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Thermal interface compositions contain nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfa

Thermal interface compositions contain nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

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What is claimed is: 1. A thermal interface composition comprising a blend of a polymer matrix and nanoparticles, said nanoparticles being selected from the group consisting of colloidal silica and POSS, wherein said composition is thermally conductive. 2. A thermal interface composition as in cla

What is claimed is: 1. A thermal interface composition comprising a blend of a polymer matrix and nanoparticles, said nanoparticles being selected from the group consisting of colloidal silica and POSS, wherein said composition is thermally conductive. 2. A thermal interface composition as in claim 1, wherein the nanoparticles are organo-functionalized nanoparticles. 3. A thermal interface composition as in claim 2, wherein the organo-functionalized nanoparticles comprise an organoalkoxysilane, vinyl, allyl, styrenic, silyl or siloxyl of the formula (R1)a Si(OR2)4-a, wherein R1 is independently at each occurrence a C1-18 monovalent hydrocarbon radical optionally further functionalized with alkyl acrylate, alkyl methacrylate, epoxide, vinyl, allyl, styrenic, silyl or siloxyl groups or C6-14 aryl radical; R2 is independently at each occurrence a C 1-18 monovalent hydrocarbon radical or a hydrogen radical; and "a" is a whole number equal to 1 to 3 inclusive. 4. A thermal interface composition as in claim 3, wherein the organoalkoxysilane is selected from the group consisting of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, 1-hexenyl triethoxysilane, n-octyl triethoxysilane, n-dodecyl triethoxysilane, 2-(3-vinyl tetramethyl disiloxyl)-ethyl trimethoxy silane and combinations thereof. 5. A thermal interface composition as in claim 1, wherein the polymer matrix comprises a curable polymeric composition. 6. A thermal interface composition as in claim 5, wherein the curable polymeric composition is selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins. 7. A thermal interface composition as in claim 1, further comprising a micron-sized filler. 8. A thermal interface composition as in claim 7 wherein the micron-sized filler is selected from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, metals, silicone carbide, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof. 9. A thermal interface composition comprising a blend of a curable polymer matrix and organo-functionalized nanoparticles selected from the group consisting of organo-functionalized colloidal silica and organo-functionalized POSS. 10. A thermal interface composition as in claim 9, wherein the organo-functionalized nanoparticles comprise an organoalkoxysilane functionality derived from a compound selected from the group consisting of 2-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, 1-hexenyl triethoxysilane, n-octyl triethoxysilane, n-dodecyl triethoxysilane, 2-(3-vinyl tetramethyl disiloxyl)-ethyl trimethoxysilane and combinations thereof. 11. A thermal interface composition as in claim 9 further comprising a micron-sized filler selected from the group consisting of fumed silica, fused silica, finely divided quartz powder, amorphous silicas, carbon black, graphite, diamond, metals, silicone carbide, aluminum hydrates, metal nitrides, metal oxides, and combinations thereof. 12. A method of increasing heat transfer comprising: positioning a heat producing component in contact with a thermal interface composition comprising a blend of a polymer matrix and nanoparticles; said nanoparticles being selected from the group consisting of colloidal silica and POSS; and positioning a heat sink in contact with the thermal interface composition. 13. A method as in claim 12 wherein the step of positioning the heat producing component in contact with a thermal interface composition comprises positioning a heat producing component in contact with a blend of a curable polymer matrix and colloidal silica functionalized with at least one organoalkoxysilane. 14. A method as in claim 12 wherein the step of positioning the heat producing component in contact with a thermal interface composition comprises positioning a heat producing component in contact with a blend of a curable polymer matrix and POSS functionalized with at least one organoalkoxysilane. 15. A method as in claim 12 wherein the step of positioning heat producing component in contact with a thermal interface composition comprises positioning a heat producing component in contact with a blend of a curable polymer matrix and nanoparticles functionalized with at least one organoalkoxysilane selected from the group consisting of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane 1-hexenyl triethoxysilane, n-octyl-triethoxysilane, n-dodecyl triethoxysilane, 2-(3-vinyl tetramethyl disiloxyl)-ethyl trimethoxysilane and combinations thereof. 16. A method as in claim 12 further comprising the step of curing the thermal interface composition. 17. A method as in claim 12 wherein the step of positioning heat producing component in contact with a thermal interface composition comprises positioning a pre-formed pad made from the thermal interface composition in contact with the heat producing component. 18. A method of increasing heat transfer comprising: positioning a heat producing component in contact with a thermal interface composition comprising a blend of (i) a polymer matrix; (ii) organo-functionalized nanoparticles selected from the group consisting of colloidal silica and POSS; and and (iii) a micron-sized filler; and positioning a heat sink in contact with the thermal interface composition. 19. An electronic component comprising: a heat producing component; a heat sink; and a thermal interface composition interposed between the heat producing component and the heat sink, the thermal interface composition comprising a blend of a polymer matrix and nanoparticles, said nanoparticles being selected from the group consisting of colloidal silica and POSS. 20. An electronic component as in claim 19, wherein the heat producing component is a semiconductor chip. 21. An electronic component as in claim 19, wherein the polymer matrix comprises a curable polymer. 22. An electronic component as in claim 19, wherein the polymer matrix is selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, fluorinated polyallyl ethers, polyamide resins, acrylic resins, polyimidoamide resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimmide triazine resins, fluororesins and any other polymeric systems known to there skilled in the art. 23. An electronic component as in claim 19, wherein the nanoparticles are functionalized with at least one organoalkoxysilane selected from the group consisting of 2-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, 1-hexenyl triethyoxy silane, n-octyltriethoxysilane, n-dodecyl triethyoxysilane, 2-(3-vinyl-tetramethyl-disiloxyl)-ethyl trimethoxysilane and combinations thereof. 24. An electronic component as in claim 19, wherein the thermal interface composition further comprises a micron-sized filler. 25. An electronic component as in claim 19, wherein the thermal interface composition comprises a pre-formed pad. 26. A thermal interface composition comprising a blend of polymer matrix and nanoparticles, said nanoparticles being selected from the group consisting of colloidal silica and POSS. 27. A thermal composition as in claim 26, wherein the polymer matrix comprises a curable polymeric composition selected from the group consisting of epoxy resins, acrylate resins, organopolysiloxane resins, polyimide resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, and fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, cyanate ester resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, and fluororesins. 28. A thermal interface composition as in claim 26, further comprising a micron-sized filler.