$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatuses and method for maskless mesoscale material deposition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05C-011/06
  • B05C-011/02
출원번호 US-0346935 (2003-01-17)
발명자 / 주소
  • Renn,Michael J.
  • King,Bruce H.
  • Essien,Marcelino
  • Hunter,Lemna J.
출원인 / 주소
  • Optomec Design Company
대리인 / 주소
    Peasock Myers, P.C.
인용정보 피인용 횟수 : 139  인용 특허 : 82

초록

Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds n

대표청구항

What is claimed is: 1. An apparatus for maskless mesoscale material deposition of liquids or liquid particle suspensions in patterns on a target, said apparatus comprising: a first module for and providing aerosolization of a liquid selected from one or more of molecular precursors and particle sus

이 특허에 인용된 특허 (82)

  1. John E. Brockmann ; John R. Torczynski ; Ronald C. Dykhuizen ; Richard A. Neiser ; Mark F. Smith, Aerodynamic beam generator for large particles.
  2. Thaler Stephen L., Apparatus for coating a substrate.
  3. Biernaux Alain (Mons BEX) Laude Lucien (Hautmont FRX), Apparatus for pinpoint laser-assisted electroplating of metals on solid substrates.
  4. Livsey Norman B. (Colne GB2), Application of metallic coatings to metallic substrates.
  5. Fabre Christian,FRX, Autonomous device for limiting the rate of flow of a fluid through a pipe, and fuel circuit for an aircraft comprising such a device.
  6. Whitney Eric J. (Cincinnati OH) Pratt Vanon D. (Hamilton OH) Scheidt Wilbur D. (Cincinnati OH) Young William R. (Cincinnati OH), Axial flow laser plasma spraying.
  7. Eric Peeters ; Jaan Noolandi ; Raj B. Apte ; Philip D. Floyd ; Jonathan A. Small ; Gregory J. Kovacs CA; Meng H. Lean ; Armin R. Volkel ; Steven B. Bolte ; An-Chang Shi CA; Frederick J. End, Ballistic aerosol marking apparatus for treating a substrate.
  8. Philip D. Floyd ; Frederick J. Endicott ; Gregory B. Anderson ; Jurgen Daniel ; Eric Peeters, Ballistic aerosol marking apparatus with non-wetting coating.
  9. Philip D. Floyd ; Tuan Anh Vo ; Kaiser H. Wong ; Gregory B. Anderson ; Eric Peeters ; Jaan Noolandi CA; Meng H. Lean ; Armin R. Volkel CA; John E. Northrup ; Jurgen Daniel ; G. A. Neville C, Ballistic aerosol marking apparatus with stacked electrode structure.
  10. Eric Peeters ; Jaan Noolandi ; Raj B. Apte ; Philip D. Floyd ; Jonathan A. Small ; Gregory J. Kovacs CA; Meng H. Lean ; Armin R. Volkel ; Steven B. Bolte ; An-Chang Shi CA; Frederick J. End, Cartridge for use in a ballistic aerosol marking apparatus.
  11. Wang Liang, Ceramic coatings synthesized by chemical reactions energized by laser plasmas.
  12. Aleshin Stephen (Cincinnati OH), Coaxial single point powder feed nozzle.
  13. Ashkin ; Arthur ; Dziedzic ; Joseph Martin, Damping of optically levitated particles by feedback and beam shaping.
  14. Sharma Sunity ; Annavajjula Durga ; Bhasin Kuldip,INX ; Narang Subhash ; Nigam Asutosh, Deposition of substances on a surface.
  15. Hayes Donald J. ; Boldman Michael T. ; Shah Virang G., Direct solder bumping of hard to solder substrate.
  16. Mir ; Jose Manuel ; Varner ; Jerry Reubon, Electrographic mist development apparatus and method.
  17. Marchitto, Kevin S.; Flock, Stephen T., Electromagnetic energy driven separation methods.
  18. Pilloff Herschel S., Evanescent atom guiding in metal-coated hollow-core optical fibers.
  19. Leasure John D. (Saluda VA), Gun silencer.
  20. Marple Virgil A. (Maple Plain MN) Liu Benjamin Y. H. (North Oaks MN), High volume virtual impactor.
  21. Liu Yagang, Highly sensitive bead-based multi-analyte assay system using optical tweezers.
  22. Haaland Peter D. (Centerville OH), Hybrid pulsed valve for thin film coating and method.
  23. Karlinski Haggai,ILX, Ink jet print head with ink supply through porous medium.
  24. Horike Masanori (Tokyo JPX) Jinnai Koichiro (Tokyo JPX) Iwasaki Kyuhachiro (Tokyo JPX) Kodama Yutaka (Tokyo JPX), Ink jet printing apparatus.
