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A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the periph

A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges. The method also preferably includes closing the first and second mold portions around the IC and injecting encapsulating material into the mold to encapsulate the IC and make the IC package having an exposed portion of the IC adjacent the mold protrusion. Morever, the bleed-through retention channel retains any encapsulating material bleeding beneath the peripheral edges of the IC contact surface, and prevents the encapsulating material from reaching further onto the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion from the mold.

대표청구항 ▼

That which is claimed is: 1. A method for making an integrated circuit (IC) package with an exposed portion of the IC, the method comprising: providing a mold including first and second mold portions, the first mold portion carrying a mold protrusion defining an IC-contact surface with peripheral e

That which is claimed is: 1. A method for making an integrated circuit (IC) package with an exposed portion of the IC, the method comprising: providing a mold including first and second mold portions, the first mold portion carrying a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges; closing the first and second mold portions around the IC and injecting encapsulating material into the mold to form the IC package with the exposed portion adjacent the mold protrusion and while the bleedthrough retention channel retains encapsulating material bleeding beneath the peripheral edges of the IC contact surface; controlling pressure applied by the IC-contact surface to the IC when the first and second mold portions are closed around the IC, wherein controlling pressure comprises mounting the IC on a leadframe having resilient portions to resiliently accommodate downsetting of the IC as the IC-contact surface contacts the IC; and releasing the IC package from the mold. 2. A method according to claim 1 wherein said bleedthrough retention channel extends adjacent at least a portion of an entire extent of the peripheral edges of the IC-contact surface. 3. A method according to claim 1 wherein said bleedthrough retention channel extends adjacent an entire extent of the peripheral edges of the IC-contact surface. 4. A method according to claim 1 wherein the mold protrusion has a generally rectangular shape. 5. A method according to claim 1 wherein controlling pressure comprises providing the mold protrusion comprising a resilient material. 6. A method according to claim 1 wherein the resilient portions comprise die pad support bars extending between a die pad and adjacent finger portions. 7. A method according to claim 6 wherein downsetting displaces the die pad below the finger portions. 8. A method according to claim 6 further comprising shaping bond wires between the IC and the finger portions so that upon downsetting the bond wires have a desired clearance from the IC and an upper surface of the encapsulating material. 9. A method according to claim 1 further comprising mounting the IC on a substrate prior to closing the first and second mold portions. 10. A method according to claim 1 wherein the encapsulating material and the IC have different coefficients of thermal expansion (CTEs); wherein the encapsulating material is injected at an elevated temperature; and further comprising relieving stress caused by the different CTEs as the IC and encapsulating material cool. 11. A method according to claim 10 wherein relieving stress comprises using a low stress encapsulating material. 12. A method according to claim 10 wherein relieving stress comprises providing a leadframe having a die pad with an opening therein, and mounting the IC on the die pad prior with the opening therein prior to closing the first and second mold portions around the IC. 13. A method according to claim 12 wherein relieving stress further comprises mounting the IC on the die pad with the opening therein by adhesively securing the IC on the die pad using a low stress, low modulus adhesive. 14. A method according to claim 1 wherein the exposed portion of the IC comprises upper surface portions with active devices formed therein. 15. A method according to claim 14 wherein the active devices define a sensor. 16. A method according to claim 14 wherein the active devices define an electric field fingerprint sensor. 17. A method according to claim 1 wherein the first and second mold portions each comprises rigid material. 18. A method according to claim 1 further comprising periodically cleaning the mold and the mold protrusion. 19. A method for making an integrated circuit (IC) package with an exposed portion of the IC, the method comprising: providing a mold including first and second mold portions, the first mold portion carrying a mold protrusion defining an IC-contact surface; mounting the IC on a leadframe having resilient portions to resiliently accommodate downsetting of the IC within the mold as the IC-contact surface contacts the IC; closing the first and second mold portions around the IC and leadframe to downset the IC under controlled pressure applied by the IC-contact surface to the IC and while the second mold portion has a surface opposite the IC that remains spaced therefrom; injecting encapsulating material into the mold to make the IC package with the exposed portion adjacent the mold protrusion; and releasing the IC package from the mold. 20. A method according to claim 19 wherein the resilient portions comprise die pad support bars extending between a die pad and adjacent finger portions. 21. A method according to claim 20 wherein downsetting displaces the die pad below the finger portions. 22. A method according to claim 20 further comprising shaping bond wires between the IC and the outer finger portion so that upon downsetting the bond wires have a desired clearance from the IC and an upper surface of the encapsulating material. 23. A method according to claim 19 wherein the encapsulating material and the IC have different coefficients of thermal expansion (CTEs); wherein the encapsulating material is injected at an elevated temperature; and further comprising relieving stress caused by the different CTEs as the IC and encapsulating material cool. 24. A method according to claim 23 wherein relieving stress comprises using a low stress encapsulating material. 25. A method according to claim 23 wherein relieving stress comprises providing a leadframe having a die pad with an opening therein, and mounting the IC on the die pad with the opening therein prior to closing the first and second mold portions around the IC. 26. A method according to claim 25 wherein relieving stress further comprises mounting the IC on the die pad with the opening therein by adhesively securing the IC on the die pad using a low stress, low modulus adhesive. 27. A method according to claim 19 wherein the exposed portion of the IC comprises upper surface portions with active devices formed therein. 28. A method according to claim 27 wherein the active devices define a sensor. 29. A method according to claim 28 wherein the mold protrusion comprises a resilient material.