Heat transfer device and method of making same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28D-015/00
H05K-007/20
출원번호
US-0765660
(2004-01-27)
발명자
/ 주소
Rosenfeld,John H.
Ernst,Donald M.
출원인 / 주소
Thermal Corp.
대리인 / 주소
Duane Morris LLP
인용정보
피인용 횟수 :
17인용 특허 :
98
초록▼
A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in
A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
대표청구항▼
What is claimed is: 1. A capillary structure for a heat transfer device comprising: a plurality of particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adja
What is claimed is: 1. A capillary structure for a heat transfer device comprising: a plurality of particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles wherein at least one vapor vent is defined through said capillary structure. 2. A capillary structure according to claim 1 wherein said plurality of particles comprise a first melting temperature and said brazing compound comprises a second melting temperature that is lower than said first melting temperature. 3. A capillary structure according to claim 1 wherein said plurality of particles are selected from the group consisting of carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, and beryllium oxide. 4. A capillary structure according to claim 1 wherein said plurality of particles comprise a shape selected from the group consisting of spherical, oblate spheroid, prolate spheroid, ellipsoid, polygonal, and filament. 5. A capillary structure according to claim 1 wherein said plurality of particles comprise at least one of copper spheres and oblate copper spheroids having a melting point of about one thousand eighty-three 째 C. 6. A capillary structure according to claim 1 wherein said brazing compound comprises six percent by weight of a finely divided copper/gold. 7. A capillary structure according to claim 1 wherein said brazing compound is present in the range from about two percent to about ten percent by weight. 8. A capillary structure according to claim 1 wherein said plurality of particles comprise copper powder comprising particles sized in a range from about twenty mesh to about two-hundred mesh. 9. A capillary structure for a heat transfer device comprising: a plurality of particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles wherein a plurality of vapor vents are defined through said capillary structure. 10. A capillary structure according to claim 9 wherein said vapor vents comprise a cross-sectional profile selected from the group consisting of cylindrical, conical, frustoconical, triangular, pyramidal, rectangular, rhomboidal, pentagonal, hexagonal, octagonal, polygonal and curved. 11. A heat pipe comprising: a hermetically sealed and partially evacuated enclosure, said enclosure comprising internal surfaces; a wick disposed on at least one of said internal surfaces and comprising a plurality of particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles wherein at least one vapor vent is defined through said capillary structure; and a two-phase fluid at least partially disposed within a portion of said wick. 12. A heat pipe according to claim 11 wherein said plurality of particles comprise a first melting temperature and said brazing compound comprises a second melting temperature that is lower than said first melting temperature. 13. A heat pipe according to claim 11 wherein said plurality of particles are selected from the group consisting of carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, and beryllium oxide. 14. A heat pipe according to claim 11 wherein said plurality of particles comprise a shape selected from the group consisting of spherical, oblate spheroid, prolate spheroid, polygonal, and filament. 15. A heat pipe according to claim 11 wherein said plurality of particles comprise at least one of copper spheres and oblate copper spheroids having a melting point of about 1083째 C. 16. A heat pipe according to claim 11 wherein said brazing compound is present in the range from about two percent to about ten percent by weight. 17. A heat pipe according to claim 11 wherein said plurality of particles comprise copper powder comprising particles size in a range from about twenty mesh to about two-hundred mesh. 18. A heat pipe comprising: a hermetically sealed and partially evacuated enclosure, said enclosure comprising internal surfaces; a wick disposed on at least one of said internal surfaces and comprising a plurality of particles joined together by a brazing compound comprising six percent by weight of a finely divided copper/gold brazing compound such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles wherein at least one vapor vent is defined through said capillary structure; and a two-phase fluid at least partially disposed within a portion of said wick. 19. A heat pipe comprising a sealed and partially evacuated tubular enclosure having an internal surface covered by a brazed wick comprising a plurality of copper particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles and including a plurality of vapor vents defined through said wick; and a working fluid disposed within said tubular enclosure. 20. A heat pipe comprising: a hermetically sealed and partially evacuated enclosure, said enclosure comprising internal surfaces; a wick disposed on at least one of said internal surfaces and comprising a plurality of aluminum and magnesium particles joined together by an aluminum/magnesium intermetallic alloy brazing compound such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles wherein at least one vapor vent is defined through said capillary structure; and a two-phase fluid at least partially disposed within a portion of said wick.
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