  25. Stevens Wayne R. (Downey CA), Ink vapor aerosol pen for pen plotters.
  26. Takeshi Okazaki JP; Yutaka Koizumi JP; Kiyomi Aono JP; Tsutomu Abe JP; Kouichi Omata JP; Hiroki Tajima JP, Ink-jet print head and production method of ink-jet print head.
  27. Drumheller Carl E. (Pittsford NY), Inking system for producing circuit patterns.
  28. Wong Kaiser H. ; Vo Tuan Anh, Inorganic overcoat for particulate transport electrode grid.
  29. Jaan Noolandi ; An-Chang Shi CA; T. Brian McAneney CA, Kinetic fusing of a marking material.
  30. Benton Richard Glasscock (1300 St. Joseph Prof. Bldg. Houston TX 77002), Laser beam transport, and method.
  31. Castro Anthony J. (San Francisco CA) Van Duyne Richard P. (Wilmette IL) Sheng King C. (Troy NY) Bianchini Robert J. (Lakeland FL) Parr William J. (Hopewell Junction NY) Franklin Ralph (Danbury CT) Na, Laser direct writing.
  32. Schaefer Robert J. (Springfield VA) Ayers Jack D. (Oakton VA), Laser spraying.
  33. Matsuda Jun (Takamatsu JPX) Utsumi Akihiro (Kagawa JPX) Katsumura Munehide (Takamatsu JPX) Yoneda Masafumi (Takamatsu JPX) Yano Tetsuo (Takamatsu JPX), Laser spraying process.
  34. Gelchinski Mordechai H. (Bedford Hills NY) Romankiw Lubomyr T. (Briarcliff Manor NY) Vigliotti Donald R. (Yorktown Heights NY) Von Gutfeld Robert J. (New York NY), Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method.
  35. Morita Takeshi (Amagasaki JPX) Fujita Minoru (Amagasaki JPX) Sunamoto Masatoshi (Amagasaki JPX) Hayashi Osamu (Amagasaki JPX) Hoshinouchi Susumu (Amagasaki JPX), Local laser plating apparatus.
  36. Okada Yoshinori (Kanagawa JPX) Higuchi Shigemitsu (Kanagawa JPX) Takahashi Hiroaki (Kanagawa JPX) Yunde Yasufumi (Kanagawa JPX) Furuhata Takashi (Kanagawa JPX), Magnetic recording/reproducing apparatus utilizing phase comparator.
  37. Thaler Stephen L. (Independent City MO), Method and apparatus for coating a substrate.
  38. Ranalli Ronald J. (Caledonia MI), Method and apparatus for laser coating.
  39. Solayappan Narayan ; Grant Robert W. ; McMillan Larry D. ; Paz de Araujo Carlos A., Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size.
  40. Nishimura Matsuomi (Ohmiya JPX) Isaka Kazuo (Tokyo JPX) Okamoto Tadashi (Yokohama JPX) Tanaka Kazumi (Yokohama JPX) Onishi Toshikazu (Tokyo JPX) Miyazaki Takeshi (Ebina JPX) Takayama Hidehito (Chigas, Method and apparatus for particle manipulation, and measuring apparatus utilizing the same.
  41. Hochberg Frederick (Yorktown Heights NY), Method and apparatus for recording information on a recording medium.
  42. Hochberg Frederick (Yorktown Heights NY) Reisman Arnold (Yorktown Heights NY), Method and apparatus for recording information on a recording surface through the use of mists.
  43. Choh Richard T. ; Fagan John R. ; Forcucci Stephen J., Method and apparatus for regulating the fluid flow rate to and preventing over-pressurization of a balloon catheter.
  44. Andeen Gerry B. (Pandan Valley CA SGX) Swidler Ronald (Palo Alto CA) Nishikawa Hisashi (Shizuoka JPX) Matsumoto Yasuo (Shizuoka JPX) Makino Ayumu (Shizuoka JPX), Method and apparatus for vapor jet printing.
