Sheet and electronic component packaging container
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-027/18
B32B-027/30
B32B-027/32
B32B-033/00
B65D-085/00
출원번호
US-0343308
(2002-06-14)
국제출원번호
PCT/JP02/005971
(2002-06-14)
§371/§102 date
20030130
(20030130)
국제공개번호
WO03/106165
(2003-12-24)
발명자
/ 주소
Oda,Minoru
Ogita,Katsuhisa
Miyakawa,Takeshi
Fujimura,Tetsuo
Shimizu,Mikio
출원인 / 주소
Denki Kagaku Kogyo Kabushiki Kaisha
대리인 / 주소
Oblon, Spivak, McClelland, Maier &
인용정보
피인용 횟수 :
2인용 특허 :
9
초록▼
In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and
In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.
대표청구항▼
what is claimed is: 1. A sheet, which comprises: a continuous layer comprising thermoplastic resin and an electrically conductive filler having a surface resistivity of from 10 2 to 1012 Ω/□, and a surface layer having a surface resistivity of from 109 to 1014 Ω/□ formed on b
what is claimed is: 1. A sheet, which comprises: a continuous layer comprising thermoplastic resin and an electrically conductive filler having a surface resistivity of from 10 2 to 1012 Ω/□, and a surface layer having a surface resistivity of from 109 to 1014 Ω/□ formed on both sides or on one side of said continuous layer; wherein the surface resistivity of the surface layer is higher than the surface resistivity of the continuous layer. 2. The sheet according to claim 1, wherein a substrate layer is further laminated on the continuous layer having a structure of surface layer/continuous layer/substrate layer. 3. The sheet according to claim 1, wherein a substrate layer is further laminated on the continuous layer with a structure of surface layer/continuous layer/substrate layer/continuous layer/surface layer. 4. The sheet according to claim 1, wherein the surface layer comprises a material which is close to an electronic component to be contained in the sheet using said surface layer, in the series of frictional electrification. 5. The sheet according to claim 4, wherein the surface layer comprises an acrylate type polymer and polyvinylidene fluoride. 6. The sheet according to claim 4, wherein the surface layer comprises an olefin type polymer and an aromatic vinyl compound type polymer. 7. The sheet according to claim 4, wherein the surface layer comprises a mixture of polycarbonate and a copolymer of acrylonitrile and an aromatic vinyl compound. 8. An electronic component packaging container which comprises the sheet as defined in claim 1. 9. A carrier tape which comprises the sheet as defined in claim 1. 10. A method of protecting an electronic component from static electricity impairment due to static electricity, which comprises: enclosing the electronic component with the sheet as claimed in claim 1 and transporting or storing the enclosed sheet comprising the electronic component. 11. The sheet according to claim 1, wherein the continuous layer has a surface resistivity of from 104 to 108 Ω/□. 12. The sheet according to claim 1, wherein the continuous layer has a surface resistivity of from 104 to 108 Ω/□. 13. A sheet, which comprises: a continuous layer comprising thermoplastic resin and an electrically conductive filler having a surface resistivity of from 10 2 to 1012 Ω/□, and a surface layer having a thickness of at most 20 μm and comprising a thermoplastic resin formed on both sides or on one side of said continuous layer; wherein the surface resistivity of the surface layer is higher than the surface resistivity of the continuous layer. 14. The sheet according to claim 13, wherein a substrate layer is further laminated on the continuous layer with a structure of surface layer/continuous layer/substrate layer. 15. The sheet according to claim 13, wherein a substrate layer is further laminated on the continuous layer with a structure of surface layer/continuous layer/substrate layer/continuous layer/surface layer. 16. The sheet according to claim 13, wherein the surface layer comprises a material which is close to an electronic component to be contained in the sheet using said surface layer, in the series of frictional electrification. 17. The sheet according to claim 16, wherein the surface layer comprises an acrylate type polymer and polyvinylidene fluoride. 18. The sheet according to claim 16, wherein the surface layer comprises an olefin type polymer and an aromatic vinyl compound type polymer. 19. The sheet according to claim 16, wherein the surface layer comprises a mixture of polycarbonate and a copolymer of acrylonitrile and an aromatic vinyl compound. 20. An electronic compound packaging container which comprises the sheet as defined in claim 13. 21. A carrier tape which comprises the sheet as defined in claim 13. 22. A method of protecting an electronic component from static electricity impairment due to static electricity, which comprises: enclosing the electronic component with the sheet as claimed in claim 13 and transporting or storing the enclosed sheet comprising the electronic component. 23. The sheet according to claim 13, wherein the surface layer has a thickness of 0.1 to 20 μm. 24. The sheet according to claim 13, wherein the surface layer has a thickness selected from the group consisting of 2 μm, 5 μm, and 10 μm.
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이 특허에 인용된 특허 (9)
Anderson Barbara J. (Saltsburg PA), Amine-free internal antistatic agent.
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