초록
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
대표
청구항
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The invention claimed is: 1. In a mold apparatus for resin encapsulation, wherein a substrate board is clamped by both an upper mold disposed in the lower surface of an upper mold set and a lower mold disposed in the upper surface of a lower mold set, wherein a plunger provided in any one of said mold sets is extruded whereby solid resin for encapsulation is fluidified, and wherein an electronic component mounted on the surface of said substrate board is encapsulated with the resin, a mold for resin encapsulation, wherein any one of said molds is suppor...
The invention claimed is: 1. In a mold apparatus for resin encapsulation, wherein a substrate board is clamped by both an upper mold disposed in the lower surface of an upper mold set and a lower mold disposed in the upper surface of a lower mold set, wherein a plunger provided in any one of said mold sets is extruded whereby solid resin for encapsulation is fluidified, and wherein an electronic component mounted on the surface of said substrate board is encapsulated with the resin, a mold for resin encapsulation, wherein any one of said molds is supported by plural pistons provided in parallel, wherein said pistons are inserted slidably within an oil hydraulic cylinder block provided in said mold set to be able to compensate for substrate boards having varying thicknesses, and wherein said plural pistons provided in parallel are linked by a synchronization bar. 2. In a mold apparatus for resin encapsulation, wherein a substrate board is clamped by both an upper mold disposed in the lower surface of an upper mold set and a lower mold disposed in the upper surface of a lower mold set, wherein a plunger provided in any one of said mold sets is extruded whereby solid resin for encapsulation is fluidified, and wherein an electronic component mounted on the surface of said substrate board is encapsulated with the resin, a mold for resin encapsulation, wherein any one of said molds is supported by plural pistons provided in parallel, wherein said pistons are inserted slidably within an oil hydraulic cylinder block provided in said mold set to be able to compensate for substrate boards having varying thicknesses, and wherein each of the plural pistons provided in parallel and a base plate supporting the middle sections of the pistons and constituting a lower mold set are provided with respective through holes, for operation check, capable of communicating in a common straight line. 3. In a mold apparatus for resin encapsulation, wherein a substrate board is clamped by both an upper mold disposed in the lower surface of an upper mold set and a lower mold disposed in the upper surface of a lower mold set, wherein a plunger provided in any one of said mold sets is extruded whereby solid resin for encapsulation is fluidified, and wherein an electronic component mounted on the surface of said substrate board is encapsulated with the resin, a mold for resin encapsulation, wherein any one of said molds is supported by plural pistons provided in parallel, wherein said pistons are inserted slidably within an oil hydraulic cylinder block provided in said mold set to be able to compensate for substrate boards having varying thicknesses, and wherein a guiding mechanism section comprising: an up-down movable block moving downwardly by being pressed by the lower surface of an upper mold set; and a guiding block moving sidewardly to a guiding position of said lower mold by being pressed by the tapered surface of the up-down movable block; for guiding the lower mold with said guiding block during the mold clamping and for releasing said guiding block during the mold opening is disposed in the vicinity of an outward surface of said lower mold attached to said lower mold set. 4. In a mold apparatus for resin encapsulation, wherein a substrate board is clamped by both an upper mold disposed in the lower surface of an upper mold set and a lower mold disposed in the upper surface of a lower mold set, wherein a plunger provided in any one of said mold sets is extruded whereby solid resin for encapsulation is fluidified, and wherein an electronic component mounted on the surface of said substrate board is encapsulated with the resin, a mold apparatus for resin encapsulation, wherein any one of the molds is supported by plural pistons provided in parallel, wherein an oil hydraulic cylinder block to which one end of each of the plural pistons supporting any one of said molds is inserted slidably is provided in any one of said upper mold set and said lower mold set so as to be changeable with a normal base block and to be able to compensate for substrate boards having varying thicknesses, wherein the plural pistons provided in parallel are linked by a synchronization bar. 5. A mold apparatus for resin encapsulation according to claim 4, wherein said plural pistons supporting any one of said molds are plural pistons supporting said lower mold and one end of each of the plural pistons are inserted slidably in said oil hydraulic cylinder block provided in said lower mold set so as to be changeable with a normal base block comprising ejector rods and to be able to compensate for substrate boards having varying thicknesses. 6. A mold apparatus for resin encapsulation of claim 5, wherein said oil hydraulic cylinder block is slidably engaged to a base plate for chase constituting the lower mold set so as to be changeable with a normal base block comprising ejector rods. 7. A mold apparatus for resin encapsulation of claim 4, wherein an oil hydraulic cylinder block is slidably engaged to a base plate constituting the upper mold set so as to be changeable with a normal base block. 8. A mold apparatus for resin encapsulation of claim 4, wherein a heat insulating plate is disposed in at least one linkage section between the lower mold and a space block, a side block, or an end block constituting the lower mold set. 9. A mold apparatus for resin encapsulation of claim 4, wherein a heat insulating plate is disposed in at least one linkage section between a lower mold and a space block, a support block, or a piston of a lower chase. 10. A mold apparatus for resin encapsulation of claim 4, wherein a lower chase involving the lower mold is slidably engaged to the lower mold set so as to be attachable thereto and detachable therefrom. 