초록 ▼

A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller

A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.

대표청구항 ▼

The invention claimed is: 1. A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted, wherein the coefficient of th

The invention claimed is: 1. A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted, wherein the coefficient of thermal expansion of the adhesive is smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. 2. A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted, wherein the coefficient of thermal expansion of the adhesive is larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. 3. A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted, wherein the stiffener is a frame-like member having an outer contour generally identical to that of the semiconductor element, and external terminals are provided around the stiffener, the height of the stiffener being smaller than that of the external terminals. 4. A semiconductor device as defined by claim 3, further comprising a printed circuit board having terminals to be connected to the external terminals, wherein the stiffener is brought in contact with a surface of the printed circuit board. 5. A semiconductor device as defined by claim 4, wherein a cooling member is coupled to the semiconductor element via a heat-conductive member, and is fixed to the printed circuit board.