  45. Brown Clyde O. (Newington CT) Breinan Edward M. (Glastonbury CT) Kear Bernard H. (Madison CT), Method for fabricating articles by sequential layer deposition.
  46. Eric Peeters ; Jaan Noolandi ; Raj B. Apte ; Philip D. Floyd ; Jonathan A. Small ; Gregory J. Kovacs CA; Meng H. Lean ; Armin R. Volkel ; Steven B. Bolte ; An-Chang Shi CA; Frederick J. End, Method for marking with a liquid material using a ballistic aerosol marking apparatus.
  47. Uchiyama Futoshi (Kashiwa JPX) Tsukamoto Koichi (Tokyo JPX) Ohno Yoshihiro (Tokyo JPX) Kaga Yasuo (Tsukuba JPX) Momma Akihiko (Tsukuba JPX), Method for producing object by laser spraying and apparatus for conducting the method.
  48. Periasamy Ravindran (Cary NC), Method for protecting a substrate surface from contamination using the photophoretic effect.
  49. Funkhouser Merle E. (North Palm Beach FL) Dalzell ; Jr. William J. (Jupiter FL), Method for the application of coatings of oxide dispersion strengthened metals by laser powder injection.
  50. Kubota Toshio (Sayama JPX) Toyama Niichi (Sayama JPX) Arai Hiroshi (Sayama JPX) Ishibashi Ichirou (Sayama JPX) Ono Yukihito (Sayama JPX), Method of and apparatus for electrostatically spray-coating work with paint.
  51. Turchan Manuel C. (Northville MI) Mistry Pravin (Shelby Township MI), Method of applying, sculpting, and texturing a coating on a substrate and for forming a heteroepitaxial coating on a sur.
  52. Haaland Peter D., Method of coating a thin film on a substrate.
  53. Gartner Georg (Aachen DEX) Lydtin Hans (Stolberg DEX), Method of manufacturing ultrafine particles and their application.
  54. Eric Peeters ; Jaan Noolandi ; Raj B. Apte ; Philip D. Floyd ; Jonathan A. Small ; Gregory J. Kovacs CA; Meng H. Lean ; Armin R. Volkel ; Steven B. Bolte ; An-Chang Shi CA; Frederick J. End, Method of marking a substrate employing a ballistic aerosol marking apparatus.
  55. Haggai Karlinski IL, Method of producing an ink jet print head.
  56. Sharma, Sunity; Narang, Subhash; Bhasin, Kuldip; Sharma, Madan Lal, Method of producing and depositing a metal film.
  57. Hochberg Frederick (Yorktown Heights NY) Pennebaker William B. (Carmel NY) Pennington Keith S. (Somers NY), Micromist jet printer.
  58. Yule Thomas J. (West Chigago IL), Monitor of the concentration of particles of dense radioactive materials in a stream of air.
  59. Wong Kaiser H., Multi-layer organic overcoat for particulate transport electrode grid.
  60. Prentice Thomas C. ; Prescott Brian P. ; Purcell Thomas ; Helm Stephen S. ; Martin Donald J. ; Brown Kevin ; Donnelly James P., Multiple head dispensing system and method.
  61. Ashkin Arthur (Rumson NJ) Dziedzic Joseph M. (Clark NJ), Non-destructive optical trap for biological particles and method of doing same.
  62. Hochberg ; deceased Frederick (LATE OF Yorktown NY BY Lee Hochberg ; administratrix) Pennington Keith Samuel (Somers NY), Non-impact printing system.
  63. Finer Jeffrey (Palo Alto CA) Simmons Robert (Middlesex CA GBX) Spudich James A. (Palo Alto CA) Chu Steven (Stanford CA), Optical trap system and method.
  64. Hidaka Takehiko (Ibaraki JPX) Morikawa Takitaro (Sayama JPX) Shimada Junichi (Ibaraki JPX) Kumata Ken (Ibaraki JPX), Optical waveguide for middle infrared band.
  65. Wong Kaiser H. ; Vo Tuan Anh ; Hsieh Bing R., Organic overcoat for electrode grid.
  66. Renn, Michael J., Particle guidance system.
  67. Wilson Steven D. (P.O. Box 415 Soquel CA 95073) Clarke William L. (2221 Aralia St. Newport Beach CA 92660), Particle trap.
