Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B24C-007/00
출원번호
US-0045685
(2005-01-28)
발명자
/ 주소
Tannous,Adel George
Makhamreh,Khalid
출원인 / 주소
Manoclean Technologies, Inc.
대리인 / 주소
Loudermilk &
인용정보
피인용 횟수 :
2인용 특허 :
84
초록▼
A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radicals are generated from one or more r
A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radicals are generated from one or more reactant gases and introduced into at least one of the one or more processing chambers where they react with the polymeric residue. A cryogenic cleaning medium is supplied into at least one of the one or more processing chambers where it removes the polymeric residue present after the free radicals react with the polymeric residue. The reactant gases are selected to facilitate removal of the polymeric residue with the cryogenic cleaning medium. The cryogenic cleaning medium is supplied via a nozzle implement that sweeps across the article. A slide mechanism and drive motor may be supplied internal or external to the controlled environment.
대표청구항▼
What is claimed is: 1. A method for manufacturing an article, the article having polymeric residue that is to be removed during the manufacture of the article, comprising the steps of: introducing the article into a controlled environment of a processing tool, the processing tool having one or more
What is claimed is: 1. A method for manufacturing an article, the article having polymeric residue that is to be removed during the manufacture of the article, comprising the steps of: introducing the article into a controlled environment of a processing tool, the processing tool having one or more processing chambers; generating free radicals from one or more reactant gases and introducing the free radicals into at least one of the one or more processing chambers, wherein the free radicals react with the polymeric residue; and supplying a cryogenic cleaning medium into at least one of the one or more processing chambers, wherein the cryogenic cleaning medium removes the polymeric residue present after the free radicals react with the polymeric residue; wherein the reactant gases are selected to result in the polymeric residue having weakened bonds and to facilitate removal of the polymeric residue with the cryogenic cleaning medium; wherein the cryogenic cleaning medium is supplied via a nozzle implement that sweeps across the article. 2. The method of claim 1, wherein movement of the nozzle implement is generated by a slide mechanism and a drive motor coupled to the slide mechanism. 3. The method of claim 2, wherein the slide mechanism and drive motor are provided in the controlled environment of the processing tool. 4. The method of claim 3, wherein the slide mechanism and drive motor are provided in a chamber separate from the one or more processing chambers. 5. The method of claim 4, wherein a vacuum port is provided in the chamber in which the slide mechanism and drive motor are provided. 6. The method of claim 2, wherein the slide mechanism and drive motor are provided outside of the controlled environment of the processing tool. 7. The method of claim 6, wherein the slide mechanism and drive motor are coupled to the nozzle implement via a shaft that extends from outside the controlled environment of the processing tool into at least one of the one or more processing chambers. 8. The method of claim 6, wherein the slide mechanism and drive motor are magnetically coupled to the nozzle implement via a first magnet member that is outside the controlled environment of the processing tool and a second magnet member that is inside the controlled environment of the processing tool. 9. The method of claim 1, further comprising the steps of: applying RF energy to one or more electrodes in at least a first processing chamber; generating an RF plasma, wherein the RF plasma is generated from the reactant gases and/or from the free radicals, wherein the RF plasma reacts with the polymeric residue; wherein the step of supplying a cryogenic cleaning medium operates to remove polymeric residue present after the RF plasma reacts with the polymeric residue. 10. The method of claim 1, wherein the cryogenic cleaning medium is supplied in an oscillatory, vibratory or pulsating manner. 11. The method of claim 1, wherein the polymeric residue results from a photoresist removal process. 12. The method of claim 1, wherein the cryogenic cleaning medium is subjected to a multi-stage, multi-mode filtering process prior to being supplied to the second processing chamber. 13. The method of claim 1, wherein a first processing chamber provides plasma processing but not cryogenic processing. 14. The method of claim 13, wherein a second processing chamber provides cryogenic processing but not plasma processing. 15. The method of claim 1, wherein each of first and second processing chambers provide plasma processing and cryogenic processing. 16. The method of claim 1, wherein at least first and second processing chambers are provided, wherein movement of the nozzle implement is generated by a slide mechanism and a drive motor coupled to the slide mechanism, wherein the slide mechanism and drive motor are provided in the controlled environment of the processing tool, wherein the slide mechanism and drive motor are provided in a chamber separate from the one or more processing chambers. 17. The method of claim 16, wherein the chamber in which the slide mechanism and drive motor are provided is positioned between the first and second processing chambers and provides movement of a first nozzle implement in the first processing chamber and also provides movement of a second nozzle implement in the second processing chamber. 18. The method of claim 16, wherein a vacuum port is provided in the chamber in which the slide mechanism and drive motor are provided. 19. The method of claim 1, wherein the nozzle assembly has a non-linear shape that corresponds to a shape of the article.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (84)
Hashish Mohamed (Kent WA) Marvin Mark (Tacoma WA), Abrasive swivel assembly and method.
