초록

Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

대표청구항 ▼

What is claimed is: 1. An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate through junctions comprising CuSn com

What is claimed is: 1. An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate through junctions comprising CuSn compounds and Cu balls, said CuSn compounds resulting from a mixture of said Cu balls and an Sn-based solder subjected to a bonding operation at a temperature above the melting point temperature of said Sn-based solder but less than the melting point temperature of said Cu balls, wherein said Cu--Sn compound includes Cu6Sn5 and Cu 3Sn and said Cu3Sn is disposed in a region between said Cu-balls and said Cu6Sn5. 2. An electronic device according to claim 1, wherein said Cu6Sn5 has a thickness of about a few micrometers. 3. An electronic device according to claim 1, wherein said Cu6Sn5 is formed by reflowing said Cu-balls and Sn-base solder at a temperature higher than a melting point of said Sn-base solder and lower than a melting point of said Cu-balls. 4. An electronic device according to claim 3, wherein said Sn-base solder comprises eutectic Sn--Cu solder, eutectic Sn--Cu solder to which at least one of In, Zn and Bi is added, eutectic Sn--Ag solder, eutectic Sn--Ag solder to which at least one of In, Zn and Bi is added, eutectic Sn--Ag--Cu solder, or eutectic Sn--Ag--Cu solder to which at least one of In, Zn and Bi is added. 5. An electronic device according to claim 3, wherein said Cu-balls have a diameter greater than 5 micrometers. 6. An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate by way of junctions, each junction including a Cu--Sn compound containing Cu6Sn5 and Cu3Sn and Cu balls resulting from a mixture of said Cu balls and an Sn-based solder subjected to a bonding operation at a temperature above the melting point temperature of said Sn-based solder but less than the melting point temperature of said Cu balls, said Cu3Sn being formed at peripheries of said Cu balls. 7. An electronic device according to claim 6, wherein said Cu--Sn compound is formed by reflowing said Cu-balls and Sn-base solder at a temperature higher than a melting point of said Sn-base solder and lower than a melting point of said Cu-balls. 8. An electronic device according to claim 7, wherein said Sn-base solder comprises eutectic Sn--Cu solder, eutectic Sn--Cu solder to which In, Zn or Bi is added, eutectic Sn--Ag solder, eutectic Sn--Ag solder to which In, Zn or Bi is added, eutectic Sn--Ag--Cu solder or eutectic Sn--Ag--Cu solder to which In, Zn or Bi is added. 9. An electronic device according to claim 7, wherein said Cu-balls have a diameter greater than 5 micrometers.