feature and method of manufacture.
  21. Yang Rui, Flexible circuits with static discharge protection and process for manufacture.
  22. Hughbanks Timothy Scott ; Robertson Neil Leslie ; Voldman Steven Howard ; Wallash Albert John, Having parastic shield for electrostatic discharge protection.
  23. Kamigama, Takehiro; Yagi, Ichiro; Shiraishi, Masashi, Head arm assembly, disk apparatus with head arm assembly and manufacturing method of head arm assembly.
  24. Carlson Carl J. ; Doundakov Viktor S., Head gimbal assembly with low stiffness flex circuit and ESD Protection.
  25. Girard, Mark T.; Jurgenson, Ryan A., Head interconnect with support material carbonized shunt.
  26. Kochem Karl-Heinz (Bingen-Dietersheim DEX) Schmidt Michael (Oestrich-Winkel DEX), Heat-sealable films and film laminates with an antistatic coating.
  27. Palmer Darrell Dean (San Jose CA), Integrated suspension for an information storage system having electrostatic discharge protection.
  28. Girard Mark T. ; Jurgenson Ryan A., Method and shunting and deshunting an electrical component and a shuntable/shunted electrical component.
  29. Klun Thomas P. (Lakeland MN) Truong Thach G. (Austin TX), Method for making flexible circuits.
  30. Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY), Multi-layer flexible film module.
  31. Shum, Victor Wing-Chun; Simmons, Randall George, Non-homogeneous laminate material for suspension with electrostatic discharge shunting.
  32. Hempel Hans-Ulrich (Overath DEX) Grnert Margarete (Kaarst DEX) Tesmann Holger (Dsseldorf DEX) Mller Heinz (Monheim DEX), Organopolysiloxane anti-foaming agents.
  33. Mackowski Jean M. (Villeurbanne FRX), Process for depositing a thin layer of a material on the wall of a hollow body.
  34. Jonas Friedrich,DEX ; Guntermann Udo,DEX ; Lerch Klaus,DEX ; Bohnke Arthur,DEX ; Basten Hans,DEX ; Thometzek Peter,DEX, Process for the electrostatic lacquering of non-conductive surfaces.
  35. Bajorek Christopher H. (Los Gatos CA) Erpelding A. David (San Jose CA) Garfunkel Glen A. (Los Gatos CA) Pattanaik Surya (San Jose CA) Robertson Neil L. (Campbell CA) Wallash Albert J. (Morgan Hill CA, Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture.
  36. Eggler James F. (Stonington CT) Johnson Michael R. (Gales Ferry CT) Melvin ; Jr. Lawrence S. (Ledyard CT), Substituted hexahydrobenzo[e]indene and octahydrophenanthrene CNS agents and pharmaceutical compositions thereof.
  37. Kulkarni Vaman G., Tuned conductive coatings and blends from intrinisically conductive polymers and processes for making same.

이 특허를 인용한 특허 (16)

  1. Schreiber, Christopher; Dunn, Christopher, Additive disk drive suspension manufacturing using tie layers for vias and product thereof.
  2. Schreiber, Christopher; Dunn, Christopher, Disk drive suspension via formation using a tie layer and product.
  3. Ziegler, Karl; McKinstry, Kevin D., Flexible circuit with partial ground path.
  4. Carlson,Keith W.; Boismier,Dennis A.; Houk,Galen D.; Webb, Jr.,Larry C.; Leabch,Craig A., Ground interconnects.
  5. Fornes, Timothy D.; Carruthers, Seth B.; Cox, Christopher J., Lightning strike protection system.
  6. Schreiber, Christopher; Dunn, Christopher Gene, Low impedance, high bandwidth disk drive suspension circuit.
  7. Schreiber, Christopher; Dunn, Christopher Gene, Low impedance, high bandwidth disk drive suspension circuit.
  8. Thaveeprungsriporn,Visit; Hu,Szu Han, Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material.
  9. Schreiber,Christopher; Dunn,Christopher, Multilayer gimbal suspension element manufacture with co-etchable layers.
  10. Schreiber, Christopher; Dunn, Christopher, Resilient flying lead and terminus for disk drive suspension.
  11. Ishii,Jun; Ooyabu,Yasunari, Suspension board with circuit.
  12. Bumanlag, Napoleon B.; Galinggana, Jr., Roger F.; Li, Lloyd Henry; Tag-At, Ray Nicanor, System and method for changing resonant frequency in hard disk drive components.
  13. Isom,Eric S.; Bhattacharya,Sandeepan; Agrawal,Jagdish L., Unified suspension laminate.
  14. Ishii, Jun; Funada, Yasuhito; Ooyabu, Yasunari, Wired circuit board.
  15. Ishii, Jun; Ooyabu, Yasunari; Thaveeprungsriporn, Visit, Wired circuit board.
  16. Ishii, Jun; Funada, Yasuhito; Ooyabu, Yasunari, Wired circuit board and production method thereof.
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