Whitlock Walter H. (Peapack NJ) Weltmer ; Jr. William R. (Murray Hill NJ) Clark James D. (Mountainside NJ), Apparatus and method for removing minute particles from a substrate.
McDermott Wayne T. (Allentown PA) Wu Jin J. (Ossining NY) Ockovic Richard C. (Northampton PA), Apparatus to clean solid surfaces using a cryogenic aerosol.
Goddin ; Jr. Clifton S. (Tulsa OK) Turek Edward A. (Tulsa OK) George Boyd A. (Lisle IL), CO2Removal from high CO2content hydrocarbon containing streams.
Goffnett David M. (Alma MI) Richardson Mark D. (Hemlock MI) Bielby Eugene F. (Saginaw MI), Cleaning of CVD reactor used in the production of polycrystalline silicon by impacting with carbon dioxide pellets.
Nakayama Izumi ; Masuda Yukio ; Bersin Richard L. ; Xu Han ; Geng Quain, Cold processes for cleaning and stripping photoresist from surfaces of semiconductor wafers.
Cotte, John Michael; Goldfarb, Dario L.; Jones, Pamela; McCullough, Kenneth John; Moreau, Wayne Martin; Pope, Keith R.; Simons, John P.; Taft, Charles J., Liquid or supercritical carbon dioxide composition.
Aronowitz Sheldon ; Sukharev Valeriy ; Zubkov Vladimir, Low dielectric constant multiple carbon-containing silicon oxide dielectric material for use in integrated circuit structures, and method of making same.
Jon Min-Chung (Princeton Junction NJ) Nicholl Hugh (Berthoud CO) Read Peter Hartpence (Morrisville PA), Method and apparatus for CO2cleaning with mitigated ESD.
Bjornard Erik J. (Northfield MN) Kurman Eric W. (Northfield MN) Shogren David A. (Lakeville MN) Hoffman Jeffrey J. (Inver Grove Heights MN), Method and apparatus for cleaning substrates in preparation for deposition of thin film coatings.
Bingham Dennis N. ; Swainston Richard C. ; Palmer Gary L., Method and apparatus for cutting, abrading, and drilling with sublimable particles and vaporous liquids.
Sneed John D. (Long Beach CA) Krone-Schmidt Wilfried (Fullerton CA) Slattery Michael J. (Gardena CA) Bowen Howard S. (Los Angeles CA), Method for cleaning surface by heating and a stream of snow.
Smith ; Jr. Charles W. (Fairview PA) Rosio Larry R. (Fairview PA) Shore Stephen H. (Erie PA), Method of cleaning workpiece with solvent and then with liquid carbon dioxide.
Jones Curtis S. (Boise ID) Crane William J. (Boise ID) Gilchrist Robin L. (Boise ID) Langley Rod C. (Boise ID), Method to remove fluorine residues from bond pads.
Bauer Tibor L. (Hopewell Junction NY) Cavaliere William A. (Verbank NY) Linnell David C. (Poughkeepsie NY) Wu Jin J. (Ossining NY), Nozzle apparatus for producing aerosol.
Heyns Garrett J. (Boulder CO) McClure Terry R. (Kersey CO) Nicholl Hugh (Berthoud CO) Read Peter H. (Morrisville PA) Schulte Steven M. (Westminster CO) Tabrizi Mohammad F. (Westminster CO), Probemat cleaning system using CO2pellets.
Herden Hansjoerg (Rodgau DEX) Federhen Stefan (Frankfurt DEX) Mayer-Schwinning Gernot (Bad Homburg DEX) Roth Hubert (Bad Vilbel DEX), Process and apparatus for separating polycyclic and polyhalogenated hydrocarbons from exhaust gas of a sintering process.
Jur, Jesse Stephen; McCullough, Kenneth J.; Moreau, Wayne Martin; Simons, John Patrick; Taft, Charles Jesse, Process for cleaning a workpiece using supercritical carbon dioxide.
Gifford George G. (Poughkeepsie NY) Lii Yeong-Jyh T. (Peekskill NY) Wu Jin J. (Ossining NY), Process for fabricating a semiconductor structure having sidewalls.
Lansberry Don D. (Kaysville UT) Council Thomas G. (Camarillo CA), Supercritical fluid recirculating system for a precision inertial instrument parts cleaner.
McDermott Wayne T. (Allentown PA) Ockovic Richard C. (Allentown PA) Wu Jin J. (Ossining NY) Cooper Douglas W. (Millwood NY) Schwarz Alexander (Allentown PA) Wolfe Henry L. (Pleasant Valley NY), Surface cleaning using a cryogenic aerosol.
Wong Kaichiu ; Ramkumar Krishnaswamy ; Bamnolker Hanna ; Puri Suraj ; Bhushan Rajiv ; Wong David ; Elmore Gary ; Mohindra Raj, Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.