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[미국특허] Low-current pogo probe card 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/02
출원번호 US-0948717 (2004-09-22)
발명자 / 주소
  • Tervo,Paul A.
  • Cowan,Clarence E.
출원인 / 주소
  • Cascade Microtech, Inc.
대리인 / 주소
    Chernoff Vilhauer McClung &
인용정보 피인용 횟수 : 2  인용 특허 : 262

초록 ▼

A probe card includes a plurality of probes, where each probe is supported by the probe card. A plurality of landings are on the top of the probe card. Each of the landings is electrically interconnected with a coaxial cable that is also associated with one of the probes. A plurality of trenches def

대표청구항 ▼

The invention claimed is: 1. A probe card comprising: (a) a plurality of probes; (b) each of said probes supported by said probe card; (c) a plurality of landings on the top of said probe card, (d) each of said landings electrically interconnected with a respective coaxial cable, which is also ass

이 특허에 인용된 특허 (262) 인용/피인용 타임라인 분석

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  145. Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.
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  146. Ubbens Henricus D. U. (Eindhoven NLX) Langeveld Peer (Eindhoven NLX), Method of interconnecting conductors of different layers of a multilayer printed circuit board.
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  147. Chen Jimmy Kuo-Wei ; Eldridge Benjamin N. ; Dozier Thomas H. ; Yeh Junjye J. ; Herman Gayle J., Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive.
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  148. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Method of making and using lithographic contact springs.
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  149. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making contact tip structures.
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  150. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice H. ; Shih Da-Yuan ; Walker George Frederick, Method of making high density integral test probe.
    상세보기
  151. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Method of making lithographic contact springs.
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  152. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of making microelectronic contact structures.
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  153. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
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  154. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.
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  155. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.
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  156. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Lotfizadeh, Poya; Tseng, Chih-Chiang, Method of manufacturing a probe card.
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  157. Chance Randal W. (Boise ID), Method of manufacturing edge connected semiconductor die.
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  158. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
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  159. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y ; Mathieu Gaetan L., Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method.
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  160. Khandros Igor Y., Method of mounting free-standing resilient electrical contact structures to electronic components.
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  161. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
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  162. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
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  163. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.
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  164. Eldridge Benjamin N. ; Mathieu Gaetan L., Method of severing bond wires and forming balls at their ends.
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  165. Khandros Igor Y. ; Mathieu Gaetan L., Method of stacking electronic components.
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  166. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.
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  167. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of testing semiconductor.
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  168. Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.
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  169. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods.
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  170. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
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  171. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
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  172. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
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  173. Eldridge, Benjamin N.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V., Microelectronic spring contact elements.
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  174. Grube, Gary W.; Mathieu, Gaetan L., Microelectronic spring contact repair.
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  175. Grube, Gary W., Microelectronic spring with additional protruding member.
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  176. Gleason K. Reed (Portland OR) Jones Keith E. (Beaverton OR) Strid Eric W. (Portland OR), Microwave wafer probe having replaceable probe tip.
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  177. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe.
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  178. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Mounting spring elements on semiconductor devices.
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  179. Miller, Charles A., Multiple die interconnect system.
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  180. Reid Lee R. (Plano TX) Ratliff Charles R. (Richardson TX), Multiprobe test system and method of using same.
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  181. Yu, Hyun-Sik; Choi, Ji-Man; Shin, In-Dae, Needle fixture of a probe card in semiconductor inspection equipment and needle fixing method thereof.
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  182. Henson, Roy, PC board having clustered blind vias.
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  183. Richard S. Roy ; Charles A. Miller, Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons.
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  184. Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Partially-overcoated elongate contact structures.
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  185. Ogura Mitsuhiro (Kunitachi JPX), Personality board.
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  186. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Planarizer for a semiconductor contactor.
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  187. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Pluggable chip scale package.
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  188. Eldridge, Benjamin N.; Miller, Charles A., Predictive, adaptive power supply for an integrated circuit under test.
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  189. Rath Dale R. (Gales Creek OR), Pressure control apparatus for use in an integrated circuit testing station.
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  190. Sharif, Adam K., Probe card and probe needle for high frequency testing.
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  191. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly.
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  192. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
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  193. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.
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  194. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
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  195. Sporck, A. Nicholas; Shinde, Makarand S., Probe card with coplanar daughter card.
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  196. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card with plural probe tips on a unitary flexible tongue.
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  197. Tarzwell John W. (Phoenix AZ), Probe device for integrated circuit wafers.
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  198. Ikeda Towl (Kofu JPX), Probe device having micro-strip line structure.
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  199. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Probe for testing a device under test.