11. In a method of resin encapsulation, wherein a plastic substrate board is clamped between a fixed side mold and a movable side mold, and wherein resin is filled into the formed cavity, thereby encapsulating a mounted component on the surface of said substrate board with the resin, a method of resin encapsulation comprising: a first clamping step of clamping said substrate board with said both molds using a force of a strength, which does not cause the deformation of said substrate board; a first resin filling step of filling the resin into a cavity formed by said both molds to an extent that the mounted component is almost covered; a second clamping step of clamping the member to be clamped, with said both molds in an ordinary manner; and a second resin filling step of filling the resin completely in the cavity formed by said both molds; wherein clamping is carried out with a force of 70-80% of ordinary force in said first clamping step, and wherein the resin is filled by an amount of 80-90% of the complete filling in said first resin tilling step. 12. In a mold apparatus for resin encapsulation, wherein a plastic substrate board is clamped between a fixed side mold and a movable side mold, and wherein resin is filled into the formed cavity, thereby encapsulating a mounted component on the surface of said substrate board with the resin, a mold apparatus for resin encapsulation, wherein at least the area for clamping the plastic substrate board of said movable side mold is constituted of a clamping member movable in the clamping direction, comprising a driving mechanism for moving said clamping member thereby to clamp the plastic substrate board between the both molds with a clamping force of a strength, which does not cause the deformation of said substrate board or an ordinary clamping force, wherein said driving mechanism is constituted of a hydraulic pressure generating cylinder mechanism for driving a clamping member by the hydraulic balance between a piston extruding liquid chamber and a piston retracting liquid chamber, wherein a pressure sensor is provided for detecting the hydraulic pressure of the extruding liquid chamber in a hydraulic pressure generating cylinder of the hydraulic pressure generating cylinder mechanism, and wherein said hydraulic pressure generating cylinder mechanism is controlled and driven depending on the pressure detected by said pressure sensor, thereby clamping the plastic substrate board between the both molds with an ordinary clamping force or a clamping force of a strength, which does not cause the deformation. 13. A mold apparatus for resin encapsulation of claim 12, wherein the oil pressure adjustment of the piston extruding liquid chamber and the piston retracting liquid chamber of said hydraulic pressure generating cylinder is performed independently by respective oil pressure adjusting apparatuses depending on the pressure detected by pressure sensors provided correspondingly to the respective liquid chambers. 14. A mold apparatus for resin encapsulation of claim 1, wherein each of the plural pistons provided in parallel and a base plate supporting the middle sections of the pistons and constituting a lower mold set are provided with respective through holes, for operation check, capable of communicating in a common straight line. 15. A mold apparatus for resin encapsulation of claim 1, wherein a guiding mechanism section comprising: an up-down movable block moving downwardly by being pressed by the lower surface of an upper mold set; and a guiding block moving sidewardly to a guiding position of said lower mold by being pressed by the tapered surface of the up-down movable block; for guiding the lower mold with said guiding block during the mold clamping and for releasing said guiding block during the mold opening is disposed in the vicinity of an outward surface of said lower mold attached to said lower mold set. 16. A mold apparatus for resin encapsulation of claim 2, wherein a guiding mechanism section comprising: an up-down movable block moving downwardly by being pressed by the lower surface of an upper mold set; and a guiding block moving sidewardly to a guiding position of said lower mold by being pressed by the tapered surface of the up-down movable block; for guiding the lower mold with said guiding block during the mold clamping and for releasing said guiding block during the mold opening is disposed in the vicinity of an outward surface of said lower mold attached to said lower mold set. 17. A mold apparatus for resin encapsulation of claim 1, wherein the lower mold supported by the pistons is attachable onto and detachable from the upper surface of said lower mold set, and wherein the oil hydraulic cylinder block is clamped by a base plate and a base plate for chase constituting the top and the bottom of the lower mold set. 18. A mold apparatus for resin encapsulation of claim 1, wherein each of the plural pistons provided in parallel and a base plate supporting the middle sections of the pistons and constituting a lower mold set are provided with respective through holes, for operation check, capable of communicating in a common straight line, and wherein the oil hydraulic cylinder block is clamped by a base plate and the base plate for chase constituting the top and the bottom of the lower mold set. 19. A mold apparatus for resin encapsulation of claim 1, wherein a guiding mechanism section comprising: an up-down movable block moving downwardly by being pressed by the lower surface of an upper mold set; and a guiding block moving sidewardly to a guiding position of said lower mold by being pressed by the tapered surface of the up-down movable block; for guiding the lower mold with said guiding block during the mold clamping and for releasing said guiding block during the mold opening is disposed in the vicinity of an outward surface of said lower mold attached to said lower mold set, and wherein the oil hydraulic cylinder block is clamped by a base plate and a base plate for chase constituting the top and the bottom of the lower mold set. 20. A mold apparatus for resin encapsulation according to claim 6, wherein a heat insulating plate is disposed in at least one linkage section between the lower mold and a space block, a side block, or an end block constituting the lower mold set. 21. A mold apparatus for resin encapsulation according to claim 6, wherein a heat insulating plate is disposed in at least one linkage section between a lower mold and a space block, a support block, or a piston of a lower chase. 22. A mold apparatus for resin encapsulation according to claim 6, wherein the lower chase involving the lower mold is slidably engaged to the lower mold set so as to be attachable thereto and detachable therefrom. 23. A mold apparatus for resin encapsulation of any one of claims 1, 2 and 3, wherein said plunger provided in any one of said mold sets is a plunger provided in the lower mold set. 24. A mold apparatus for resin encapsulation of claim 23, wherein the oil hydraulic cylinder block is clamped by a base plate and a base plate for chase constituting the top and the bottom of the lower mold set. 25. A mold apparatus for resin encapsulation of any one of claims 1, 2 and 3, wherein the lower mold supported by the pistons is attachable onto and detachable from the upper surface of said lower mold set.