  68. Vo Tuan Anh ; Hays Dan A. ; Peeters Eric ; Elhatem Abdul M. ; Wong Kaiser H. ; Kubby Joel A. ; Noolandi Jaan, Particulate marking material transport apparatus utilizing traveling electrostatic waves.
  69. Floyd Philip D. ; Biegelsen David K. ; Peeters Eric ; Endicott Frederick J. ; Veregin Richard P. N.,CAX ; Anderson Gregory B. ; Moffat Karen A.,CAX ; McDougall Maria N. V,CAX ; Noolandi Jaan,CAX ; Vo, Particulate source, circulation, and valving system for ballistic aerosol marking.
  70. Kindler Helmut,DEX ; Huonker Martin,DEX, Powder coating apparatus.
  71. Lagain Georges L. (Combs la Ville FRX), Powder supply device for the formation of coatings by laser beam treatment.
  72. Miller W. Doyle ; Keicher David M. ; Essien Marcelino, Precision spray processes for direct write electronic components.
  73. Peeters Eric ; Noolandi Jaan ; Apte Raj B. ; Floyd Philip D. ; Lean Meng H. ; Volkel Armin R., Print head for use in a ballistic aerosol marking apparatus.
  74. Ayers Scott D. ; Hayes Donald J. ; Boldman Michael T. ; Wallace David B., Printhead for liquid metals and method of use.
  75. Richart Douglas S., Process and apparatus for the preparation of fine powders.
  76. Loewenstein Lee M. (Plano TX) Davis Cecil J. (Greenville TX), Remote plasma generation process using a two-stage showerhead.
  77. Engelsberg Audrey C. ; Parker William P., Removal of material by polarized radiation.
  78. Hochberg Frederick (Yorktown Heights NY) Pennington Keith S. (Somers NY), Selective wetting using a micromist of particles.
  79. Scheer Bradley W. (San Jose CA) Konicek Paul A. (Santa Clara CA), System and method for accurately depositing particles on a surface.
  80. Wright Robert J. ; Dalzell ; Jr. William J. ; Himich ; Jr. George ; O'Donoghue Raymond M., Thermal spray coating method and apparatus.
  81. Mitchell Joan LaVerne (Peekskill NY) Pennington Keith Samuel (Somers NY) Hochberg ; deceased Frederick (LATE OF Yorktown Heights NY BY Lee Hochberg ; administratrix), Ultrasonic transfer printing with multi-copy, color and low audible noise capability.
  82. Ogren John A. (Hagersten SEX) Heinzenberg Jost (Sollentuna WA SEX) Charlson Robert L. (Seattle WA), Virtual impactor.

이 특허를 인용한 특허 (139)

  1. Buller, Benyamin; Lappas, Tasso; Korepanov, Sergey; Lappen, Alan Rick, Accurate three-dimensional printing.
  2. Buller, Benyamin; Lappas, Tasso; Lappen, Alan Rick, Accurate three-dimensional printing.
  3. Levin, Evgeni; Lappas, Tasso; Buller, Benyamin; Lappen, Alan Rick, Accurate three-dimensional printing.
  4. Buller, Benyamin; Lappas, Tasso; Levin, Evgeni, Adept three-dimensional printing.
  5. Buller, Benyamin; Milshtein, Erel, Adept three-dimensional printing.
  6. Renn, Michael J.; Essien, Marcelino; King, Bruce H.; Paulsen, Jason A., Aerodynamic jetting of aerosolized fluids for fabrication of passive structures.
  7. Renn, Michael J.; King, Bruce H.; Paulsen, Jason A., Aerodynamic jetting of blended aerosolized materials.
  8. Chappa, Ralph A.; Bach, Andrew G.; MacGregor, Mark, Apparatus and methods for coating medical devices.
  9. Chappa, Ralph A.; Bach, Andrew G.; MacGregor, Mark, Apparatus and methods for coating medical devices.
  10. Chappa, Ralph A.; Bach, Andrew G.; MacGregor, Mark, Apparatus and methods for coating medical devices.
  11. Chappa, Ralph A.; Bach, Andrew G.; MacGregor, Mark, Apparatus and methods for coating medical devices.
  12. King, Bruce H.; Woolfson, Steven Barry; Ramahi, David H., Apparatus for anisotropic focusing.
  13. Renn, Michael J.; King, Bruce H.; Essien, Marcelino; Marquez, Gregory J.; Giridharan, Manampathy G.; Sheu, Jyh-Cherng, Apparatuses and methods for maskless mesoscale material deposition.
