[특허]Protection of work piece during surface processing

[미국특허] Protection of work piece during surface processing 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B24B-049/00
출원번호	US-0249433 (2003-04-08)
발명자 / 주소	Kassir,Salman Moudrek Spiegel,Larry A.
출원인 / 주소	Strasbaugh
대리인 / 주소	Sinsheimer, Schiebelhut &
인용정보	피인용 횟수 : 8 인용 특허 : 106

초록 ▼

The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the passage of a vacuum signal, a frame holding the protective material, a frame holder to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method provided by the invention can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.

대표청구항 ▼

What is claimed is: 1. An arrangement for supporting a work piece having opposed first and second surfaces while operations are carried out on the first, surface, to protect the second surface, comprising: a vacuum chuck having a support surface, the vacuum chuck being at least partially porous to allow passage of a vacuum signal therethrough; a frame; a porous protective material held by the frame; said frame and said protective material together comprising a frame assembly; a frame holder to hold the frame assembly to the vacuum chuck; and a fastening arrangement to fasten the frame holder to the vacuum chuck adjacent the support surface allowing passage of the vacuum signal from said vacuum chuck through said protective material to said work piece. 2. The arrangement of claim 1 wherein the frame holder releasably holds the frame assembly. 3. The arrangement of claim 2 further comprising magnetic material on said frame holder to hold said frame to said frame holder. 4. The arrangement of claim 1 wherein said frame includes a ring-shaped body. 5. The arrangement of claim 1 wherein said frame comprises a plurality of laminated rings. 6. The arrangement of claim 1 wherein said protective material is secured to said frame with an adhesive. 7. The arrangement of claim 1 wherein said protective material is held under tension by the frame. 8. The arrangement of claim 1 wherein said protective material comprises a polymeric film mesh. 9. The arrangement of claim 1 wherein said protective material comprises a woven fabric. 10. The arrangement of claim 1 wherein said protective material comprises a fabric with vacuum holes defined by warp and weft fibers. 11. The arrangement of claim 10 wherein said vacuum holes are arranged in a regularly spaced pattern. 12. The arrangement of claim 1 wherein said work piece comprises a semiconductor wafer of predetermined size. 13. The arrangement of claim 1 wherein said protective material comprises a film sheet that is perforated to form vacuum holes. 14. The arrangement of claim 13 wherein said film sheet is generally non-porous prior to being perforated. 15. The arrangement of claim 1 wherein said fastening arrangement comprises a plurality of threaded fasteners securing said frame holder to said vacuum chuck and a plurality of springs between said frame holder and said fastening arrangement. 16. The arrangement of claim 15 further comprising a plurality of pins extending from said frame holder and received in a plurality of openings defined by the frame. 17. The arrangement of claim 1, wherein the protective material is a non-adhering material. 18. A method of back grinding a semiconductor wafer having an initial thickness, a front side surface with circuitry and an opposed backside surface, comprising the steps of: providing a protective material having a first surface for contact with the front side surface of said wafer; providing a vacuum chuck having a support surface, the vacuum chuck being at least partially porous to allow passage of the vacuum signal therethrough; placing said protective material in contact with said support surface; placing the front side surface of said wafer in contact with the first surface of said protective material wherein the protective material extends at least over an entire surface area of the front side surface of the wafer; applying the vacuum signal through said protective material with said vacuum chuck to thereby communicate the vacuum signal with the front side surface of said wafer securing the wafer with the vacuum chuck; processing the backside surface of said wafer; removing the vacuum signal to release said wafer; and removing said wafer from said protective material. 19. A method of back grinding a semiconductor wafer having an initial thickness, a front side surface with circuitry and an opposed backside surface, comprising the steps of: providing a protective material having a first surface for contact with the front side surface of said wafer; providing a vacuum chuck having a support surface, the vacuum chuck being at least partially porous to allow passage of the vacuum signal therethrough; placing said protective material in contact with said support surface; placing the front side surface of said wafer in contact with the first surface of said protective material; applying the vacuum signal through said protective material with said vacuum chuck to thereby communicate the vacuum signal with the front side surface of said wafer securing the wafer with the vacuum chuck; processing the backside surface of said wafer; removing the vacuum signal to release said wafer; removing said wafer from said protective material; providing a frame; securing the protective material to the frame; and securing the frame to the vacuum chuck. 20. The method of claim 19 wherein the step of securing the protective material to the frame comprises stretching the protective material on said frame. 21. The method of claim 19 wherein the step of securing the protective material to the frame comprises the steps of providing an adhesive and securing the protective material to the frame with said adhesive. 22. The method of claim 19 wherein the step of securing the frame to the vacuum chuck comprises the steps of: providing a frame holder having magnetic material; and securing the frame holder to said vacuum chuck, whereby said frame is releasably secured to said vacuum chuck. 23. The method of claim 22 wherein the step of securing the frame holder to said vacuum chuck comprises the step of resiliently securing the frame holder to said vacuum chuck. 24. A method of back grinding a semiconductor wafer having an initial thickness, a front side surface with circuitry and an opposed backside surface, comprising the steps of: providing a protective material having a first surface for contact with the front side surface of said wafer; providing a vacuum chuck having a support surface, the vacuum chuck being at least partially porous to allow passage of the vacuum signal therethrough; placing said protective material in contact with said support surface; placing the front side surface of said wafer in contact with the first surface of said protective material; applying the vacuum signal through said protective material with said vacuum chuck to thereby communicate the vacuum signal with the front side surface of said wafer securing the wafer with the vacuum chuck; processing the backside surface of said wafer; removing the vacuum signal to release said wafer; and removing said wafer from said protective material; wherein the step of providing said protective material comprises the steps of providing a fabric having warp and weft fibers, and defining a series of vacuum holes with the warp and weft fibers. 25. The method of claim 24 further comprising the step of arranging said vacuum holes in a regularly spaced, generally rectilinear grid. 26. The method of claim 18 wherein the step of providing said protective material comprises the steps of providing a protective film sheet and perforating said film sheet to form vacuum holes. 27. A method for use in assembling a frame assembly capable of use in protecting a wafer during processing, comprising: applying a tensile force to a protective material, positioning the protective material over a frame, wherein the frame has an area greater than an area of a wafer; securing the protective material with the frame; and applying an adhesive about a surface of the frame, wherein the securing the protective material with the frame includes securing the protective material with the adhesive; wherein the applying the tensile force includes applying the tensile force at a predefined level to achieve pores within the protective material with an average pore size being of at least a predefined pore size limit. 28. An apparatus for use in protecting a semiconductor wafer during processing, comprising: a frame; a porous protection material secured across the frame, wherein the protection material has an area greater than an area of a first surface of the semiconductor wafer; and a frame holder comprising a plurality of pins extending from said frame holder defining positioning of said frame with said frame holder, and fasteners extending from said frame holder to secure said frame holder with a housing; wherein the protective material is perforated such that the protective material is porous and the protective material is non-porous prior to being perforated.

