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Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-057/00
출원번호 US-0675939 (2003-10-02)
우선권정보 JP-10-369447(1998-12-25)
발명자 / 주소
  • Osuda,Hiroshi
  • Matoba,Toru
  • Fukuizumi,Masataka
출원인 / 주소
  • Fujitsu Limited
대리인 / 주소
    Armstrong, Kratz, Quintos, Hanson &
인용정보 피인용 횟수 : 5  인용 특허 : 60

초록

An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized circulation. The slurry effluent

대표청구항

What is claimed is: 1. In a chemical-mechanical polishing system, the improvement comprising: an apparatus for reusing a slurry effluent containing agglomerations of abrasive grains which has been used in a polishing step in the manufacture of a semiconductor, comprising: a crusher for crushing the

이 특허에 인용된 특허 (60)

  1. Drenter John Charles (Davenport IA) Allebach ; Jr. Donald Charles (Davenport IA) Konitzer ; Jr. Dieter Artur (Walcott IA), Abrasive grit material recovery system.
  2. Moore, Scott E., Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization.
  3. Moore, Scott E., Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization.
  4. Moore, Scott E., Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization.
  5. Moore, Scott E., Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization.
  6. Obeng Yaw S. ; Schultz Laurence D., Apparatus and method for continuous delivery and conditioning of a polishing slurry.
  7. Tanoue, Akihiro; Hidaka, Yoshiharu; Hashimoto, Shin, Apparatus and method for feeding slurry.
  8. Hedrick ; II Harold M. (Houston TX), Apparatus and method for producing virgin and/or reclaiming used abrasives.
  9. Crevasse, Annette M.; Easter, William G.; Maze, John A.; Miceli, Frank, Apparatus and method for reclamation of used polishing slurry.
  10. Nicholes, Mary Kristin; Carlson, Stephen John; Litchy, Mark R., Apparatus and method for sampling a chemical-mechanical polishing slurry.
  11. Matsumoto, Akira; Hayashi, Kazuki, Apparatus and process for recovering abrasive.
  12. Gary L. Corlett ; Edward T. Ferri, Jr. ; J. Tobin Geatz, Apparatus and process for separation and recovery of liquid and slurry abrasives used for polishing.
  13. Gary L. Corlett ; Edward T. Ferri, Jr. ; J. Tobin Geatz, Apparatus for separation and recovery of liquid and slurry abrasives used for polishing.
  14. Jurgen Hammer DE; Andre Richter DE; Werner Kraus DE; Heinz-Dieter Petermann DE, Apparatus for treating wastewater from a chemical-mechanical polishing process used in chip fabrication.
  15. Carpio Ronald A., CMP slurry measurement and control technique.
  16. Hiroshi Mizuno ; Masaaki Ogitsu JP; Takuya Nagamine JP; Toru Kikuchi JP, CMP slurry recycling apparatus and method for recycling CMP slurry.
  17. Russ Richard D. ; Thomas Daniel, Chemical-mechanical-polishing system with continuous filtration.
  18. Russ Richard D. ; Thomas Daniel, Chemical-mechanical-polishing system with continuous filtration.
  19. Lai, Chien-Hsin; Lin, Juen-Kuen; Li, Huang-Yi; Yu, Kevin, Closed loop concentration control system for chemical mechanical polishing slurry.
  20. Lemke, Travis A., Conductivity feedback control system for slurry bending.
  21. Hayashi Yoshihiro,JPX ; Saito Yukishige,JPX ; Nakajima Tsutomu,JPX ; Sato Shin,JPX ; Furukawa Yukihiro,JPX, Device and method for recovering and reusing a polishing agent.
  22. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX, Device for filtering slurry.
  23. Decain Donald M. ; Huynh Cuc K. ; Jurjevic Robert A. ; Nadeau Douglas P. ; Taubenblatt Marc A., Downstream monitor for CMP brush cleaners.
  24. Chiu Hao-Kuang,TWX ; Peng Peng-Yih,TWX, Filtering apparatus with stirrer in a CMP apparatus.
  25. Caserta Richard T. (Lansdale PA) Zimmerman Roy E. (Lansdale PA), Grinding wheel containing dissolvable granular material.
  26. Leman Derek A. ; Fritzsche Alfred K., Membrane filter element for chemical-mechanical polishing slurries.
  27. Hayden Daniel B., Membrane-like filter element for chemical mechanical polishing slurries.
  28. Costantini Michael A. ; Talbott Jonathan A. ; Chandra Mohan ; Prasad Vishwanath ; Caster Allison ; Gupta Kedar P. ; Leyvraz Philippe, Method and apparatus for improved wire saw slurry.
  29. David K. Watts, Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating process.
  30. Yorita Hiroshi,JPX ; Yoshikawa Takashi,JPX, Method and apparatus for reclaiming used working fluid.
  31. Corlett Gary L. ; Roberson ; Jr. Glenn A., Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization.