  14. Renn, Michael J.; King, Bruce H.; Essien, Marcelino; Marquez, Gregory J.; Giridharan, Manampathy G.; Sheu, Jyh-Cherng, Apparatuses and methods for maskless mesoscale material deposition.
  15. Buller, Benyamin; Lappas, Tasso; Mendelsberg, Rueben; Lappen, Alan Rick, Apparatuses for three-dimensional printing.
  16. Buller, Benyamin; Milshtein, Erel, Apparatuses, systems and methods for three-dimensional printing.
  17. Buller, Benyamin; Milshtein, Erel, Apparatuses, systems and methods for three-dimensional printing.
  18. Buller, Benyamin; Milshtein, Erel, Apparatuses, systems and methods for three-dimensional printing.
  19. Buller, Benyamin; Milshtein, Erel; Chua, Thai Cheng, Apparatuses, systems and methods for three-dimensional printing.
  20. Buller, Benyamin; Milshtein, Erel; Chua, Thai Cheng, Apparatuses, systems and methods for three-dimensional printing.
  21. Buller, Benyamin; Milshtein, Erel; Seelinger, Sherman, Apparatuses, systems and methods for three-dimensional printing.
  22. Buller, Benyamin; Milshtein, Erel; Seelinger, Sherman, Apparatuses, systems and methods for three-dimensional printing.
  23. Buller, Benyamin; Milshtein, Erel; Seelinger, Sherman, Apparatuses, systems and methods for three-dimensional printing.
  24. Buller, Benyamin; Milshtein, Erel; Seelinger, Sherman, Apparatuses, systems and methods for three-dimensional printing.
  25. Rathburn, James, Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection.
  26. Rathburn, James, Bumped semiconductor wafer or die level electrical interconnect.
  27. Chappa, Ralph A.; Kloke, Timothy M., Coating apparatus and methods.
  28. Chappa, Ralph A.; Arps, James H., Coating application system with shaped mandrel.
  29. Rathburn, James, Compliant conductive nano-particle electrical interconnect.
  30. Rathburn, James, Compliant conductive nano-particle electrical interconnect.
  31. Rathburn, James, Compliant core peripheral lead semiconductor socket.
  32. Rathburn, James, Compliant core peripheral lead semiconductor test socket.
  33. Rathburn, James, Compliant printed circuit area array semiconductor device package.
  34. Rathburn, James, Compliant printed circuit semiconductor package.
  35. Rathburn, James, Compliant printed circuit semiconductor package.
  36. Rathburn, James, Compliant printed circuit semiconductor tester interface.
  37. Rathburn, James, Compliant printed circuit socket diagnostic tool.
  38. Rathburn, James, Compliant printed circuit wafer level semiconductor package.
  39. Rathburn, James, Compliant printed circuit wafer probe diagnostic tool.
  40. Rathburn, James, Compliant printed flexible circuit.
  41. Rathburn, James, Compliant wafer level probe assembly.
  42. Rathburn, James, Composite polymer-metal electrical contacts.
  43. Agrawal, Anoop; Cronin, John P.; Tonazzi, Juan Carlos L., Conductive busbars and sealants for chromogenic devices.
  44. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  45. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  46. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  47. Rathburn, James, Copper pillar full metal via electrical circuit structure.
  48. Rathburn, Jim, Copper pillar full metal via electrical circuit structure.
  49. Rathburn, James, Direct metalization of electrical circuit structures.
  50. Renn, Michael J.; King, Bruce H.; Giridharan, Manampathy G.; Sheu, Jyh-Cherng, Direct write# system.
  51. Rathburn, James, Electrical connector insulator housing.
  52. Rathburn, James, Electrical interconnect IC device socket.
  53. Rathburn, James, Electrical interconnect IC device socket.
  54. Renn, Michael J.; King, Bruce H., Forming structures using aerosol jet® deposition.
  55. Rathburn, James, Fusion bonded liquid crystal polymer circuit structure.
  56. Saukaitis, John Charles; Del Paggio, Alan Anthony, Gas separation membrane comprising a substrate with a layer of coated inorganic oxide particles and an overlayer of a gas-selective material, and its manufacture and use.
