IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0069757
(2005-02-28)
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발명자
/ 주소 |
- Beaty,Elwin M.
- Mork,David P.
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출원인 / 주소 |
- Scanner Technologies Corporation
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
5 인용 특허 :
82 |
초록
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A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light r
A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined.
대표청구항
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What is claimed is: 1. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on the BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three di
What is claimed is: 1. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on the BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead; receiving at least the bottom view and the side perspective view of the lead using a single camera; transmitting the bottom view and the side perspective view of the lead to memory as pixel values; determining a first lead reference pixel position in the bottom view; determining a second lead reference pixel position in the side view; and converting the first and second lead reference pixel positions into a world value by using pixel values and parameters determined during a calibration. 2. The BGA do ice of claim 1, wherein illuminating the lead is achieved using a single light source. 3. The BGA device of claim 1, wherein illuminating the lead is achieved using more than one light source. 4. The BGA do ice of claim 3, wherein the more than one light sources used are spectrally diverse from one another. 5. The BGA do ice of claim 1, wherein the lead on the BGA device being inspected comprises a contact. 6. The BGA device of claim 1, wherein the lead on the BGA device being inspected comprises a pin. 7. The BGA device of claim 1, wherein the lead on the BGA device being inspected is selected from the group consisting of; bump contact, ball contact, pad, and pedestal. 8. The BGA device of claim 1, wherein the bottom view of the lead and a side perspective view of the lead are obtained in a single image. 9. The BGA device of claim 1, wherein the bottom view of the lead and a side perspective view of the lead are obtained in more than one image. 10. The BGA device of claim 1, wherein the illuminating is with a diffuse light. 11. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on the BGA device; and selecting the BGA device as a produced BGA device bas d upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead; receiving at least the bottom view and the side perspective view of the lead using a single camera; transmitting the bottom view and the side perspective view of the lead to memory as pixel values; determining a first lead reference pixel position in the bottom view; determining a second lead reference pixel position in the side view; and converting the first lead reference pixel position into a first world value and the second lead reference pixel position into a second world value by using pixel values and parameters determined during a calibration. 12. The BGA d vice of claim 11, wherein illuminating the lead is achieved using a single light source. 13. The BGA device of claim 11, wherein illuminating the lead is achieved using more than one light source. 14. The BGA d vice of claim 13, wherein the more than one light sources used are spectrally diverse from one another. 15. The BGA device of claim 11, wherein the lead on the BGA device being inspected comprises a contact. 16. The BGA device of claim 11, wherein the lead on the BGA device being inspected comprises a pin. 17. The BGA device of claim 11, wherein the lead on the BGA device being inspected is selected from the group consisting of: bump contact, ball contact, pad, and pedestal. 18. The BGA device of claim 11, wherein the bottom view of the lead and a side perspective view of the lead are obtained in a single image. 19. The BGA device of claim 11, wherein the bottom view of the lead and a side perspective view of the lead are obtained in more than one image. 20. The BGA device of claim 11, wherein the illuminating is with a diffuse light. 21. A ball grid array (BGA) device produced according to a process comprising: making a three dimension inspection of a lead on the BGA device with the BGA device being positioned in an optical system; and selecting the BGA device as a produced BGA device based upon the results of the e dimensional inspection; wherein the three dimensional inspection comprises: illuminating at least one ball on the BGA device using a fixed illumination system; disposing a single sensor, a first optical element and a second optical element in relation to the BGA device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing output representing the at least two differing views; and processing the output using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. 22. The EGA device of claim 21, wherein the pro-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. 23. The BGA device of claim 21, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an XY measurement value is proportional to a Z measurement value. 24. The BGA device of claim 21, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein a Y measurement value is proportional to a Z measurement value. 25. The BGA device of claim 21, wherein the triangulation method is based on determining a center of the at leas one ball in a first view and determining a ball top location in a second view. 26. The BGA device of claim 21, wherein the pre-calculated calibration plane is defined by measuring a calibration pattern. 27. The BGA device of claim 21, wherein one of the at least two differing views is obtained at a low angle of view. 28. The BGA device of claim 21, wherein the sensor and the second optical element are positioned to receive light from different angles relative to the calibration plane. 29. The BGA device of claim 21, wherein the processing includes applying grayscale edge detection to locate ball positions. 30. The BGA device of claim 21, wherein the processing includes applying threshold analysis. 31. The BGA device of claim 21, wherein the BGA device comprises a bump an wafer device. 32. The BGA device of claim 21, wherein processing the output is carried out using a general purpose computer. 33. The BGA device of claim 21, wherein one of the views comprises a segment having a crescent shape. 34. The BGA device of claim 21, wherein the two different views of the at least one ball are obtained in a single image. 35. The BGA device of claim 21, wherein the two different views of the at least one ball are each obtained in a separate image. 36. