IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0188690
(2002-07-02)
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발명자
/ 주소 |
- Crowe,Richard
- Babko Malyi,Sergei
- Kovach,Kurt
- Tropper,Seth
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| 출원인 / 주소 |
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| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
11 인용 특허 :
90 |
초록
▼
A plasma emitter apparatus and method for using the same that includes a primary electrode and a secondary electrode. The secondary electrode is porous, that is, it is configured to permit the passage of plasma discharge therethrough. Accordingly, the plasma is received at one side of the secondary
A plasma emitter apparatus and method for using the same that includes a primary electrode and a secondary electrode. The secondary electrode is porous, that is, it is configured to permit the passage of plasma discharge therethrough. Accordingly, the plasma is received at one side of the secondary electrode and emitted from its opposing plasma exiting side. The secondary electrode may be a laminate of multiple insulating material layers with at least one conductive layer sandwiched therebetween. A plurality of apertures are defined through the laminate and a dielectric sleeve is inserted into and retained in the aperture. The generated plasma passes through one or more holes defined in each of the dielectric sleeves. Alternatively, the secondary electrode may be formed as a plurality of unidirectional high voltage wires strung substantially parallel across a frame or a plurality of bidirectional high voltage wires interwoven and secured by a perimeter frame.
대표청구항
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What is claimed is: 1. A plasma emitter apparatus, comprising: a primary dielectric; a primary electrode disposed proximate said primary dielectric, said primary electrode being at a first voltage potential, said primary dielectric associated with the primary electrode; a secondary electrode being
What is claimed is: 1. A plasma emitter apparatus, comprising: a primary dielectric; a primary electrode disposed proximate said primary dielectric, said primary electrode being at a first voltage potential, said primary dielectric associated with the primary electrode; a secondary electrode being at a second voltage potential different from that of the first voltage potential so as to produce a plasma discharge, said secondary electrode permitting passage of the plasma discharge therethrough, said secondary electrode having a first surface facing said primary electrode and a secondary opposing surface of said secondary electrode, wherein said secondary electrode includes a plurality of unidirectional conductive layers disposed substantially parallel to one another; and secondary dielectrics, associated with each of the plurality of unidirectional conductive layers, so that said secondary electrode is not exposed. 2. The plasma emitter apparatus in accordance with claim 1, wherein said secondary electrode further includes a second plurality of unidirectional conductive layers interwoven with the plurality of unidirectional conductive layers. 3. A plasma emitter apparatus, comprising: a housing; a primary dielectric disposed within said housing; a primary electrode disposed proximate said primary dielectric, said primary dielectric associated with the primary electrode; a secondary electrode having a first surface facing said primary electrode and a secondary opposing surface forming at least a portion of one surface of said housing, the primary and second electrodes being at different voltages so as to generate a plasma discharge that is emitted from the secondary opposing surface of said secondary electrode; and a secondary dielectric, associated with the secondary electrode, so that said secondary electrode is not exposed. 4. The plasma emitter apparatus in accordance with claim 3, wherein said secondary electrode is a laminate comprising two dielectric layers with a conductive layer disposed therebetween, at least one aperture is defined in said laminate, a dielectric sleeve is disposed within each respective aperture with a hole defined therein. 5. The plasma emitter apparatus in accordance with claim 4, wherein said primary dielectric has at least one capillary defined therethrough. 6. The plasma emitter apparatus in accordance with claim 5, wherein said primary dielectric is arranged relative to said secondary dielectric so that the center of each of the capillaries is substantially aligned with the center of each respective hole. 7. The plasma emitter apparatus in accordance with claim 3, wherein said secondary electrode is a plurality of unidirectional conductive wires disposed substantially parallel to one another and secured within a frame. 8. The plasma emitter apparatus in accordance with claim 7, wherein said primary dielectric has at least one slot defined therethrough. 9. The plasma emitter apparatus in accordance with claim 8, wherein said primary dielectric is arranged relative to said secondary electrode such that each slot is disposed substantially centered between two adjacent wires. 10. The plasma emitter apparatus in accordance with claim 3, wherein said secondary electrode is a plurality of unidirectional conductive slats disposed substantially parallel to one another and secured within a frame. 11. The plasma emitter apparatus in accordance with claim 10, wherein said primary dielectric has at least one slot defined therethrough. 12. The plasma emitter apparatus in accordance with claim 11, wherein said primary dielectric is arranged relative to said secondary electrode such that each slot is disposed substantially centered between two adjacent conductive slats. 13. The plasma emitter apparatus in accordance with claim 3, wherein said secondary electrode comprises a plurality of bidirectional conductive wires interwoven in a substantially perpendicular configuration to form a grid, said bidirectional conductive wires being secured within a frame. 14. The plasma emitter apparatus in accordance with claim 13, wherein said primary dielectric has at least one capillary defined therethrough. 15. The plasma emitter apparatus in accordance with claim 14, wherein said primary dielectric is arranged relative to said secondary dielectric so that a center of each of the capillaries is substantially aligned with a center of each of a plurality of squares formed by overlapping of the bidirectional conductive wires. 16. The plasma emitter apparatus in accordance with claim 3, wherein said secondary electrode is a plurality of bidirectional conductive slats interwoven in a substantially perpendicular configuration to form a grid, said bidirectional conductive slats being secured within a frame. 17. The plasma emitter apparatus in accordance with claim 16, wherein said primary dielectric has at least one capillary defined therethrough. 