이 특허에 인용된 특허 (106) 인용/피인용 타임라인 분석

Vogtmann Michael R. ; Lentz Terry L., Accurate positioning of a wafer.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Active yoke hidden hinge digital micromirror device.
상세보기
Nagamoto Kouichi,JPX ; Komiyama Mikio,JPX ; Ebe Kazuyoshi,JPX, Adhesive tape, base material for adhesive tape and their manufacturing methods.
상세보기
Bruce Victoria J. ; Dabney Gregory A., Analyzing an electronic circuit formed upon a frontside surface of a semiconductor substrate by detecting radiation exiting a backside surface coated with an antireflective material.
상세보기
Tietz James V. ; White John M., Apparatus and method for grinding a semiconductor wafer surface.
상세보기
Kassir Salman M, Apparatus and method for reliably releasing wet, thin wafers.
상세보기
O'Boyle John O., Apparatus and method for retaining a semiconductor wafer during testing.
상세보기
Scherrer Raymond E. (West Palm Beach FL), Apparatus for lapping or polishing materials.
상세보기
Feldmeier Fritz (Nuremberg DEX), Apparatus for manufacturing and handling thin wafers.
상세보기
Brandt Georg (Erlangen DEX), Apparatus for manufacturing thin wafers of hard, non-metallic material such as for use as semiconductor substrates.
상세보기
Numoto Minoru,JPX, Apparatus for polishing wafers.
상세보기
Ball Michael B. ; Heppler Steve W., Apparatus for processing a planar structure.
상세보기
Kalenian Bill ; Lentz Terry L., Apparatus for sensing the presence of a wafer.
상세보기
Petermann Harald (Nuremberg DEX) Bauer Peter (Nuremberg DEX), Apparatus for spanning a center-opening saw blade.
상세보기
Timphony Harold R. (Gretna LA) DeCastro Rene F. (Gretna LA), Apparatus for stretching fabric.
상세보기
Birdsley Jeffrey D. ; Thayer Matthew, Back side reactive ion etch.
상세보기
Daniel B. Dow, Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members.
상세보기
Thompson Dennis A. ; Howe Bryan L., Backside thinning using ion-beam figuring.
상세보기
Gitis Norm ; Vinogradov Michael ; Dorfman Vlad, Bidirectional force sensor.
상세보기
Tolles Robert D. ; Cheng Tsungan ; Prince John, Carrier head with layer of conformable material for a chemical mechanical polishing system.
상세보기
Walsh Thomas ; Trojan Dan, Chemical mechanical polishing apparatus and method.
상세보기
Koch Peter (Nuremberg DEX), Chucking apparatus for the combined working of rolling bearing rings.
상세보기
Liebel Christian (Burgthann DEX) Meyer Udo (Nrnberg DEX), Conveyor apparatus.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Deformable mirror light modulator.
상세보기
Roberts Jay W., Film frame substrate fixture.
상세보기
Strasbaugh Ray Howard (Long Beach CA), Fluid responsive, leverage operated chuck.
상세보기
Tabuchi Shuji (Yokohama JPX), Grinding machine.
상세보기
Kassir Salman M ; Walsh Thomas A, Grinding process and apparatus for planarizing sawed wafers.
상세보기
Ronny Konnemann DE, Grinding spindle.
상세보기
Hurley Daniel T. (San Ramon CA), High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microsc.
상세보기
Walsh Thomas A. (Fountain Valley CA) Strasbaugh Alan E. (Seal Beach CA), Lap milling machine.
상세보기
Walsh, Thomas A., Lap shaping machine with oscillatable point cutter and selectively rotatable or oscillatable lap.
상세보기
Vogtmann Michael R. ; Lentz Terry L., Lifting and rinsing a wafer.
상세보기
Degani Yinon ; Dudderar Thomas Dixon ; Tai King Lien, Low profile integrated circuit packages.
상세보기
Althouse Victor E. (Los Altos CA), Means for handling semiconductor die and the like.
상세보기
David G. Halley, Method and apparatus for chemical mechanical polishing.
상세보기
Gitis Norm ; Vinogradov Michael, Method and apparatus for controlled polishing.
상세보기
Park Bae-seung,KRX ; Kim Jin-heung,KRX ; Hwang Do-yun,KRX, Method and apparatus for grinding wafers using a grind chuck having high elastic modulus.
상세보기
Hinzen Hubert (Eckental DEX), Method and apparatus for manufacturing semiconductor wafers and cutting wire apparatus for use therein.
