초록 ▼

A plurality of film formation layers on which respective film formation patterns are formed; interlayer films formed among the plurality of film formation layers; test element patterns formed in test element formation regions with the same material as that of each film formation pattern of at least

A plurality of film formation layers on which respective film formation patterns are formed; interlayer films formed among the plurality of film formation layers; test element patterns formed in test element formation regions with the same material as that of each film formation pattern of at least one film formation layer among the plurality of film formation layers; openings formed in the test element formation regions of an interlayer film of a planarized uppermost layer, thereby exposing a pair of pads connected to the test element patterns; and dummy patterns formed below the corresponding one of the pair of pads with the same material as that of each of the film formation patterns of predetermined film formation layers among the plurality of film formation layers, thereby defining the vertical locations of the pads and the contact holes, etc. in the test element formation regions.

대표청구항 ▼

What is claimed is: 1. A substrate for an electro-optical device, comprising: a plurality of sub-interlayer-film wiring patterns formed in film formation layers which are disposed above a test-element-provided substrate; interlayer film formed on the plurality of sub-interlayer-film wiring pattern

What is claimed is: 1. A substrate for an electro-optical device, comprising: a plurality of sub-interlayer-film wiring patterns formed in film formation layers which are disposed above a test-element-provided substrate; interlayer film formed on the plurality of sub-interlayer-film wiring patterns, the surfaces of the interlayer films being planarized; a plurality of contact holes formed in the planarized interlayer film corresponding to some of the plurality of sub-interlayer-film wiring patterns; and laminated films provided between the substrate and the plurality of sub-interlayer-film wiring patterns, the thicknesses of regions of the laminated films corresponding to the plurality of contact holes being equal or substantially equal. 2. A substrate for an electro-optical device, comprising: a test-element-provided substrate having a plurality of indentation portions formed on the surface of the substrate and other portions, a plurality of sub-interlayer-film wiring patterns formed in film formation layers disposed in at least one of the indented portions and the other portions; interlayer films formed on the plurality of sub-interlayer-film wiring patterns, the surface of the interlayer films being planarized; a plurality of contact holes formed in the planarized interlayer films corresponding to some of the plurality of sub-interlayer-film wiring patterns; and laminated films provided between the substrate and the plurality of sub-interlayer-film wiring patterns, the thicknesses of regions of the laminated films corresponding to the plurality of contact holes minus the indentation depth in the normal direction of the surface of the substrate being equal or substantially equal. 3. A test-element-provided substrate, comprising: a plurality of film formation layers on which respective film formation patterns are formed; interlayer films interlayered betweeen corresponding ones of the plurality of film formation layers; test element patterns formed in test element formation regions with the same material as that of each film formation pattern of at least one film formation layer among the plurality of film formation layers; openings formed in the test element formation regions of a planarized uppermost layer of the interlayer films, the openings exposing a plurality of pads connected to the test element patterns; and dummy patterns formed below the corresponding of the plurality of pads, the dummy patterns being formed with the same material as that of each of the film formation patterns of predetermined film formation layers among the plurality of film formation layers. 4. The test-element-provided substrate according to claim 3, the dummy patterns being provided to independently control the distances from the surfaces of the planarized interlayer films to the plurality of pads, thereby exposing all the plurality of pads which need to be exposed by an interlayer film removing process at the time of forming the openings, from the surfaces of the planarized interlayer films to the plurality of pads. 5. The test-element-provided substrate according to claim 3, the dummy patterns being independently formed below the plurality of pads, whereby the distances from the surfaces of the planarized interlayer films to the plurality of pads are equalized. 6. The test-element-provided substrate according to claim 3, the dummy patterns being formed below the plurality of pads as film formation patterns of the same film formation layers. 7. The test-element-provided substrate according to claim 6, the dummy patterns being formed below the plurality of pads as two separated patterns. 8. The test-element-provided substrate according to claim 3, the openings being opened by etching the planarized interlayer films, and the dummy patterns having respective margins corresponding to allowable over-etching amounts for the plurality of pads, thereby independently controlling the distances from the surfaces of planarized interlayer films to the plurality of pads. 9. A test-element-provided substrate, comprising: a plurality of film formation layers on which respective film formation patterns are formed; interlayer films interlayered between corresponding ones of the plurality of film formation layers; first contact holes formed in a planarized interlayer film on a predetermined wiring layer among the plurality of film formation layers, the first contact holes being electrically connected to the wiring layers; a wiring pattern formed in a test element formation region, the wiring pattern being formed with same material as the predetermined wiring layer of the film formation patterns of during a film formation process of the predetermined wiring layers; second contact holes formed in the planarized interlayer films on the wiring patterns, the second contact holes being electrically connected to the wiring patterns; openings formed in the test element formation regions of a planarized uppermost layer of the interlayer films, the openings exposing pads connected to the wiring patterns through the second contact holes; and dummy patterns formed below the wiring patterns. 