초록 ▼

Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A pr

Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

대표청구항 ▼

What is claimed is: 1. A probe card assembly comprising: a plurality of probes attached to a substrate, said probes disposed to contact ones of input and/or output terminals of a device to be tested; and a stop structure attached to said substrate, said stop structure disposed to engage others of s

What is claimed is: 1. A probe card assembly comprising: a plurality of probes attached to a substrate, said probes disposed to contact ones of input and/or output terminals of a device to be tested; and a stop structure attached to said substrate, said stop structure disposed to engage others of said input and/or output terminals of said device to be tested, wherein said ones of said input and/or output terminals and said others of said input and/or output terminals are configured to provide electrical signals into and/or out of the device to be tested. 2. The probe card assembly of claim 1, wherein said stop structure comprises a sensor. 3. The probe card assembly of claim 1, wherein said probes are disposed in an array, and wherein said probe card assembly further comprises a plurality of stop structures that are each configured to engage said device to be tested. 4. The probe card assembly of claim 3, wherein at least two of said plurality of stop structures are disposed on opposite sides of said array. 5. The probe card assembly of claim 1, further comprising sensing means for determining at least one of: (i) contact between at least one terminal of said device to be tested and said stop structure; and (ii) a force against one of said probes. 6. The probe card assembly of claim 1, wherein: each probe of said plurality of probes comprises a contact tip disposed a first distance from said substrate; and said stop structure comprises a stop feature disposed a second distance from said substrate. 7. The probe card assembly of claim 6, wherein said second distance is less than said first distance. 8. The probe card assembly of claim 1, wherein said probes are compressible and said stop structure limits compression of said probes. 9. The probe card assembly of claim 1, further comprising a second substrate comprising a flexible material and configured to flex in response to a force applied to said stop structure. 10. The probe card assembly of claim 1, wherein said substrate comprises a space transformer coupled to a base. 11. The probe card assembly of claim 1, wherein said stop structure is disposed to physically contact said others of said input and/or output terminals of said device to be tested. 12. A probe card assembly comprising: a plurality of probes attached to a substrate and disposed to contact a device to be tested; a stop structure attached to said substrate and disposed to physically contact said device to be tested; and a sensor configured to output at least one of: a signal indicating contact of said device to be tested with said stop structure, a signal that is proportional to a force of said device to be tested against said probes, or a signal for input into a controller for controlling a relative position of said device to be tested with respect to said probe card assembly. 13. The probe card assembly of claim 12, wherein said stop structure is resilient. 14. The probe card assembly of claim 13, wherein said stop structure is rigid. 15. The probe card assembly of claim 12, wherein said stop structure comprises said sensor. 16. The probe card assembly of claim 12, wherein said probes are disposed in an array, and wherein said probe card assembly further comprises a plurality of stop structures. 17. The probe card assembly of claim 16, wherein at least two of said plurality of stop structures are disposed on opposite sides of said array. 18. The probe card assembly of claim 12, wherein: each probe of said plurality of probes comprises a contact tip disposed a first distance from said substrate; and said stop structure comprises a stop feature disposed a second distance from said substrate. 19. The probe card assembly of claim 18, wherein said second distance is less than said first distance. 20. The probe card assembly of claim 12, wherein said probes are compressible and said stop structure limits compression of said probes. 21. The probe card assembly of claim 12, further comprising a second substrate comprising a flexible material and configured to flex in response to a force applied to said stop structure. 22. The probe card assembly of claim 12, wherein said substrate comprises a space transformer coupled to a base. 23. The probe card assembly of claim 12, wherein said sensor is configured to output a signal indicating contact of said device with said stop structure. 24. The probe card assembly of claim 12, wherein said sensor is configured to output a signal that is proportional to a force of said device to be tested against said probes. 25. The probe card assembly of claim 12, wherein said sensor is configured to output a signal for input into a controller for controlling relative movement of said device to be tested with respect to said probe card assembly. 26. The probe card assembly of claim 12, wherein said device to be tested comprises input and/or output terminals, and said probes are configured to contact ones of said terminals, and said stop structure is configured to engage at least one of said terminals. 27. A probe card assembly comprising: a substrate; a plurality of elongate elements, each said elongate element comprising a first end and a second end, said first end attached to said substrate and said second end disposed away from said substrate; a plurality of probe tips attached to said second ends of ones of said elongate elements, said probe tips disposed to contact terminals of a device to be tested; and a stop plate attached to said second end of one of said elongate elements, said stop plate disposed to physically contact said device to be tested. 28. The probe card assembly of claim 27, wherein said stop plate and said elongate element to which said stop plate is attached compose a stop structure. 29. The probe card assembly of claim 28, wherein said stop structure comprises a sensor. 30. The probe card assembly of claim 29, wherein said probe tips are disposed in an array, wherein said probe card assembly further comprises a plurality of stop structures that are each configured to selectively contact with a portion of said device to be tested. 31. The probe card assembly of claim 30, wherein at least two of said plurality of stop structures are disposed on opposite sides of said array. 32. The probe card assembly of claim 28, wherein said probe tips and said elongate elements to which said probe tips are attached compose compressible probes and said stop structure limits compression of said probes. 33. The probe card assembly of claim 32, wherein said probes are resilient. 34. The probe card assembly of claim 28 further comprising a second substrate comprising a flexible material and configured to flex in response to a force applied to said stop structure. 35. The probe card assembly of claim 28, further comprising a plurality of stop structures. 36. The probe card assembly of claim 27, further comprising sensing means for determining contact between said device to be tested and said stop plate. 37. The probe card assembly of claim 27 further comprising sensing means for outputting a signal that is proportional to a level of force against said stop plate. 38. The probe card assembly of claim 27, wherein: each probe tip is disposed a first distance from said substrate; and said stop plate is disposed a second distance from said substrate. 39. The probe card assembly of claim 38, wherein said second distance is less than said first distance. 40. The probe card assembly of claim 27, wherein said stop plate is attached to said second ends of a plurality of said elongate elements. 41. The probe card assembly of claim 40, wherein said elongate elements to which said stop plate is attached are support columns. 42. The probe card assembly of claim 41, wherein said support columns are flexible. 43. The probe card assembly of claim 41, wherein said support columns are resilient. 44. The probe card assembly of claim 41, wherein said support columns are rigid. 45. The probe card assembly of claim 27, wherein said device to be tested comprises input and/or output terminals, and said probes are configured to contact ones of said terminals. 46. A probe card assembly comprising: a substrate; an array of probes attached to said substrate and disposed to contact a device to be tested; a plurality of stop structures disposed outside of and adjacent to said array of probes, wherein ones of said stop structures comprise a sensor configured to detect physical contact with said device to be tested. 47. The probe card assembly of claim 46, wherein: each of said probes comprises a contact tip disposed a first distance from said substrate; and each of said stop structures comprises a stop feature disposed a second distance from said substrate. 48. The probe card assembly of claim 47, wherein said second distance is less than said first distance. 49. The probe card assembly of claim 46, wherein said probes are compressible and said stop structure limits compression of said probes. 50. The probe card assembly of claim 49, wherein said probes are resilient. 51. The probe card assembly of claim 46, wherein pairs of said stop structures comprising sensors are disposed on opposite sides of said array of probes. 52. The probe card assembly of claim 46, wherein said stop structures are flexible. 53. The probe card assembly of claim 46, wherein said stop structures are resilient. 54. The probe card assembly of claim 46, wherein said device to be tested comprises input and/or output terminals, and said probes are configured to contact ones of said terminals, and said stop structure is configured to engage at least one of said terminals.