상세보기
Gitis Norm ; Levinson Leo ; Dorfman Vlad ; Vinogradov Michael, Method and apparatus for measuring friction and wear characteristics of materials.
상세보기
Norm Gitis ; Michael Vinogradov ; Vlad Dorfman, Method and apparatus for measuring friction and wear characteristics of materials.
상세보기
Michael B. Ball ; Steve W. Heppler, Method and apparatus for processing a planar structure.
상세보기
Hinzen Hubert (Igensdorf DEX), Method and arrangement for subdividing semiconductor bars into semiconductor wafers.
상세보기
Kunze-Concewitz Horst,DEX, Method and device for cleaning and etching individual wafers using wet chemistry.
상세보기
Norm Gitis ; Michael Vinogradov ; Vlad Dorfman, Method and device for measuring forces.
상세보기
Kunze-Concewitz Horst,DEX, Method and device for treating two-dimensional substrates, especially silicon slices (wafers), for producing microelectronic components.
상세보기
Lindsey ; Jr. Paul C. ; McClelland Robert J., Method for fabricating an integrated circuit.
상세보기
Vallett David P., Method for making semiconductor devices having backside probing capability.
상세보기
Feldmeier Fritz (Nuremberg DEX), Method for manufacturing and handling thin wafers.
상세보기
Chen Sen-Fu,TWX ; Chang Kuei-Jen,TWX, Method for preparing a semiconductor wafer to receive a protective tape.
상세보기
Riding Alan J. ; Jones H. Wayne ; Pennisi Leonard, Method for producing thin dice from fragile materials.
상세보기
Jastrzebski Lubomir L. (Plainsboro NJ) Corboy ; Jr. John F. (East Amwell Township ; Hunterdon County NJ) Pagliaro ; Jr. Robert H. (Mercer County NJ) Soydan Ramazan (Berkley Township ; Ocean County NJ, Method for thinning silicon.
상세보기
Peng Tzu-min,TWX ; Liaw Yung-Haw,TWX ; Chu Cheng-Te,TWX ; Huang Hsin-chieh,TWX, Method of cleaning residue on a semiconductor wafer bonding pad.
상세보기
Kunze-Concewitz Horst,DEX, Method of cleaning surfaces with water and steam.
상세보기
Kazuma Sekiya JP, Method of dicing workpiece.
상세보기
Sasaki Shigeo,JPX ; Takyu Shinya,JPX ; Tokubuchi Keisuke,JPX ; Yazima Koichi,JPX, Method of dividing a wafer and method of manufacturing a semiconductor device.
상세보기
Lehmann Wolfgang (Oberndorf-Kuppenheim DEX) Neukam Christian (Karlsruhe DEX), Method of forming sieve unit for screening machine.
상세보기
Tanaka Kouichi (Nishigo-mura JPX) Hashimoto Hiromasa (Nishigo-mura JPX) Suzuki Fumio (Taishin-mura JPX), Method of polishing semiconductor wafers and apparatus therefor.
상세보기
Gale Richard O. (Richardson TX) Mignardi Michael A. (Dallas TX), Method of protecting micromechanical devices during wafer separation.
상세보기
Engelmann Hans-Juergen,DEX ; Volkmann Beate,DEX ; Zschech Ehrenfried,DEX, Method of sample preparation for electron microscopy.
상세보기
Allen Franklin L. (Sherman TX) Davis Eugene C. (Sherman TX) Dyer Lawrence D. (Richardson TX) Medders Jerry B. (Van Alstyne TX) Simpson Vikki S. (Sherman TX) Smith Jerry D. (Sherman TX) Cunningham Mic, Method of surface protection of a semiconductor wafer during polishing.
상세보기
Corrie Brian L. (Gaston OR), Method of thinning a silicon wafer using a reinforcing material.
상세보기
Mountain David J., Method of thinning semiconductor wafer of smaller diameter than thinning equipment was designed for.
상세보기
Hayato Noguchi JP; Yoshihisa Mineura JP; Kazuyoshi Ebe JP, Method of using pressure sensitive adhesive double coated sheet.
상세보기
Uijen Antonius Johannes Mathijs (Nijmegen NL), Method of working flat articles.
상세보기
Ballhaus Heribert (Nuremberg DEX), Motor spindle with integrated bearing races.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Multi-level deformable mirror device.
상세보기
David G. Halley, Multi-pad apparatus for chemical mechanical planarization.
상세보기
Earl Michael R. (Kokomo IN) Detterich Russell A. (Kokomo IN) Yancey Robert A. (Carmel IN), No coat backside wafer grinding process.
상세보기
Treur Randolph E. ; Boyd John M. ; Wolf Stephan H., Optical view port for chemical mechanical planarization endpoint detection.
