초록 ▼

The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of d

The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N횞M fiber optic switches, which direct light from N input fibers into M output fibers.

대표청구항 ▼

What is claimed is: 1. An array of lithographically fabricated MEMS devices comprising: a plurality of individual dies including at least one MEMS device, each die having been separated from adjacent dies on an original fabrication wafer, with each die of the plurality positioned on a second wafer,

What is claimed is: 1. An array of lithographically fabricated MEMS devices comprising: a plurality of individual dies including at least one MEMS device, each die having been separated from adjacent dies on an original fabrication wafer, with each die of the plurality positioned on a second wafer, and affixed mechanically to said second wafer. 2. The array of lithographically fabricated MEMS devices according to claim 1, wherein each individual die in the array is connected electrically to supporting circuiting in said second wafer. 3. The array of lithographically fabricated MEMS devices according to claim 1, wherein said second wafer comprises electronic circuitry to manipulate said at least one MEMS devices. 4. The array of lithographically fabricated MEMS devices according to claim 1, wherein each individual die has been rotated out of an original plane of fabrication. 5. The array of lithographically fabricated MEMS devices according to claim 1, wherein the dies in the array are not all alike. 6. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises a utilitarian feature affixed to a MEMS microactuator. 7. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises a fluid flow diverter affixed to a MEMS microactuator. 8. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises an electrical relay affixed to a MEMS microactuator. 9. The array of lithographically fabricated MEMS devices according to claim 6, wherein the utilitarian feature of at least one of the MEMS devices differs from the utilitarian feature of at least one other of the MEMS devices. 10. The array of lithographically fabricated MEMS devices according to claim 6, wherein the utilitarian feature is the same for each of the at least one MEMS device. 11. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises an optical element affixed to a MEMS microactuator. 12. The array of lithographically fabricated MEMS devices according to claim 11, wherein said optical element comprises a mirror. 13. The array of lithographically fabricated MEMS devices according to claim 12, wherein the array is coupled with a block of N input optical fibers and a block of M exit optical fibers, forming an N횞M fiber optic switch. 14. The array of lithographically fabricated MEMS devices of claim 1, wherein the plurality of individual dies are detached from adjacent dies on the original fabrication wafer, before being affixed to the second wafer. 15. The array of lithographically fabricated MEMS devices according to claim 1, wherein each individual die has been rotated out of an original plane of fabrication into a rotated orientation, and affixed in the rotated orientation to the second wafer. 16. The array of lithographically fabricated MEMS devices of claim 1, wherein the plurality of individual dies includes at least one unencapsulated MEMS device.