[특허]Shielded probe for testing a device under test

[미국특허] Shielded probe for testing a device under test 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-031/02
출원번호	US-0445174 (2003-05-23)
발명자 / 주소	Gleason,K. Reed Lesher,Tim Andrews,Mike Martin,John
출원인 / 주소	Sharp Laboratories of America, Inc.
대리인 / 주소	Chernoff, Vilhauer, McClung &
인용정보	피인용 횟수 : 21 인용 특허 : 228

초록 ▼

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path between the first and second sides of a substrate and a probe contact

대표청구항 ▼

The invention claimed is: 1. A probe comprising: (a) a dielectric substrate; (b) an elongate conductor suitable to be electrically interconnected to a test signal supported by a first side of said substrate; (c) a conductive member suitable to be electrically interconnected to a ground signal supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor; (d) a conductive path between said first side of said substrate and said second side of said substrate in a manner free from an air gap between the conductive path and the end of said substrate for at least a majority of the thickness of said substrate and said conductive path free from electrical interconnection with said conductive member; and (e) a contact electrically interconnected to said conductive path for testing a device under test. 2. The probe of claim 1 wherein said elongate conductor is electrically interconnected to a central conductor of a coaxial cable. 3. The probe of claim 2 wherein said conductive member is electrically connected to a conductor surrounding said central conductor of said coaxial cable. 4. The probe of claim 3 wherein said substrate is supported by said coaxial cable. 5. The probe of claim 4 wherein said substrate is supported by a shelf of said coaxial cable. 6. The probe of claim 1 wherein said conductive member is substantially planar. 7. The probe of claim 1 wherein said dielectric substrate is semi-flexible. 8. The probe of claim 7 wherein said dielectric substrate is a membrane. 9. The probe of claim 1 wherein said dielectric substrate has a dielectric constant less than 7. 10. The probe of claim 1 wherein said dielectric substrate has a dielectric constant less than 5. 11. The probe of claim 1 wherein said dielectric substrate has a dielectric constant less than 4. 12. The probe of claim 1 wherein said dielectric substrate has a dielectric constant less than 2. 13. The probe of claim 1 wherein said ground signal is zero volts. 14. The probe of claim 1 wherein said conductive member covers greater than 50% of said second side of said substrate. 15. The probe of claim 1 wherein said conductive member covers greater than 60% of said second side of said substrate. 16. The probe of claim 1 wherein said conductive member covers greater than 70% of said second side of said substrate. 17. The probe of claim 1 wherein said conductive member covers greater than 80% of said second side of said substrate. 18. The probe of claim 1 wherein said conductive member covers greater than 90% of said second side of said substrate. 19. The probe of claim 1 wherein said conductive member, said elongate conductor, and said substrate collectively form a microstrip transmission structure. 20. The probe of claim 1 wherein said conductive path is a via through said substrate. 21. The probe of claim 1 wherein said conductive member laterally surrounds at least 50% of said contact. 22. The probe of claim 1 wherein said conductive member laterally surrounds at least 75% of said contact. 23. The probe of claim 1 wherein said conductive member laterally surrounds at least 100% of said contact. 24. The probe of claim 1 wherein said contact is in the form of a bump. 25. The probe of claim 1 wherein said substrate has a thickness less than 40 microns. 26. The probe of claim 1 wherein said substrate has a thickness less than 30 microns. 27. The probe of claim 1 wherein said substrate has a thickness less than 20 microns. 28. A probe comprising: (a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor; (b) a conductive path between said first side of said substrate and said second side of said substrate in a region within the periphery of said substrate for at least a majority of the thickness of said substrate; and (c) a contact electrically interconnected to said conductive path for testing a device under test. 29. The probe of claim 28 wherein said elongate conductor is electrically interconnected to a central conductor of a coaxial cable. 30. The probe of claim 29 wherein said conductive member is electrically connected to a conductor surrounding said central conductor of said coaxial cable. 31. The probe of claim 28 wherein said dielectric substrate is flexible. 32. The probe of claim 31 wherein said dielectric substrate is a membrane. 33. The probe of claim 28 wherein said dielectric substrate has a dielectric constant less than 7. 34. The probe of claim 28 wherein said dielectric substrate has a dielectric constant less than 5. 35. The probe of claim 28 wherein said dielectric substrate has a dielectric constant less than 4. 36. The probe of claim 28 wherein said dielectric substrate has a dielectric constant less than 2. 37. The probe of claim 28 wherein said conductive member covers greater than 50% of said second side of said substrate. 38. The probe of claim 28 wherein said conductive member covers greater than 60% of said second side of said substrate. 39. The probe of claim 28 wherein said conductive member covers greater than 70% of said second side of said substrate. 40. The probe of claim 28 wherein said conductive member covers greater than 80% of said second side of said substrate. 41. The probe of claim 28 wherein said conductive member covers greater than 90% of said second side of said substrate. 42. The probe of claim 28 wherein said conductive member, said elongate conductor, and said substrate collectively form a microstrip transmission structure. 43. The probe of claim 28 wherein said substrate has a thickness less than 40 microns. 44. The probe of claim 28 wherein said substrate has a thickness less than 20 microns. 45. The probe of claim 28 wherein said substrate has a thickness less than 10 microns.

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Miller, Charles A., Test signal distribution system for IC tester.
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Lockwood Larry R. (McMinnville OR) Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR), Wafer probe.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

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[미국특허] Shielded probe for testing a device under test 원문보기

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이 특허에 인용된 특허 (228) 인용/피인용 타임라인 분석

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