상세보기
David G. Halley, Pad quick release device for chemical mechanical planarization.
상세보기
Halley David G., Pad quick release device for chemical mechanical polishing.
상세보기
David G. Halley, Pad transfer apparatus for chemical mechanical planarization.
상세보기
Fortune William S., Pneumatic rotatable hand held pickup tool.
상세보기
Bamba Ryo,JPX, Polishing apparatus for semiconductor wafers.
상세보기
Brown John ; Costello Matthew J. ; DosSantos Luciano P. ; Ruck Robin, Probe station adapter for backside emission inspection.
상세보기
Hollman Kenneth F. ; Karlsson Hans E., Probing with backside emission microscopy.
상세보기
Seko Nobuya,JPX ; Matsuzaki Tadahiro,JPX, Process for production of field-emission cold cathode.
상세보기
Yamada Yutaka,JPX ; Muramoto Takanori,JPX, Semiconductor device manufacturing method for grinding and dicing a wafer from a back side of the wafer.
상세보기
Yoshihara Shinji,JPX ; Inomata Sumitomo,JPX ; Atsumi Kinya,JPX ; Sakai Minekazu,JPX ; Shimoyama Yasuki,JPX ; Fujii Tetsuo,JPX, Semiconductor device with a protective sheet to affix a semiconductor chip.
상세보기
Arai, Kazuhisa, Semiconductor wafer grinding method.
상세보기
Mitchel Fred E. ; Adams John A. ; Bibby Thomas Frederick A., Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head.
상세보기
Ballhaus Heribert (Nuremberg DEX), Sensor bearings for determining rotational speed and/or angle of torsion.
상세보기
Melcer Chris, Slurry pump control system.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Spatial light modulator.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Spatial light modulator and method.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Spatial light modulator and method.
상세보기
Hornbeck Larry J. (Van Alstyne TX), Spatial light modulator and method.
상세보기
Ring Rosalinda M. ; Goruganthu Rama R. ; Davis Brennan V. ; Birdsley Jeffrey D. ; Bruce Michael R., Substrate removal as a function of SIMS analysis.
상세보기
Ring Rosalinda M. ; Goruganthu Rama R. ; Davis Brennan V. ; Birdsley Jeffrey D. ; Bruce Michael R., Substrate removal as a function of resistance at the back side of a semiconductor device.
상세보기
Kato Tadahiro,JPX ; Okuni Sadayuki,JPX ; Kudo Hideo,JPX ; Tomioka Hiroshi,JPX, Surface grinding device and method of surface grinding a thin-plate workpiece.
상세보기
Hetrich Harold Arthur (Reading PA), THINNING SEMICONDUCTIVE SUBSTRATES.
상세보기
Klebanoff Leonard Elliott ; Rader Daniel John, Thermophoretic vacuum wand.
상세보기
Larson Charles E. ; Murphy Timothy E. ; Taylor Bryan L. ; Long Jon M. ; Ellis Mark W. ; Riley Vincent L., Thin microelectronic substrates and methods of manufacture.
상세보기
Koyama Isao (Tokyo JPX) Hatsuse Toshikazu (Tokyo JPX), Vacuum suction device.
상세보기
Sekiya Shinji (Tokyo JPX), Wafer attracting and fixing device.
상세보기
Sekiya Shinji (Tokyo JPX), Wafer attracting and fixing device.
상세보기
Tsai Poyueh,TWX ; Wang Rea-Chang,TWX ; Liu Te Yun,TWX ; Lin Y. F.,TWX, Wafer handling tool with vacuum pickup.
상세보기
Takei Tokio,JPX ; Nakamura Susumu,JPX, Wafer holding jig.
상세보기
Karasikov Nir (Haifa ILX) Ilssar Yoel (Haifa ILX), Wafer inspection system.
상세보기
Randy J. Schwindt ; Warren K. Harwood ; Paul A. Tervo ; Kenneth R. Smith ; Richard H. Warner, Wafer probe station for low-current measurements.
상세보기
Warren K. Harwood ; Paul A. Tervo ; Martin J. Koxxy, Wafer probe station having environment control enclosure.
상세보기
Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR) Andrews Peter D. (Tigard OR), Wafer probe station having integrated guarding, Kelvin connection and shielding systems.
상세보기
David G. Halley, Wafer support for chemical mechanical planarization.
상세보기
Foulke Richard F. (Carlisle MA) Lord Steven M. (Malden MA), Wafer transfer apparatus.
상세보기
Gale Richard O. (Richardson TX) Mignardi Michael A. (Dallas TX), Wafer-like processing after sawing DMDs.
상세보기

