Cooling arrangement and method with selected surfaces configured to inhibit changes in boiling state
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28F-013/18
F28F-013/00
출원번호
US-0732217
(2003-12-11)
우선권정보
EP-02258581(2002-12-12)
발명자
/ 주소
Garner,Colin Peter
Holland,Adrian
출원인 / 주소
Caterpillar Inc.
대리인 / 주소
Finnegan, Henderson, Farabow, Garrett &
인용정보
피인용 횟수 :
4인용 특허 :
15
초록▼
Heat transfer in coolant circuits, as in an internal combustion engine for example, can be beneficially enhanced by maintaining the coolant in a nucleate boiling state, but undesirable transitions to a film boiling state are then possible. The disclosed coolant circuit has selected surface(s) that h
Heat transfer in coolant circuits, as in an internal combustion engine for example, can be beneficially enhanced by maintaining the coolant in a nucleate boiling state, but undesirable transitions to a film boiling state are then possible. The disclosed coolant circuit has selected surface(s) that have a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit. These surfaces are provided with a surface configuration, such as a matrix of nucleation cavities, which has a tendency to inhibit a change in boiling state. The surface configuration can be provided on the parent coolant circuit surface or on a surface of an insert positioned in the coolant circuit. Thus, transitions to film boiling can be effectively avoided at locations in the coolant circuit that are susceptible to such transitions.
대표청구항▼
What is claimed is: 1. A cooling arrangement utilizing a coolant having a boiling state, comprising: a coolant circuit having a high-heat surface therein to be cooled, said high-heat surface having a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit; wh
What is claimed is: 1. A cooling arrangement utilizing a coolant having a boiling state, comprising: a coolant circuit having a high-heat surface therein to be cooled, said high-heat surface having a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit; wherein at least a portion of the high-heat surface includes a surface configuration, said surface configuration including a plurality of cavities in said high-heat surface tending to inhibit departure from nucleate boiling in the coolant. 2. The cooling arrangement of claim 1 wherein said surface configuration is only on a portion of said high-heat surface. 3. The cooling arrangement of claim 1 wherein the coolant circuit includes at least one coolant passage configured to direct flow of coolant, and at least a portion of the high-heat surface includes an insert surface on an insert forming at least a portion of said passage, and wherein said surface configuration is on at least a portion of said insert surface. 4. The cooling arrangement of claim 3 wherein at least one surface in the coolant circuit is adjacent to said insert surface and is devoid of said surface configuration. 5. The cooling arrangement of claim 3 wherein said surface configuration is on substantially all of said insert surface. 6. The cooling arrangement of claim 1 wherein said surface configuration is configured to raise the critical heat flux associated with departure from nucleate boiling of coolant adjacent to said high-heat surface. 7. The cooling arrangement of claim 1 wherein said surface configuration decreases the superheat gradient of coolant adjacent to said high-heat surface. 8. The cooling arrangement of claim 1 wherein said surface configuration comprises a matrix of substantially uniform nucleation cavities. 9. The cooling arrangement of claim 8 wherein said high-heat surface is otherwise substantially free of cavities. 10. The cooling arrangement of claim 8 wherein said matrix comprises an equilateral triangle matrix in which each nucleation cavity is substantially equally spaced from adjacent nucleation cavities. 11. The cooling arrangement of claim 8 wherein said matrix comprises a rectangular matrix. 12. The cooling arrangement of claim 8 wherein adjacent nucleation cavities are spaced by a distance in the range of about 0.3 mm to about 4.2 mm. 13. The cooling arrangement of claim 8 wherein the nucleation cavities have a diameter in the range of about 10 μm to about 250 μ m. 14. The cooling arrangement of claim 8 wherein the ratio of a distance between adjacent nucleation cavities to the diameter of bubbles that depart the nucleation cavities is at least 1. 15. The cooling arrangement of claim 8 wherein adjacent nucleation cavities are spaced apart by a distance sufficiently large to prevent bubble interaction between adjacent nucleation cavities and sufficiently small to permit bubble transit between adjacent cavities. 16. The cooling arrangement of claim 3 wherein said insert includes non-ferrous metal. 17. The cooling arrangement of claim 3 wherein said insert surface comprises a substantially planar surface. 18. The cooling arrangement of claim 3 wherein said insert surface comprises a curved surface. 19. The cooling arrangement of claim 3 wherein said insert comprises a tubular member. 20. The cooling arrangement of claim 19 wherein said tubular member has a radially inwardly facing surface, and wherein said insert surface comprises said radially inwardly facing surface. 21. The cooling arrangement of claim 3 wherein said coolant circuit is formed at least in part by a cast body, and wherein said insert is configured to be mounted to said cast body after the body is cast. 22. The cooling arrangement of claim 3 wherein said coolant circuit is formed at least in part by a cast body, and wherein said insert is configured to be fastened to said cast body during the casting of said body. 23. The cooling arrangement of claim 1 wherein said coolant circuit has plural surfaces each having a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit, and wherein each of said plural surfaces is provided with a surface configuration including a plurality of cavities in said high-heat surface having a tendency to inhibit departure from nucleate boiling in the coolant. 24. A method for altering the boiling character of a coolant on a surface in a coolant circuit, comprising: identifying a high-heat surface in the coolant circuit having a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit; and providing a surface configuration including a plurality of cavities in said high-heat surface on at least a portion of said high-heat surface, said surface configuration tending to inhibit departure from nucleate boiling in the coolant. 25. The method of claim 24 further comprising: providing an insert having an insert surface adapted to form at least a portion of said coolant circuit surface; and positioning said insert in a passage in said coolant circuit. 26. The method of claim 25 further comprising not providing the surface configuration on coolant circuit surfaces adjacent to said insert surface. 27. The method of claim 24 wherein said surface configuration raises the critical heat flux associated with departure from nucleate boiling of coolant adjacent to said high-heat surface. 