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of BGA device wherein the BGA device comprises a plurality of balls, with the BGA device being positioned in an optical system; and selecting the device, as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the BGA device using a fixed illumination system; disposing a single sensor to receive light at a first angle relative to the BGA device; positioning a first optical element to transmit light to the sensor, where the sensor obtains a first view of the BGA device; disposing a second optical element to receive light at a second angle different from the first angle and to provide a second view of the BGA device to the sensor; transmitting image information from the sensor; and processing the image information by applying triangulation calculations to measurements of the image information so as to calculate a three dimensional position of at least one ball with reference to a pre-calculated calibration plane. 37. The BGA device of claim 36, wherein the illuminating comprises illuminating with a ring light. 38. The BGA device of claim 36, wherein the illuminating comprises illuminating with a plurality of light emitting diodes. 39. The BGA device of claim 38, wherein at least two of the plurality of light emitting diodes are spectrally diverse from one another. 40. The BGA device of claim 36, wherein the illuminating comprises illuminating with reflected light. 41. The BGA device of claim 36, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. 42. The BGA device of claim 36, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an XY measurement value is proportional to a Z measurement value. 43. The BGA device of claim 36, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein a Y measurement value is proportional to a Z measurement value. 44. The BGA device of claim 36, wherein the pre-calculated calibration plane is defined by measuring a calibration pattern. 45. The BGA device of claim 36, wherein the processing includes applying grayscale edge detection to locate ball positions. 46. The BGA device of claim 36, wherein the processing includes applying threshold analysis. 47. The BGA device of claim 36, wherein one of the views comprises a segment having a crescent shape. 48. The BGA device of claim 36, wherein the first and second views of the at least one ball are obtained in a single image. 49. The BGA device of claim 36, wherein the first and second views of the at least one ball are each obtained in a separate image. 50. A ball grid array (BGA) device produced according to a process comprising: making a three dimension inspection of a BGA device, wherein the BGA device comprises a plurality of balls, with the BGA device being positioned in an optical system; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the BGA device using a fixed illumination system; taking a first image of the BGA device with a single camera disposed in a fixed focus position relative to the BGA device to obtain a circular doughnut shape image from at least one ball; taking a second image of the BGA device with an optical element disposed in a fixed focus position relative to the BGA device to transmit a side view image of the at least one ball to the camera; and processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. 51. The BGA device of claim 50, wherein the second image comprises a segment having a crescent shape. 52. The BGA device of claim 50, wherein the calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. 53. The BGA device of claim 50, wherein the triangulation method to calculate a three dimensional position of the at least one ball is based on determining a center of the at least one ball in the first image and determining a ball top location in the second image. 54. The BGA device of claim 50, wherein the pre-calculated calibration plane is defined trough measuring a calibration pattern. 55. The BGA device of claim 50, wherein the second image is obtained at a low angle of view. 56. The BGA device of claim 50, wherein the camera and the optical element are fixed at different angles relative to the calibration plane. 57. The BGA device of claim 50, wherein processing the first image and the second image comprises employing grayscale edge detection to locate ball positions. 58. The BGA device of claim 50, wherein illuminating the BGA device employs diffuse illumination. 59. The BGA device of claim 50, wherein the triangulation method uses state values derived from the BGA device. 60. The BGA device of claim 50, wherein the processing includes applying threshold analysis. 61. The BGA device of claim 50, wherein the at least one ball on the BGA device being inspected comprises a contact. 62. The BGA device of claim 50, wherein the at least one ball on the BGA device being inspected comprises a pin. 63. The BGA device of claim 50, wherein the at least one ball on the BGA device being inspected is selected from the group consisting of: bump contact ball contact, pad, and pedestal. 64. The BGA device of claim 50, wherein the circular doughnut shape image and the side view image comprise single image. 65. The BGA device of claim 50, wherein the circular doughnut shape image and the side view image each comprise a separate image. 66. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain two differing views of the lead; disposing at least one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. 67. The BGA device of claim 66, wherein the lead on the BGA device being inspected comprises a contact. 68. The BGA device of claim 66, wherein the lead on the BGA device being inspected is selected from the group consisting of: bump contact, ball contact, pin contact, pad, and pedestal. 69. The BGA device of claim 66, wherein illuminating the lead is achieved using a single light source. 70. The BGA device of claim 66, wherein illuminating the lead is achieved using more than one light source. 71. The BGA device of claim 70, wherein the more than one light sources used are spectrally diverse from one another. 72. The BGA device of claim 66, wherein the illuminating is with a diffuse light. 73. The BGA device of claim 66, wherein the illuminating is with a ring light. 74. The BGA device of claim 66, wherein the illuminating comprises illuminating with a plurality of light emitting diodes. 75. The BGA device of claim 66, wherein a first view of the lead and a second view of the lead are obtained i a single image. 76. The BGA device of claim 66, wherein a first view of the lead and a second view of the lead are obtained in two images. 77. The BGA device of claim 66, wherein a first view of the lead and a second view of the lead are obtained in more than two images. 78. The BGA device of claim 66, wherein the at least two differing views of the lead are obtained using a single sensor. 79. The BGA device of claim 66, wherein the at least two differing views of the lead are obtained using two sensors. 80. The BGA device of claim 66, wherein the at least two differing views of the lead are obtained using more an two sensors. 81. The BGA device of claim 66, wherein the at least one sensor is selected from the group consisting of: digital camera, image sensor, charged coupled device array, and complementary metal-oxide semiconductor. 