IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0405421
(2003-04-01)
|
발명자
/ 주소 |
- Birang,Manoocher
- Gleason,Allan
- Guthrie,William L.
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
11 인용 특허 :
44 |
초록
▼
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
대표청구항
▼
What is claimed is: 1. A method of forming a polishing pad, comprising: positioning a solid insert of transparent material in a liquid pad material to provide an assembly; curing the assembly to solidity the liquid pad material, wherein the liquid pad material, when solidified, includes a polishin
What is claimed is: 1. A method of forming a polishing pad, comprising: positioning a solid insert of transparent material in a liquid pad material to provide an assembly; curing the assembly to solidity the liquid pad material, wherein the liquid pad material, when solidified, includes a polishing surface. 2. The method of claim 1, wherein curing the assembly bonds the solid insert and the pad material together. 3. The method of claim 1, wherein curing the assembly integrally molds the solid insert into the pad material. 4. The method of claim 1, wherein the pad material comprises polyurethane. 5. The method of claim 4, wherein the pad material further additives which inhibit transmissiveness. 6. The method of claim 5, wherein the additives comprises microspheres. 7. The method of claim 6, wherein the solid insert comprises polyurethane lacking microspheres. 8. The method of claim 1, wherein the solid insert comprises polyurethane. 9. The method of claim 1, wherein the liquid window material comprises polyurethane. 10. A method of forming a polishing pad, comprising: cutting a hole in a polishing pad material; dispensing a liquid window material into the hole; and curing the liquid window material to form a plug of transparent material in the pad material. 11. The method of claim 10, wherein curing the assembly integrally molds the solid insert into the pad material. 12. The method of claim 11, wherein the pad material comprises polyurethane. 13. The method of claim 12, wherein the pad material further additives which inhibit transmissiveness. 14. The method of claim 13, wherein the additives comprises microspheres. 15. The method of claim 14, wherein the window comprises polyurethane lacking microspheres. 16. A method of forming a polishing pad, comprising the steps of: forming an article having a polishing surface and an opposite surface with at least a portion of the polishing surface being transparent, the polishing surface and the opposite surface being on opposite sides of the article; and forming an aperture in the opposite side that is at least partially aligned with the transparent portion of the polishing surface. 17. The method of claim 16, wherein forming the article includes forming a cover layer with the transparent portion and a backing layer with the aperture. 18. The method of claim 16, wherein forming the aperture includes removing a portion of the article at the opposite surface. 19. The method of claim 18, wherein removing the portion of the article includes cutting the opposite surface. 20. The method of claim 16, wherein forming the article includes securing a plug of light-transmissive material in the article to provide the transparent portion of the polishing surface. 21. The method of claim 20, wherein securing the plug in the polishing pad includes molding the plug to the article. 22. The method of claim 21, wherein molding the plug includes forming a hole in the polishing surface, dispensing a liquid into the hole, and curing the liquid to form the plug. 23. The method of claim 20, wherein securing the plug in the polishing pad includes affixing the plug to the article with an adhesive. 24. The method of claim 20, wherein securing the plug in the polishing pad partially fills the aperture. 25. The method of claim 16, wherein the polishing surface includes polyurethane. 26. The method of claim 16, wherein the transparent portion substantially transmits red laser light. 27. The method of claim 16, further comprising cutting grooves into the polishing surface. 28. The method of claim 21, further comprising filling at least some of the grooves. 29. The method of 28, wherein the transparent portion has substantially the same cross-sectional dimension as the aperture. 30. The method of claim 29, wherein a top surface of the transparent portion is flush with the polishing surface. 31. A method of forming a window in a polishing pad, comprising: forming an aperture in at least one opaque layer of a polishing pad having a polishing surface; and securing a transparent plug in the aperture to the opaque layer with an adhesive, wherein the plug includes polyurethane. 32. The method of claim 31, wherein securing the transparent plug in the aperture includes placing a top surface of the plug substantially coplanar with the polishing surface. 33. The method of claim 31, wherein forming the aperture includes forming a first section with a first cross-sectional dimension adjacent the polishing surface and forming a second section with a second, different cross-sectional dimension adjacent a surface of the polishing pad opposite the polishing surface. 34. The method of claim 33, wherein the first dimension is larger than the second dimension. 35. The method of claim 33, wherein the first dimension is smaller than the second dimension. 36. The method of claim 33, wherein securing the transparent plug includes placing an adhesive on a lip between the first and second sections of the aperture. 37. The method of claim 33, wherein the transparent plug has a first portion and a second portion, and securing the transparent plug in the aperture includes placing the first portion of the transparent plug in the first section of the aperture and placing the second portion of the transparent plug in the second section of the aperture. 38. A method of forming a window in a polishing pad, comprising: forming an aperture in a polishing pad, the aperture including a first section with a first cross-sectional dimension adjacent a first surface of the pad and a second section with a second, different cross-sectional dimension adjacent a second surface of the pad opposite the first surface; and securing a transparent plug in the aperture. 39. The method of claim 38, wherein securing the plug in the aperture includes adhesively attaching the plug to the polishing pad. 40. The method of claim 38, wherein the first surface of the pad is a polishing surface. 41. The method of claim 40, wherein securing the transparent plug in the aperture includes placing a top surface of the plug substantially coplanar with the polishing surface.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.