[미국특허]
Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/30
H01L-021/02
H01L-021/46
출원번호
US-0933889
(2004-09-02)
발명자
/ 주소
Reeder,W. Jeff
Jiang,Tongbi
출원인 / 주소
Micron Technology, Inc.
대리인 / 주소
TraskBritt
인용정보
피인용 횟수 :
3인용 특허 :
42
초록▼
A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive
A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the curable component of the hybrid adhesive material may be cured to more permanently secure the semiconductor device components to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200째 C. and as low as about 120째 C. or less.
대표청구항▼
What is claimed is: 1. A method for securing at least two semiconductor device components to one another, comprising: applying an adhesive material comprising a pressure sensitive component and a curable component to at least a portion of a surface of a first semiconductor device component; placin
What is claimed is: 1. A method for securing at least two semiconductor device components to one another, comprising: applying an adhesive material comprising a pressure sensitive component and a curable component to at least a portion of a surface of a first semiconductor device component; placing a surface of a second semiconductor device component in contact with the adhesive material to temporarily secure the second semiconductor device component to the first semiconductor device component; and curing the curable component of the adhesive material. 2. The method of claim 1, wherein placing comprises pressing the surface of the second semiconductor device component against the adhesive material. 3. The method of claim 1, wherein, in placing the surface of the second semiconductor device component in contact with the adhesive material, the pressure sensitive component of the adhesive material temporarily secures the second semiconductor device component to the first semiconductor device component. 4. The method of claim 1, wherein applying comprises applying the adhesive material to a carrier. 5. The method of claim 4, wherein applying comprises applying the adhesive material to at least a portion of a surface of at least one of a lead frame, a circuit board, an interposer, and at least one semiconductor die. 6. The method of claim 1, wherein placing comprises placing at least one semiconductor die in contact with the adhesive material. 7. The method of claim 1, wherein placing comprises placing a heat sink in contact with the adhesive material. 8. The method of claim 1, wherein applying comprises at least one of spraying the adhesive material, spreading the adhesive material, metered-dispensing of the adhesive material, extruding the adhesive material, contact applying the adhesive material, and positioning a structure coated with the adhesive material. 9. The method of claim 8, wherein spraying comprises atomizing the adhesive material. 10. The method of claim 1, wherein applying comprises spreading the adhesive material over only a portion of the surface of the first semiconductor device component. 11. The method of claim 1, wherein applying comprises applying a film including the adhesive material on at least portions of opposite surfaces thereof to at least the surface of the first semiconductor device component. 12. The method of claim 1, wherein curing the curable component of the adhesive material comprises heating at least the adhesive material. 13. The method of claim 12, wherein heating comprises heating at least the adhesive material to a temperature of less than about 200째 C. 14. The method of claim 12, wherein heating comprises heating at least the adhesive material to a temperature of about 120째 C. 15. The method of claim 1, further comprising: repositioning the first and second semiconductor device components relative to one another before curing the curable component of the adhesive material. 16. A method for securing at least two semiconductor device components to one another, comprising: applying an adhesive material comprising a pressure sensitive component and a curable component to at least one of the at least two semiconductor device components; positioning the at least two semiconductor device components adjacent to one another with adhesive material positioned therebetween to at least temporarily secure the at least two semiconductor device components to one another; and altering a state of the curable component of the adhesive material to permanently secure the at least two semiconductor device components to one another. 17. The method of claim 16, wherein, during positioning, the pressure sensitive component of the adhesive material temporarily secures the at least two semiconductor device components to one another. 18. The method of claim 16, wherein, during altering, the curable component of the adhesive material permanently secures the at least two semiconductor device components to one another. 19. The method of claim 16, wherein positioning comprises pressing at least one of the at least two semiconductor device components toward the other of the at least two semiconductor device components. 20. The method of claim 16, wherein applying comprises applying the adhesive material to a semiconductor device component that comprises a carrier. 21. The method of claim 20, wherein applying the adhesive material to a semiconductor device component that comprises a carrier includes applying the adhesive material to one of a lead frame, a circuit board, an interposer, and at least one semiconductor die. 22. The method of claim 16, wherein positioning comprises positioning a carrier adjacent to another semiconductor device component. 23. The method of claim 16, wherein positioning comprises positioning a heat sink adjacent to another semiconductor device component. 24. The method of claim 16, wherein applying comprises at least one of spraying the adhesive material, spreading the adhesive material, metered-dispensing of the adhesive material, extruding the adhesive material, contact applying the adhesive material, and positioning a structure coated with the adhesive material. 25. The method of claim 24, wherein spraying comprises atomizing the adhesive material. 26. The method of claim 16, wherein applying comprises applying a film including the adhesive material on at least portions of opposite surfaces thereof to at least a portion of a surface of at least one of the at least two semiconductor device components. 27. The method of claim 16, wherein altering comprises heating at least the curable component of the adhesive material. 28. The method of claim 27, wherein heating comprises heating at least the curable component to a temperature of less than about 200째 C. 29. The method of claim 27, wherein heating comprises heating at least the thermoset component of the adhesive material to a temperature of about 120째 C. 30. The method of claim 16, further comprising: repositioning the at least two semiconductor device components relative to one another before altering the state of the curable component.
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