82. The BGA device of claim 66, wherein one of the views comprises a segment having a donut shape. 83. The BGA device of claim 66, wherein one of the views comprises a segment having a crescent shape. 84. The BGA device of claim 66, wherein one of the views is obtained at a low angle of view. 85. The BGA device of claim 66, wherein one of the views is obtained at a 0 degree angle of view. 86. The BGA device of claim 66, wherein one of the views is obtained at a 90 degree angle of view. 87. The BGA device of claim 66, wherein a displacement in a first view is proportional to a displacement in a second view. 88. The BGA device of claim 66, wherein the first lead reference position is determined from a center of the lead in a first view. 89. The BGA device of claim 66, wherein the second lead reference position is determined from a top location of the lead in a second view. 90. The BGA device of claim 66, wherein the first lead reference position is determined from a pixel position. 91. The BGA device of claim 66, wherein the first lead reference position is determined from a world position. 92. The BGA device of claim 66, wherein the second lead reference position is determined from a pixel position. 93. The BGA device of claim 66, wherein the second lead reference position is determined from a world position. 94. The BGA device of claim 66, wherein the first lead reference position is determined from grayscale edge detection. 95. The BGA device of claim 66, wherein the first lead reference position is determined from threshold analysis. 96. The BGA device of claim 66, wherein the first lead reference position is determined from convolution. 97. The BGA device of claim 66, wherein the second lead reference position is determined from grayscale edge detection. 98. The BGA device of claim 66, wherein the second lead reference position is determined from threshold analysis. 99. The BGA device of claim 66, wherein the second reference position is determined from convolution. 100. The BGA device of claim 66, wherein converting the first and second lead reference positions into a world value is carried out using a triangulation calculation. 101. The BGA device of claim 66, wherein converting the first and second lead reference positions into a world value is carried out using an interpolation calculation. 102. The BGA device of claim 66, wherein converting the first and second lead reference positions into a world value is carried out using a general purpose computer. 103. The BGA device of claim 66, wherein the world value comprises an X, Y, and Z position. 104. The BGA device of claim 66, wherein the world value comprises a Z distance from a calibration plane. 105. The BGA device of claim 66, wherein the world value comprises a Z distance from a regression plane. 106. The BGA device of claim 66, wherein the world value comprises a Z distance from a seating plane. 107. The BGA device of claim 66, wherein the parameters are determined by measuring a calibration pattern of known dimension and spacing. 108. The BGA device of claim 66, wherein the parameters are determined by measuring leads-lead on a BGA device. 109. The BGA device of claim 66, wherein the parameters define a calibration plane. 110. The BGA device of claim 109, wherein the calibration plane comprises a coordinate system having X, Y and Z axes. 111. The BGA device of claim 109, wherein the calibration plane is determined by measuring a calibration pattern. 112. The BGA device of claim 109, wherein the calibration plane is determined by storing the locations of calibration dots in memory. 113. The BGA device of claim 109, wherein the calibration plane is referenced to relate positions of differing views. 114. The BGA device of claim 109, wherein the calibration plane is referenced to perform an interpolation function. 115. The BGA device of claim 109, wherein the calibration plane is referenced to convert pixel values into world values. 116. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device base upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing at least one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. 117. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device based upon the result of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical element to obtain two differing views of the lead; disposing at least one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. 118. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device base upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape; disposing at least one sensor to obtain the first and second views of the lead; transmitting the two differing views of the cad to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. 119. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on the BGA device; and selecting BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape; disposing at least one sensor to obtain the first and second views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory. 120. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device bas upon the result of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. 121. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light that are spectrally diverse from one another; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. 122. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device based upon the result of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference positions in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. 123. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting die two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory. 124. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with ring light and a side light that are spectrally diverse from one another; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. 125. A ball grid array (BGA) device produced according to a process comprising: making a three dimensional inspection of a lead on a BGA device; and selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape; disposing a single sensor to obtain the first and second views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. 126. A ball grid array (BGA) device having a plurality of leads produced according to a process comprising: calibrating a system with a planar precision pattern; illuminating the plurality of leads; providing fixed optical elements; obtaining a single bottom view of the plurality of leads; obtaining a single side view of the plurality of leads; determining a first lead reference position in a bottom view; determining a second lead reference position in a side view; converting the first and second lead reference positions into a Z value; comparing a Z value to a tolerance value; determining a pass result; and selecting the BGA device as a manufactured product.
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