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|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||C04B-024/02 C04B-024/00 C04B-024/08 C04B-024/14|
|미국특허분류(USC)||106/250; 106/251; 106/267; 106/504; 106/657; 106/659; 106/661; 106/665; 106/822; 252/088.1; 524/002; 524/476; 524/481; 524/483|
|발명자 / 주소||
|출원인 / 주소||
|인용정보||피인용 횟수 : 5 인용 특허 : 76|
A wall repair compound useful for filling and repairing cracks, holes, and other imperfections in a wall surface includes a conventional filler material, a conventional binder material, and a dust reducing additive which reduces the quantity of airborne dust particles generated when sanding the hardened joint compound. Airborne dust reducing additives include oils, surfactants, solvents, waxes, and other petroleum derivatives. The additive can be added to conventional ready-mixed joint compounds and to setting type joint compounds. A method of reducing t...
What is claimed is: 1. A sandable low dust generating drywall joint compound for sealing joints between adjacent wallboard panels, comprising: (a) between about 25% and about 95% filler material; (b) between about 1% and 20% binder material; (c) between about 1.5% and 6% dust reducing additive comprising at least two oils; and (d) sufficient water to adjust the viscosity of the joint compound to render the joint compound suitable for use. 2. A drywall joint compound as defined in claim 1, wherein the filler comprises from about 60% to about 70% of th...