  32. Corlett Gary L. ; Roberson ; Jr. Glenn A., Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization.
  33. David K. Watts, Method and apparatus for rejuvenating a CMP chemical solution.
  34. Tanoue, Akihiro; Matsuzawa, Yutaka; Shimizu, Koji, Method and apparatus for rejuvenating polishing slurry.
  35. Osuda, Hiroshi; Matoba, Toru; Fukuizumi, Masataka, Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors.
  36. Kim, Jung-yup; Park, Young-rae; Hah, Sang-rok, Method and apparatus for supplying chemical-mechanical polishing slurries.
  37. Hayashi Yoshihiro (Tokyo JPX) Yabe Kouichi (Yokohama JPX) Mizuniwa Tetsuo (Yokosuka JPX), Method for recovering abrasive particles.
  38. Eisner, Peter; Malberg, Andreas; Menner, Michael; Borcherding, Axel, Method for separating a machining suspension into fractions.
  39. Zavattari Carlo,ITX ; Fragiacomo Guido,ITX, Method for the separation, regeneration and reuse of an exhausted glycol-based slurry.
  40. Anselme Christophe (Le Pecq FRX) Daniel Loc (Rueil-Malmaison FRX), Method of backwashing tubular filter membranes, and apparatus for implementing the method.
  41. Annette M. Crevasse ; William G. Easter ; John A. Maze ; Sailesh M. Merchant ; Frank Miceli, Method of eliminating agglomerate particles in a polishing slurry.
  42. Hed P. Paul ; Fuchs Baruch A., Multi-stage slurry system used for grinding and polishing materials.
  43. Kiyotaka Kawashima JP; Mutsumi Tanikawa JP; Hiroshi Shimomoto JP; Keiko Chono JP, Polishing liquid supply apparatus.
  44. Heinle Ewald,DEX ; Grimm Alexander,DEX ; Rubenbauer Holger,DEX ; Kurth Roman,DEX, Process for reclaiming a grinding suspension.
  45. Wiesner Peter,DEX, Process for reclaiming a suspension.
  46. Trischuk Ronald W. (Northborough MA) Garg Ajay K. (Northborough MA) Khaund Arup K. (Northborough MA), Reclamation of abrasive grain.
  47. Pinder ; Jr. Harvey Wayne,TWX, Recovery device for polishing agent and deionizing water for a polishing machine.
  48. Toyama Kohei,JPX ; Kiuchi Etsuo,JPX ; Hayakawa Kazuo,JPX ; Kaburagi Shingo,JPX ; Ashida Akio,JPX ; Ito Takara,JPX ; Noami Kuniaki,JPX, Recovery of coolant and abrasive grains used in slicing semiconductor wafers.
  49. Adams John A. ; Krulik Gerald A. ; Harwood C. Randall, Rinse water recycling in CMP apparatus.
  50. Miyata Kensho,JPX ; Kinutani Kazutomo,JPX ; Katsumata Noboru,JPX ; Kuroda Kensho,JPX ; Wada Toyotaka,JPX ; Nakayama Akihiro,JPX ; Takahashi Katsumasa,JPX ; Nishida Takaharu,JPX ; Uemura Shouichi,JPX , Slurry managing system and slurry managing method for wire saws.
  51. Annette M. Crevasse ; William G. Easter ; John A. Maze ; Frank Miceli ; Craig R. Zavilla, Slurry recirculation system for reduced slurry drying.
  52. Kurisawa Shuu,JPX, Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique.
  53. Adams John A. (Escondido CA) Krulik Gerald A. (San Clemente CA) Harwood C. Randall (Tempe AZ), Slurry recycling in CMP apparatus.
  54. Chang, Jung Hoon; Lee, Kwang Jun; Park, Jin Goo, Slurry recycling system and method for CMP apparatus.
  55. Iida Shinya,JPX ; Yoshida Akitoshi,JPX, Slurry recycling system and method for CMP apparatus.
  56. Yueh William, Slurry recycling system for chemical-mechanical polishing apparatus.
  57. Iida Shinya,JPX ; Yoshida Akitoshi,JPX, Slurry recycling system of CMP apparatus and method of same.
  58. Pham, Xuyen; Nguyen, Tuan; Quach, Vien; Zhou, Ren, System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system.
  59. Drill Charles Franklin ; Harvey Ian Robert, System for dislodging by-product agglomerations from a polishing pad of a chemical mechanical polishing machine.
  60. Toyama Kohei,JPX, System for reusing oily slurry waste fluid.

이 특허를 인용한 특허 (5)

  1. Morris, Samuel J; Zamora Morris, Glenna V, Fluid lubricant and material shavings recapture system for a cutting operation.
  2. Golden, Josh H.; Porshnev, Peter I.; Myers, Donald, Method and system for point of use recycling of ECMP fluids.
  3. Pancaldi, Fabio; Gallocchio, Vanni, Plant and method for the treatment of the recovery cooling fluid in mechanical processing plants.
  4. Sun, Qi; Graves, David; Sargent, John P.; Hamilton, Lindsey A., Systems for recycling slurry materials during polishing processes.
  5. Gaudet, Gregory; Grumbine, Steven; Naguib, Nevin; Batllo, Francois, Wire saw slurry recycling process.
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