10. The test-element-provided substrate according to claim 9, the dummy patterns being formed below the wiring patterns, whereby the distances from the surfaces of the planarized interlayer films to the wiring layers and the distances from the surfaces of the planarized interlayer films to the wiring patterns are equalized. 11. The test-element-provided substrate according to claim 10, the dummy patterns being formed below the wiring patterns with the same materials as those of the film formation patterns of the film formation layers which are formed below the predetermined wiring layers. 12. The test-element-provided substrate according to claim 11, the dummy patterns extending from at least some of the film formation patterns of the film formation layers. 13. A method of manufacturing a test-element-provided substrate, comprising: forming a plurality of dummy patterns for controlling the heights of surfaces of pads in a plurality of a pad formation region in a test element formation region with a same material as film formation patterns of a predetermined film formation layer among a plurality of film formation layers to be laminated, forming interlayer films on the predetermined film formation layer; forming test element patterns in the test element formation region at the same time as forming the film formation patterns; and forming openings in the test element formation region of a planarized uppermost layer of the interlayer films to expose a plurality of pads connected to the test element patterns. 14. A method of manufacturing a test-element-provided substrate, comprising: forming a plurality of dummy patterns for controlling the heights of bottoms of contact holes in a plurality of contact hole formation regions in test element formation regions with a same material as film formation patterns of predetermined film formation layers among a plurality of film formation layers to be laminated; forming predetermined wiring layers among the plurality of film formation layers, and wiring patterns in test element formation regions with the same material in a same film formation; forming first contact holes through planarized interlayer films on the wiring layers, thereby making conduction to the wiring layers possible, and forming second contact holes in the planarized interlayer films on the wiring patterns, thereby making conduction to the wiring patterns possible; and forming openings in the test element formation regions a planarized uppermost layer of the interlayer films, thereby exposing pads connected to the second contact holes. 15. A substrate for an electro-optical device, comprising: a pixel electrode layer where film formation patterns of pixel electrodes are provided corresponding to intersections of a plurality of data lines and a plurality of scan lines which are disposed in a matrix shape in a plane; a first film formation layer where film formation patterns of the plurality of data lines are formed; a second film formation layer where film formation patterns of the plurality of scan lines and film formation patterns of switching elements for supplying signals to the pixel electrodes are formed; interlayer films interlayered between the pixel electrode layer, the first film formation layer, and the second film formation layer; test element patterns formed in test element formation regions with the same material as that of each of the film formation patterns of at least one of the pixel electrode layer, the first film formation layer, and the second film formation layer, or other film formation layers; openings formed in the test element formation regions of a planarized uppermost layer of an interlayer film, the openings exposing a plurality of pads connected to the test element patterns; and dummy patterns formed below a corresponding ones of the plurality of pads with the same material as the film formation patterns of predetermined film formation layer among the plurality of film formation layers. 16. The substrate for an electro-optical device according to claim 15, the dummy patterns extending from at least some of the film formation patterns of the predetermined film formation layers among the plurality of film formation layers. 17. A substrate for an electro-optical device, comprising: a pixel electrode layer where film formation patterns of pixel electrodes are formed corresponding to the intersections of a plurality of data lines and a plurality of scan lines which are disposed in a matrix shape in a plane; a first film formation layer where film formation patterns of the plurality of data lines are formed; a second film formation layer where film formation patterns of the plurality of scan lines and film formation patterns of switching elements for supplying signals to the pixel electrodes are formed; interlayer films interlayered between the pixel electrode layer, the first film formation layer, and the second film formation layer; first contact holes formed through a planarized interlayer film on predetermined wiring layer of at least one of the pixel electrode layer, the first film formation layer, and the second film formation layerand another, film formation layers thereby being connected to the wiring layers; wiring patterns formed on test element formation regions with the same material as the film formation patterns of the wiring layers second contact holes formed in the planarized interlayer films, the second contact holes being electrically connected to the wiring patterns; openings formed in the test element formation regions of an interlayer film of a planarized uppermost layer, the openings exposing pads that are connected to the wiring patterns through the second contact holes; and dummy patterns formed below the wiring patterns. patterns, thereby being electrically connected to the wiring patterns; openings formed in the test element formation regions of an interlayer film of a planarized uppermost layer, thereby exposing pads connected to the wiring patterns through the second contact holes; and dummy patterns formed below the wiring patterns. 18. An electro-optical device constructed by using the substrate for an electro-optical device according to claim 16. 19. An electro-optical device constructed by using the substrate for an electro-optical device according to claim 17. 20. An electronic apparatus constructed by using an electro-optical device constructed by using the substrate for an electro-optical device according to claim 16. 21. An electronic apparatus constructed by using an electro-optical device constructed by using the substrate for an electro-optical device according to claim 17.