  57. Saukaitis, John Charles; Del Paggio, Alan Anthony, Gas separation membrane comprising a substrate with a layer of coated inorganic oxide particles and an overlayer of a gas-selective material, and its manufacture and use.
  58. Rathburn, James, High performance electrical circuit structure.
  59. Rathburn, James, High performance surface mount electrical interconnect.
  60. Rathburn, James, High performance surface mount electrical interconnect.
  61. Rathburn, James, High performance surface mount electrical interconnect.
  62. Rathburn, James, High performance surface mount electrical interconnect with external biased normal force loading.
  63. Rathburn, James, High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly.
  64. Rathburn, James, Hybrid printed circuit assembly with low density main core and embedded high density circuit regions.
  65. Fay, Owen R.; Farnworth, Warren M.; Hembree, David R., Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods.
  66. Renn, Michael J.; King, Bruce H.; Essien, Marcelino; Giridharan, Manampathy G.; Sheu, Jyh-Cherng, Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials.
  67. Rathburn, James J., Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction.
  68. Rathburn, James J., Mechanical contact retention within an electrical connector.
  69. King, Bruce H.; Marquez, Gregory J.; Renn, Michael J., Mechanically integrated and closely coupled print head and mist source.
  70. King, Bruce H.; Marquez, Gregory James; Renn, Michael J., Mechanically integrated and closely coupled print head and mist source.
  71. Rathburn, James, Metalized pad to electrical contact interface.
  72. Kodas, Toivo T.; Hampden Smith, Mark J.; Vanheusden, Karel; Denham, Hugh; Stump, Aaron D.; Schult, Allen B.; Atanassova, Paolina; Kunze, Klaus, Method for fabricating an inorganic resistor.
  73. Kodas, Toivo T.; Hampden-Smith, Mark J.; Vanheusden, Karel; Denham, Hugh; Stump, Aaron D.; Schult, Allen B.; Atanassova, Paolina; Kunze, Klaus, Method for the fabrication of conductive electronic features.
  74. Rathburn, James, Method of forming a semiconductor socket.
  75. Rathburn, James, Method of making a compliant printed circuit peripheral lead semiconductor package.
  76. Rathburn, James, Method of making a compliant printed circuit peripheral lead semiconductor test socket.
  77. Rathburn, James J., Method of making an electrical connector having electrodeposited terminals.
  78. Rathburn, Jim, Method of making an electronic interconnect.
  79. Chong, Chin Hui; Lee, Choon Kuan, Method of manufacturing an interposer.
  80. Kirby, Kyle K., Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  81. Kirby, Kyle K., Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  82. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  83. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  84. Sulfridge, Marc, Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
  85. Oliver,Steven D.; Kirby,Kyle K.; Hiatt,William M., Methods for forming interconnects in vias and microelectronic workpieces including such interconnects.
  86. Rigg,Sidney B.; Watkins,Charles M.; Kirby,Kyle K.; Benson,Peter A.; Akram,Salman, Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices.
  87. Kodas, Toivo T.; Hampden Smith, Mark J.; Vanheusden, Karel; Denham, Hugh; Stump, Aaron D.; Schult, Allen B.; Atanassova, Paolina; Kunze, Klaus, Methods for the deposition of conductive electronic features.
  88. Hiatt, William M.; Kirby, Kyle K., Microelectronic devices and methods for filing vias in microelectronic devices.
  89. Hiatt, William M.; Kirby, Kyle K., Microelectronic devices and methods for filling vias in microelectronic devices.
  90. Kirby, Kyle K.; Akram, Salman; Hembree, David R.; Rigg, Sidney B.; Farnworth, Warren M.; Hiatt, William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
  91. Kirby, Kyle K.; Akram, Salman; Hembree, David R.; Rigg, Sidney B.; Farnworth, Warren M.; Hiatt, William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
  92. Kirby,Kyle K.; Akram,Salman; Hembree,David R.; Rigg,Sidney B.; Farnworth,Warren M.; Hiatt,William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
  93. Kirby,Kyle K.; Akram,Salman; Hembree,David R.; Rigg,Sidney B.; Farnworth,Warren M.; Hiatt,William M., Microelectronic devices and methods for forming interconnects in microelectronic devices.
