IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0300196
(2002-11-20)
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발명자
/ 주소 |
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출원인 / 주소 |
- Cabot Microelectronics Corporation
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
13 |
초록
▼
The invention provides devices and methods for removing and trapping large and/or dense abrasive particles from a polishing slurry. The polishing slurry is introduced into a container and allowed to stagnate, thereby causing large and/or dense particles to separate from the slurry under the influen
The invention provides devices and methods for removing and trapping large and/or dense abrasive particles from a polishing slurry. The polishing slurry is introduced into a container and allowed to stagnate, thereby causing large and/or dense particles to separate from the slurry under the influence of gravity. The container includes a cavity or plurality of cavities defined by an inner surface of the container into which the separated particles sink. To prevent the large and/or dense particles from becoming re-suspended into the slurry, the size and shape of the cavity is relatively deep and narrow with respect to the large and/or dense particles, thus providing a trapping effect. The cavities do not effectively trap the smaller particles.
대표청구항
▼
What is claimed is: 1. A container for transporting and/or storing a polishing slurry having abrasive particles suspended therein, the container comprising: an interior surface defining a volume for storing the slurry, the interior surface further defining a cavity for retaining abrasive particles
What is claimed is: 1. A container for transporting and/or storing a polishing slurry having abrasive particles suspended therein, the container comprising: an interior surface defining a volume for storing the slurry, the interior surface further defining a cavity for retaining abrasive particles settling from the slurry; and an opening for receiving and/or emptying the slurry, wherein the container defines a volumetric capacity and the cavity is sized to retain about 0.1 wt. % to about 5 wt. % of the total abrasive particles in the slurry when the container is filled to capacity, and wherein the cavity has (a) a width from about 0.5 mm to about 10 mm,(b) a depth from about 0.5 mm to about 10 mm, or (c) a width from about 0.5 mm to about 10 mm and a depth from about 0.5 mm to about 10 mm. 2. The container of claim 1, wherein the cavity is a plurality of cavities. 3. The container of claim 1, wherein the plurality of cavities numbers about 5 or more cavities. 4. The container of claim 1, wherein the plurality of cavities numbers about 20 or more cavities. 5. The container of claim 1, wherein the container defines a volumetric capacity and the cavity is sized to retain between about 0.5 wt. % to about 5 wt. % of the total abrasive particles in the slurry when the container is filled to capacity. 6. The container of claim 1, wherein the cavity has a width from about 0.5 mm to about 10 mm. 7. The container of claim 1, wherein the cavity has a depth from about 0.5 mm to about 10 mm. 8. The container of claim 2, wherein the plurality of cavities are shaped in the form of holes. 9. The container of claim 8, wherein the shape of the holes is circular, square, triangular, rectangular, or combinations thereof. 10. The container of claim 1, wherein the cavity is shaped in the form of a groove. 11. The container of claim 10, wherein the cavity has a dimension that is about the same as or greater than the largest dimension of the container. 12. The container of claim 10, wherein the groove is arranged as a spiral, a cross hatch, or combinations thereof. 13. The container of claim 2, wherein the plurality of cavities are in the form of grooves. 14. The container of claim 13, wherein the grooves are arranged as concentric circles, multiple spirals, straight lines, arcs, or combinations thereof. 15. The container of claim 2, wherein the cavities are separated from each other by a distance of about 2 mm to a distance of about 20 mm. 16. The container of claim 2, wherein the plurality of cavities are separated by a distance of about 2 mm or less. 17. The container of claim 1, wherein the container is cylindrical, square, or rectangular in shape. 18. The container of claim 1, wherein the container has a volumetric capacity of about 1 liter to about 2,000 liters. 19. The container of claim 1, wherein the container is made of plastic. 20. A method of removing large and/or dense abrasive particles from a polishing slurry comprising abrasive particles suspended in a liquid carrier, the method comprising: providing a container having an interior surface defining a volume for storing the slurry and a cavity for retaining abrasive particles settling from the slurry; introducing the slurry into the container; allowing abrasive particles in the slurry to settle by gravimetric separation such that a portion of the abrasive particles is disposed in the cavity; removing the slurry from the container while retaining the portion of the abrasive particles in the cavity, wherein the retained abrasive particles are about 0.5 wt. % to about 5 wt. % of the total wt. % of abrasive particles in the slurry when the container is filled to capacity. 21. The method of claim 20, wherein the interior surface defines a plurality of cavities. 22. The method of claim 20, wherein the retained abrasive particles are about 0.5 wt. % to about 5 wt. % of the total wt. % of abrasive particles in the slurry when the container is filled to capacity. 23. The method of claim 20, further comprising the step of stirring the slurry. 24. The method of claim 20, further comprising the step of filtering the slurry. 25. A polishing apparatus comprising the following: a container including an opening for receiving a slurry having abrasive particles suspended therein, the container further including an interior surface defining a volume for storing the slurry and a cavity, wherein the cavity is sized to retain about 0.1 wt. % to about 5 wt. % of the total abrasive particles in the slurry when the container is filled to capacity, a polishing tool including a platen, a polishing pad, and a carrier for holding a wafer to be polished; and a means for transporting the slurry from the container to the polishing tool. 26. The polishing apparatus of claim 25, wherein the interior surface defines a plurality of cavities. 27. The polishing apparatus of claim 25, wherein the apparatus further comprises a stirrer for stirring or agitating the slurry in the container. 28. The method of claim 20, wherein the cavity has (a) a width from about 0.5 mm to about 10 mm, (b) a depth from about 0.5 mm to about 10 mm, or (c) a width from about 0.5 mm to about 10 mm and a depth from about 0.5 mm to about 10 mm. 29. The apparatus of claim 25, wherein the cavity has (a) a width from about 0.5 mm to about 10 mm, (b) a depth from about 0.5 mm to about 10 mm, or (c) a width from about 0.5 mm to about 10 mm and a depth from about 0.5 mm to about 10 mm.
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