28. The method of claim 24 wherein said surface configuration decreases the superheat gradient of coolant adjacent to said high-heat surface. 29. The method of claim 24 wherein said step of providing said surface configuration includes forming a matrix of substantially uniform nucleation cavities in said surface. 30. The method of claim 29 further wherein said step of providing said surface configuration further includes processing the surface so that it is substantially free from cavities other than said substantially uniform nucleation cavities. 31. The method of claim 29 wherein said matrix comprises an equilateral triangle matrix. 32. The method of claim 29 wherein said matrix comprises rectangular matrix. 33. The method of claim 29 wherein adjacent nucleation cavities are spaced by a distance in the range of about 0.3 mm to about 4. 2 mm. 34. The method of claim 29 wherein the nucleation cavities have a diameter in the range of about 10 μm to about 250 μm. 35. The method of claim 29 wherein a ratio of the distance between adjacent nucleation cavities to the diameter of bubbles that depart the nucleation cavities is at least 1. 36. The method of claim 29 wherein adjacent nucleation cavities are spaced apart by a distance sufficiently large to prevent bubble interaction between adjacent nucleation cavities and sufficiently small to permit bubble transit between adjacent cavities. 37. The method of claim 25 further comprising: casting a body that defines at least a portion of said coolant circuit; and securing said insert to said cast body. 38. The method of claim 25 further comprising: positioning said insert against a surface of a mold adapted for casting a body that defines at least a portion of said coolant circuit; and casting said body so that said insert is secured in position in the coolant circuit defined by the cast body. 39. A cooling arrangement utilizing a coolant having a boiling state, comprising: a coolant circuit having a circuit surface therein to be cooled, the circuit surface comprising a first surface and a second surface, the second surface being disposed adjacent to the first surface, said first surface having a tendency to experience high heat flux in comparison to the second surface, wherein the first surface includes a surface configuration including a plurality of cavities in said first surface configured to inhibit departure from nucleate boiling in the coolant. 40. The cooling arrangement of claim 39 further comprising at least one coolant passage configured to direct flow of coolant, and an insert in the coolant passage, the insert having an insert surface forming at least a part of the passage surface, wherein the insert surface at least partially comprises the first surface and at least part of the surface configuration is on the insert surface. 41. The cooling arrangement of claim 40 wherein the second surface is adjacent to the insert surface and is devoid of said surface configuration. 42. The cooling arrangement of claim 40 wherein said insert surface comprises at least one of a substantially planar surface, a curved surface, and a tubular member. 43. The cooling arrangement of claim 39 wherein said surface configuration is configured to raise the critical heat flux associated with departure from nucleate boiling of coolant adjacent to the first surface, and decrease the superheat gradient of coolant adjacent to the first surface. 44. The cooling arrangement of claim 39 wherein said surface configuration comprises a matrix of substantially uniform nucleation cavities. 45. The cooling arrangement of claim 40 wherein said coolant circuit is formed at least in part by a cast body, and wherein said insert is configured to be mounted to said cast body after the body is cast. 46. The cooling arrangement of claim 40 wherein said coolant circuit is formed at least in part by a cast body, and wherein said insert is configured to be fastened to said cast body during the casting of said body. 47. The cooling arrangement of claim 1, wherein the cooling circuit includes at least one coolant passage configured to direct flow of the coolant. 48. The cooling arrangement of claim 47, wherein the high-heat surface is within the at least one coolant passage. 49. The method of claim 24, including, wherein the cooling circuit includes at least one coolant passage configured to direct flow of the coolant. 50. The method of claim 49, wherein identifying the high-heat surface includes identifying the high-heat surface within the at least one coolant passage. 51. The cooling arrangement of claim 39, wherein the cooling circuit includes at least one coolant passage configured to direct flow of the coolant. 52. The cooling arrangement of claim 51, wherein the first surface is within the at least one coolant passage. 53. An internal combustion engine having coolant passages that form a part of an engine coolant circuit and that utilize a coolant having a boiling state, comprising: a cylinder head having an intake port and an exhaust port, the exhaust port being configured to direct gases from a combustion chamber, the cylinder head also including a valve bridge disposed between the intake port and the exhaust port; and a coolant circuit having at least one coolant passage disposed through the cylinder head, the at least one coolant passage having surface walls configured to direct the coolant in the coolant circuit to provide cooling to the cylinder head, and the at least one coolant passage having a high-heat surface having a tendency to experience high heat flux in comparison to adjacent surfaces in the coolant circuit; wherein at least a portion of the surface walls of the at least one coolant passage include a surface configuration including a plurality of cavities in said high-heat surface, said surface configuration tending to inhibit departure from nucleate boiling in the coolant. 54. The internal combustion engine of claim 53, wherein the at least one coolant passage extends through the valve bridge, and wherein at least a portion of the coolant passage surface extending through the valve bridge includes the surface configuration that tends to inhibit a change in the boiling state of the coolant. 55. The internal combustion engine of claim 53, wherein the at least one coolant passage includes at least one insert disposed therein, the insert forming a part of the surface walls, at least a portion of the insert including the surface configuration that tends to inhibit a change in the boiling state of the coolant.
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이 특허에 인용된 특허 (15)
Scarselletta Louis (Lockport NY), Actively pressurized engine cooling system.
Chu Richard C. (Poughkeepsie NY) Moran Kevin P. (Wappingers Falls NY), Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant.
Ernest Robert P. (Dearborn Heights MI) Jones Charles M. (Detroit MI) Ounsted Edwin J. (Dearborn MI) Wu Hai (Northville MI), Water cooling system -Wankel engine.
Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate processing with rapid temperature gradient control.
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