Method and structure for cooling a dual chip module with one high power chip
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/34
H01L-023/40
H05K-007/20
출원번호
US-0672494
(2003-09-26)
발명자
/ 주소
Arvelo,Amilcar R.
Sikka,Kamal Kumar
Toy,Hilton T.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Gibb I.P. Law Firm, LLC
인용정보
피인용 횟수 :
27인용 특허 :
9
초록▼
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smalles
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.
대표청구항▼
What is claimed is: 1. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising: a plurality of heat spreaders having different thicknesses, wherein the lower side of each of said heat spreaders is connected to the top of a
What is claimed is: 1. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising: a plurality of heat spreaders having different thicknesses, wherein the lower side of each of said heat spreaders is connected to the top of a corresponding one of said integrated circuit chips; and a heat dissipating structure having a flat base connected to the upper sides of said heat spreaders through a thermally conductive material, wherein said thermally conductive material is positioned in gaps between the upper sides of said heat spreaders and said flat base of said heat dissipating structure, and wherein the smallest of said gaps exists between the top of the thickest of said heat spreaders that is connected to the integrated circuit chip that produces the most thermal energy, relative to the other integrated circuit chips, and said flat base of said heat dissipating structure. 2. The structure in claim 1, wherein said heat spreaders have different coefficients of thermal conductivity. 3. The structure in claim 1, further comprising a thermal adhesive connecting said heat spreaders to said integrated circuit chips. 4. The structure in claim 1, wherein said thermally conductive material comprises a plurality of thermally conductive materials having different coefficients of thermal conductivity. 5. The structure in claim 1, wherein said thermally conductive material comprises one of a thermal grease and a phase change material. 6. The structure in claim 1, wherein said integrated circuit chips comprise at least one higher power chip and at least one lower power chip, wherein, during operation, said higher power chip generates more thermal energy than said lower power chip. 7. The structure in claim 6, wherein said smallest of said gaps allows optimum cooling of said at least one higher power chip. 8. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising: a plurality of heat spreaders, having different thicknesses, wherein the lower side of each of said heat spreaders is connected to the top of a corresponding integrated circuit chip, wherein a first chip of said multiple integrated circuit chips produces the most thermal energy relative to others of said multiple integrated circuit chips, and wherein the thickest of said heat spreaders is connected to said first chip so as to optimize cooling of said integrated circuit structure; and a heat dissipating structure having a flat base connected to the upper sides of said heat spreaders through a thermally conductive material. 9. The structure in claim 8, wherein said heat spreaders have different coefficients of thermal conductivity. 10. The structure in claim 8, further comprising a thermal adhesive connecting said heat spreaders to said integrated circuit chips. 11. The structure in claim 8, wherein said thermally conductive material comprises a plurality of thermally conductive materials having different coefficients of thermal conductivity. 12. The structure in claim 8, wherein said thermally conductive material comprises one of a thermal grease and a phase change material. 13. The structure in claim 8, wherein said integrated circuit chips comprise at least one higher power chip and at least one lower power chip, wherein, during operation, said higher power chip is said one of said multiple integrated chips that produces the most thermal energy. 14. The structure in claim 8, wherein said thermally conductive material is positioned in gaps between the upper sides of said heat spreaders and said flat base of said heat dissipating structure, and wherein the smallest of said gaps exists between the top of said thickest heat spreaders and said flat base. 15. A cooling structure for an integrated circuit structure having multiple integrated circuit chips, said cooling structure comprising: a plurality of beat spreaders, having different thicknesses; wherein the lower side of each of said heat spreaders is connected to the top of a corresponding integrated circuit chip, wherein a first chip of said multiple integrated circuit chips produces the most thermal energy relative to others of said multiple integrated circuit chips, and wherein the thickest of said heat spreaders is connected to said first chip so as to optimize cooling of said integrated circuit structure; and a heat dissipating structure having a flat base connected to the upper sides of said heat spreaders through a thermal grease. 16. The structure in claim 15, wherein said heat spreaders have different coefficients of thermal conductivity. 17. The structure in claim 15, further comprising a thermal adhesive connecting said heat spreaders to said integrated circuit chips. 18. The structure in claim 15, wherein said integrated circuit chips comprise at least one higher power chip and at least one lower power chip, wherein, during operation, said higher power chip is said one of said multiple integrated chips that produces the most thermal energy. 19. The structure in claim 15, wherein said thermal grease is positioned in gaps between the upper sides of said heat spreaders and said flat base of said heat dissipating structure, and wherein the smallest of said gaps exists between the top of said thickest heat spreader and said flat base.
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이 특허에 인용된 특허 (9)
Anderson ; Jr. Herbert R. (Patterson NY) Booth Richard B. (Wappingers Falls NY) David Lawrence D. (Wappingers Falls NY) Neisser Mark O. (Hopewell Junction NY) Sachdev Harbans S. (Wappingers Falls NY), Compliant thermally conductive compound.
Edwards David Linn ; Courtney Mark Gerard ; Fahey Albert Joseph ; Hopper Gregory Scott ; Iruvanti Sushumna ; Jones Charles Frederick ; Messina Gaetano Paolo ; Sherif Raed A., Method for cooling of chips using blind holes with customized depth.
David L. Edwards ; Glenn G. Daves ; Shaji Farooq ; Sushumna Iruvanti ; Frank L. Pompeo, Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.
Edwards David L. ; Daves Glenn G. ; Farooq Shaji ; Iruvanti Sushumna ; Pompeo Frank L., Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.
Hill,Richard; Strader,Jason L., Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink.
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