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  200. Tracy ; John M., Probe station.
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  201. Schwindt Randy (Portland OR), Probe station having conductive coating added to thermal chuck insulator.
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  202. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Yun-Hsin Liao ; Daniel Peter Morris ; Da-Yuan Shih, Probe structure having a plurality of discrete insulated probe tips.
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  203. Boll Gregory George ; Boll Harry Joseph, Probe tip structure.
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  204. Bessho Yoshiyuki,JPX ; Akama Hideo,JPX ; Sone Norio,JPX, Prober interface card for shortening the settling time.
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  205. Evans, Arthur, Probes for fixed point probe cards.
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  206. Stevens, Mac, Process and apparatus for adjusting traces.
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  207. Stevens, Mac; Parent, Yves, Process and apparatus for finding paths through a routing space.
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  208. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastomeric polymer.
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  209. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastometric polymer.
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  210. Hedrick Jeffrey Curtis (Park Ridge NJ) Hedrick James Lupton (Pleasanton CA) Liao Yun-Hsin (W. Nyack NY) Miller Robert Dennis (San Jose CA) Shih Da-Yuan (Poughkeepsie NY), Process for making a foamed polymer.
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  211. Ayala-Esquilin Juan (San Jose CA) Beaman Brian S. (Hyde Park NY) Haring Rudolf A. (Cortlandt Manor NY) Hedrick James L. (Pleasanton CA) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Process of making pinless connector.
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  212. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Process of mounting spring contacts to semiconductor devices.
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  213. Cho Frederick Y. (Scottsdale AZ) Adamo Michael D. (Wilbraham MA) Leeson David E. (Tempe AZ), Radio frequency probing apparatus for surface acoustic wave devices.
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  214. Igor Y. Khandros ; Gaetan L. Mathieu, Raised contact structures (solder columns).
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  215. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Resilient contact structures for interconnecting electronic devices.
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  216. Khandros Igor Y. ; Mathieu Gaetar L., Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components.
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  217. Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.
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  218. Masuoka, Sadaaki, Semiconductor device including gate insulation films having different thicknesses.
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  219. Hayama Hisao,JPX ; Goto Toshio,JPX ; Kanno Yukio,JPX, Semiconductor device testing apparatus.
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  220. Khandros Igor Y. ; Mathieu Gaetar L., Semiconductor devices with integral contact structures.
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  221. Benjamin N. Eldridge, Semiconductor fuse covering.
    상세보기
  222. Knauer William ; Bennett Robert, Semiconductor probe card for low current measurements.
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  223. Tajima Kenji (Kanagawa JPX) Takahashi Motoaki (Kanagawa JPX) Watanabe Hideo (Kanagawa JPX) Shoji Takashi (Kanagawa JPX) Arai Noboru (Kanagawa JPX), Sheet film package and device for loading sheet films.
    상세보기
  224. Edward J. Hager ; Rondal K. Harmon, Jr., Single tip Kelvin probe.
    상세보기
  225. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.
    상세보기
  226. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.
    상세보기
  227. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.
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  228. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pederson, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.
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  229. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
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  230. Drake Robert E. (Somers NY) Faris Sadeg M. (Pleasantville NY) Patt Roy M. (Walden NY) Shen Zhi-Yuan (Ossining NY), Soft probe for providing high speed on-wafer connections to a circuit.
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  231. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.
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  232. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Special contact points for accessing internal circuitry of an integrated circuit.
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  233. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
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  234. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
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  235. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
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  236. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.
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  237. Hemmie Dale L. (Burlington IA) Evans Robert M. (Hightstown NJ), Stacked dual dipole MMDS feed.
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  238. Eldridge, Benjamin N., Stacked semiconductor device assembly with microelectronic spring contacts.
    상세보기
  239. Khandros Igor Y. ; Pedersen David V., Stacking semiconductor devices, particularly memory chips.
    상세보기
  240. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Structures and processes to create a desired probetip contact geometry on a wafer test probe.
    상세보기
  241. Miller, Charles A., System for calibrating timing of an integrated circuit wafer tester.
    상세보기
  242. Long, John, System for measuring signal path resistance for an integrated circuit tester interconnect structure.
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  243. Nolan Charles C. (Sunnyvale CA) Sahr Stuart (Wickenburg AZ), Temperature conditioner for tests of unpackaged semiconductors.
    상세보기
  244. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.
    상세보기
  245. Eldridge, Benjamin N.; Wenzel, Stuart W., Test head assembly for electronic components with plurality of contoured microelectronic spring contacts.
    상세보기
  246. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
    상세보기
  247. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.
    상세보기
  248. Miller, Charles A., Test signal distribution system for IC tester.
    상세보기
  249. Miller, Charles A., Tester channel to multiple IC terminals.
    상세보기
  250. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
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  251. Matsunaga Kouji,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Taura Toru,JPX ; Nikaidou Masahiko,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX, Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable.
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  252. McTigue, Michael Thomas, Voltage probe.
    상세보기
  253. Akagawa Masayuki (Kawaguchi JPX), Wafer inspecting apparatus.
    상세보기
  254. Lockwood Larry R. (McMinnville OR) Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR), Wafer probe.
    상세보기
  255. Sang Emmanuel (Portland OR) Estabrook Gary L. (Vancouver WA), Wafer probe head.
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  256. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR), Wafer probe station for low-current measurements.
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  257. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR) Andrews Peter D. (Tigard OR), Wafer probe station having integrated guarding, Kelvin connection and shielding systems.
    상세보기
  258. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
    상세보기
  259. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
    상세보기
  260. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
    상세보기
  261. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Wafer-level test and burn-in, and semiconductor process.
    상세보기
  262. Martin, John T., Waveguide with adjustable backshort.
    상세보기

이 특허를 인용한 특허 (2) 인용/피인용 타임라인 분석

  1. Tang,George, Testing high frequency signals on a trace.
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  2. Knauer, William, Ultra-low current printed circuit board.
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