IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0889334
(2004-07-12)
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발명자
/ 주소 |
- Khandros,Igor Y.
- Sporck,A. Nicholas
- Eldridge,Benjamin N.
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| 출원인 / 주소 |
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| 인용정보 |
피인용 횟수 :
15 인용 특허 :
68 |
초록
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In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient
In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
대표청구항
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What is claimed is: 1. A probe assembly comprising: a wiring board comprising a plurality of contact terminals; a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrical
What is claimed is: 1. A probe assembly comprising: a wiring board comprising a plurality of contact terminals; a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrically connected to ones of said second substrate terminals; a rigid plate, said semiconductor substrate disposed on said rigid plate; and a plurality of electrical connectors connecting ones of said contact terminals to ones of said first substrate terminals. 2. The probe assembly of claim 1 further comprising a plurality of probes mounted to said second substrate terminals. 3. The probe assembly of claim 2, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate. 4. The probe assembly of claim 3, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate. 5. The probe assembly of claim 4, wherein said second side of said semiconductor substrate is disposed on said rigid plate. 6. The probe assembly of claim 5, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals. 7. The probe assembly of claim 2, wherein said probes are elongate and resilient. 8. The probe assembly of claim 2 further comprising means for applying a biasing force to said rigid plate, wherein said biasing force biases said semiconductor substrate away from said wiring board. 9. The probe assembly of claim 8 further comprising planarization means for selectively adjusting a planar orientation of contact ends of said probes with respect to said wiring board, said planarization means further holding said semiconductor substrate in said selected planar orientation. 10. The probe assembly of claim 2, wherein said probes are configured to contact an electronic device to be tested, and said semiconductor substrate has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of said electronic device. 11. The probe assembly of claim 2, wherein said probes are configured to contact terminals of an electronic circuit integrated into a semiconductor material having a composition substantially similar to said semiconductor substrate. 12. The probe assembly of claim 1, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate. 13. The probe assembly of claim 1, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate. 14. The probe assembly of claim 1, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals. 15. The probe assembly of claim 1, wherein said semiconductor substrate comprises silicon. 16. The probe assembly of claim 1 further comprising at least one active electronic circuit integrated into said semiconductor substrate. 17. A probe assembly comprising: a wiring board comprising a plurality of contact terminals; a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrically connected to ones of said second substrate terminals, said semiconductor substrate secured without adhesive to said wiring board; and a plurality of electrical connectors connecting ones of said contact terminals to ones of said first substrate terminals. 18. The probe assembly of claim 17 further comprising a plurality of probes mounted to said second substrate terminals. 19. The probe assembly of claim 18, wherein said semiconductor substrate is secured to a rigid plate, which is secured to said wiring board, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate. 20. The probe assembly of claim 19, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate. 21. The probe assembly of claim 20, wherein said second side of said semiconductor substrate is disposed on said rigid plate. 22. The probe assembly of claim 21, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals. 23. The probe assembly of claim 19 further comprising means for applying a biasing force to said rigid plate, wherein said biasing force biases said semiconductor substrate away from said wiring board. 24. The probe assembly of claim 23 further comprising planarization means for selectively adjusting a planar orientation of contact ends of said probes with respect to said wiring board, said planarization means further holding said semiconductor substrate in said selected planar orientation. 25. The probe assembly of claim 18, wherein said probes are elongate and resilient. 26. The probe assembly of claim 18, wherein said probes are configured to contact an electronic device to be tested, and said semiconductor substrate has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of said electronic device. 27. The probe assembly of claim 18, wherein said probes are configured to contact terminals of an electronic circuit integrated into a semiconductor material having a composition substantially similar to said semiconductor substrate. 28. The probe assembly of claim 17, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate. 29. The probe assembly of claim 17, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals. 30. The probe assembly of claim 17, wherein said semiconductor substrate comprises silicon. 31. The probe assembly of claim 17 further comprising at least one active electronic circuit integrated into said semiconductor substrate. 32. A probe assembly comprising: a wiring board comprising a plurality of contact terminals; a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrically connected to ones of said second substrate terminals, there being a space that is at least partially unfilled by solid material between said semiconductor substrate and said wiring board; and a plurality of electrical connectors connecting ones of said contact terminals to ones of said first substrate terminals. 33. The probe assembly of claim 32 further comprising a plurality of probes mounted to said second substrate terminals. 34. The probe assembly of claim 33, wherein said semiconductor substrate is secured to a rigid plate, which is secured to said wiring board, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate. 35. The probe assembly of claim 34, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate. 36. The probe assembly of claim 35, wherein said second side of said semiconductor substrate is disposed on said rigid plate. 37. The probe assembly of claim 36, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals. 38. The probe assembly of claim 34 further comprising means for applying a biasing force to said rigid plate, wherein said biasing force biases said semiconductor substrate away from said wiring board. 39. The probe assembly of claim 38 further comprising planarization means for selectively adjusting a planar orientation of contact ends of said probes with respect to said wiring board, said planarization means further holding said semiconductor substrate in said selected planar orientation. 40. The probe assembly of claim 33, wherein said probes are elongate and resilient. 41. The probe assembly of claim 33, wherein said probes are configured to contact an electronic device to be tested, and said semiconductor substrate has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of said electronic device. 42. The probe assembly of claim 33, wherein said probes are configured to contact terminals of an electronic circuit integrated into a semiconductor material having a composition substantially similar to said semiconductor substrate. 43. The probe assembly of claim 32, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate. 44. The probe assembly of claim 32, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals. 45. The probe assembly of claim 32, wherein said semiconductor substrate comprises silicon. 46. The probe assembly of claim 32 further comprising at least one active electronic circuit integrated into said semiconductor substrate.
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