이 특허를 인용한 특허 (8) 인용/피인용 타임라인 분석

Simmons, Michael E.; Negishi, Kazuki; Garrison, Ryan; Wolf, Philip, High voltage chuck for a probe station.
상세보기
Simmons, Michael E.; Negishi, Kazuki; Garrison, Ryan; Wolf, Philip, High voltage chuck for a probe station.
상세보기
Brake, Thomas E.; Kalenian, William J.; Grant, David L., Methods and systems for use in grind shape control adaptation.
상세보기
Walsh, Thomas A.; Spiegel, Larry A., Methods and systems for use in grind spindle alignment.
상세보기
Kroninger, Werner; Schwaiger, Josef; Schneider, Ludwig; Ossowski, Lukas, Semiconductor device and method.
상세보기
Kalenian, William J.; Walsh, Thomas A.; Vogtmann, Michael R.; Smedley, Benjamin C.; Spiegel, Larry A.; Brake, Thomas E., Systems and methods of processing substrates.
상세보기
Walsh, Thomas A.; Vogtmann, Michael R., Systems and methods of wafer grinding.
상세보기
Ishikawa, Shigeharu; Kiriyama, Katsuyuki, Vacuum chuck and suction board.
상세보기

활용도 분석정보

상세보기

다운로드

내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

[미국특허] Protection of work piece during surface processing 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허에 인용된 특허 (106) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (8) 인용/피인용 타임라인 분석

활용도 분석정보

활용도 Top5 특허

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

[미국특허] Protection of work piece during surface processing 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허에 인용된 특허 (106) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (8) 인용/피인용 타임라인 분석

활용도 분석정보

활용도 Top5 특허 더보기

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

활용도 Top5 특허