  94. Clark, Douglas; Oliver, Steven D.; Kirby, Kyle K.; Dando, Ross S., Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces.
  95. Rigg, Sidney B.; Watkins, Charles M.; Kirby, Kyle K.; Benson, Peter A.; Akram, Salman, Microelectronics devices, having vias, and packaged microelectronic devices having vias.
  96. Lee, Teck Kheng; Lim, Andrew Chong Pei, Microfeature workpiece substrates having through-substrate vias, and associated methods of formation.
  97. Hiatt, William M.; Dando, Ross S., Microfeature workpieces and methods for forming interconnects in microfeature workpieces.
  98. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
  99. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
  100. Borthakur, Swarnal, Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods.
  101. Tuttle, Mark E., Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods.
  102. Tuttle, Mark E., Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods.
  103. King, Bruce H., Miniature aerosol jet and aerosol jet array.
  104. King, Bruce H.; Renn, Michael J.; Paulsen, Jason A., Miniature aerosol jet and aerosol jet array.
  105. Essien, Marcelino; King, Bruce H., Multiple sheath multiple capillary aerosol jet.
  106. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
  107. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
  108. Lee, Teck Kheng, Partitioned through-layer via and associated systems and methods.
  109. Rathburn, James, Performance enhanced semiconductor socket.
  110. Mickley, Timothy J.; Genovese, Frank; Feng, James; Richardson, Leonard B., Precision pen height control for micro-scale direct writing technology.
  111. Rathburn, James, Resilient conductive electrical interconnect.
  112. Rathburn, James, Selective metalization of electrical connector or socket housing.
  113. Rathburn, Jim, Selective metalization of electrical connector or socket housing.
  114. Rathburn, James, Semiconductor device package adapter.
  115. Rathburn, James, Semiconductor die terminal.
  116. Rathburn, James, Semiconductor socket with direct selective metalization.
  117. Rathburn, James, Simulated wirebond semiconductor package.
  118. Rathburn, James, Singulated semiconductor device separable electrical interconnect.
  119. Steele, James K.; White, Wayne F.; Romano, Alfred M.; Rubow, Kenneth L., Sinter bonded porous metallic coatings.
  120. Buller, Benyamin; Lappas, Tasso; Mendelsberg, Rueben; Lappen, Alan Rick, Skillful three-dimensional printing.
  121. Buller, Benyamin; Milshtein, Erel; Brezoczky, Thomas Blasius; Murphree, Zachary Ryan; Christiansen, Daniel; Lappen, Alan Rick, Skillful three-dimensional printing.
  122. Buller, Benyamin; Milshtein, Erel; Brezoczky, Thomas Blasius; Murphree, Zachary Ryan; Christiansen, Daniel; Lappen, Alan Rick, Skillful three-dimensional printing.
  123. Chong,Chin Hui; Lee,Choon Kuan, Slanted vias for electrical circuits on circuit boards and other substrates.
  124. Watkins, Charles M.; Hiatt, William M., System and methods for forming apertures in microfeature workpieces.
  125. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  126. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  127. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  128. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  129. Buller, Benyamin; Milshtein, Erel; Brezoczky, Thomas Blasius; Christiansen, Daniel; Lappen, Alan Rick, Systems for three-dimensional printing.
  130. Buller, Benyamin; Milshtein, Erel; Seelinger, Sherman, Systems for three-dimensional printing.
  131. Panat, Rahul; Heo, Deuk Hyoun, Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces.
  132. Buller, Benyamin; Murphree, Zachary Ryan; Romano, Richard Joseph; Brezoczky, Thomas Blasius; Lappen, Alan Rick, Three-dimensional printing and three-dimensional printers.
  133. Buller, Benyamin; Murphree, Zachary Ryan; Romano, Richard Joseph; Brezoczky, Thomas Blasius; Lappen, Alan Rick, Three-dimensional printing and three-dimensional printers.
  134. Buller, Benyamin; Lappas, Tasso; Mendelsberg, Rueben; Korepanov, Sergey, Three-dimensional printing in real time.
  135. Buller, Benyamin; Murphree, Zachary Ryan, Three-dimensional printing systems and methods of their use.
  136. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  137. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  138. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  139. Palti,Yoram, Transporting matter that is enclosed within a container through a hollow optical fiber.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로