18. The plasma emitter apparatus in accordance with claim 17, wherein said primary dielectric is arranged relative to said secondary dielectric so that a center of each of the capillaries is substantially aligned with a center of each of a plurality of squares formed by overlapping of the bidirectional conductive slats. 19. The plasma emitter apparatus in accordance with claim 3, further comprising a spacer disposed between said first and second dielectrics to displace the second dielectric a predetermined distance relative to said first dielectric. 20. A method for producing a plasma discharge using a plasma emitter apparatus including a primary dielectric; a primary electrode disposed proximate said primary dielectric, said primary dielectric associated with the primary electrode; a secondary electrode, said secondary electrode includes a plurality of unidirectional conductive layers disposed substantially parallel to one another and has a first surface facing said primary electrode and an opposing surface, the primary and secondary electrodes being at different voltages; and a secondary dielectric, associated with each of the plurality of unidirectional conductive layers, so that said secondary electrode is not exposed, said method comprising the step of: producing a plasma discharge that passes through said secondary electrode. 21. The method in accordance with claim 20, wherein said producing step comprises applying a differential in potential voltage between said primary and secondary electrodes to generate the plasma discharge. 22. The method in accordance with claim 20, wherein said secondary electrode is a laminate comprising two dielectric layers with a conductive layer disposed therebetween, at least one aperture is defined in said laminate, and a dielectric sleeve is disposed within each respective aperture with a hole defined therein. 23. The method in accordance with claim 22, wherein said primary dielectric has at least one capillary defined therethrough. 24. The method in accordance with claim 23, wherein said primary dielectric is arranged relative to said secondary dielectric so that a center of each of the capillaries is substantially aligned with a center of each respective hole. 25. The method in accordance with claim 20, wherein said secondary electrode is a plurality of unidirectional conductive wires disposed substantially parallel to one another and secured within a frame. 26. The method in accordance with claim 25, wherein said primary dielectric has at least one slot defined therethrough. 27. The method in accordance with claim 26, wherein said primary dielectric is arranged relative to said secondary electrode such that each slot is disposed substantially centered between two adjacent wires. 28. The method in accordance with claim 20, wherein said secondary electrode is a plurality of unidirectional conductive slats disposed substantially parallel to one another and secured within a frame. 29. The method in accordance with claim 28, wherein said primary dielectric has at least one slot defined therethrough. 30. The method in accordance with claim 29, wherein said primary dielectric is arranged relative to said secondary electrode such that each slot is disposed substantially centered between two adjacent conductive slats. 31. The method in accordance with claim 30, wherein said secondary electrode is a plurality of bidirectional conductive wires interwoven in a substantially perpendicular configuration to form a grid, said bidirectional conductive wires being secured within a frame. 32. The method in accordance with claim 31, wherein said primary dielectric has at least one capillary defined therethrough. 33. The method in accordance with claim 32, wherein said primary dielectric is arranged relative to said second dielectric so that the center of each of the capillaries is substantially aligned with the center of each square formed by overlapping of the bidirectional conductive wires. 34. The method in accordance with claim 20, wherein said secondary electrode is a plurality of bidirectional conductive slats interwoven in a substantially perpendicular configuration to form a grid, said bidirectional conductive slats being secured within a frame. 35. The method in accordance with claim 34, wherein said primary dielectric has at least one capillary defined therethrough. 36. The method in accordance with claim 35, wherein said primary dielectric is arranged relative to said second dielectric so that the center of each of the capillaries is substantially aligned with the center of each square formed by overlapping of the bidirectional conductive slats. 37. The method in accordance with claim 20, wherein said plasma emitter apparatus further comprising a spacer disposed between said first and second dielectrics to displace the second dielectric a predetermined distance relative to said first dielectric. 38. The method in accordance with claim 20, wherein said primary dielectric has an aperture defined therethrough, said primary electrode is disposed proximate said primary dielectric, and said secondary electrode is disposed about at least a portion of the outer perimeter of said primary dielectric. 39. The method in accordance with claim 38, wherein said primary electrode is a pin inserted at least partially into the aperture, and said secondary electrode is a washer made of conductive material disposed about the circumference of said primary dielectric. 40. The method in accordance with claim 20, further comprising the step of passing the plasma discharge through the plasma exiting surface of said secondary electrode. 41. The method in accordance with claim 40, further comprising the step of placing the plasma emitter apparatus so that the exiting surface of said secondary electrode is proximate to a surface to be treated. 42. The method in accordance with claim 40, further comprising the step of placing the plasma emitter apparatus so that the exiting surface of said secondary electrode is in direct contact with a surface to be treated. 43. A plasma emitter apparatus, comprising: a primary dielectric; a primary electrode disposed proximate said primary dielectric, said primary electrode being at a first voltage potential, said primary dielectric associated with the primary electrode; a secondary electrode being at a second voltage potential different from that of the first voltage potential so as to produce a plasma discharge, said secondary electrode permitting passage of the plasma discharge therethrough, wherein the secondary electrode is a plurality of unidirectional conductive wires disposed substantially parallel to one another and secured within a frame; and a secondary dielectric, associated with the secondary electrode, so that said secondary electrode is not exposed. 44. A plasma emitter apparatus, comprising: a primary dielectric; a primary electrode disposed proximate said primary dielectric, said primary electrode being at a first voltage potential, said primary dielectric associated with the primary electrode; a secondary electrode being at a second voltage potential different from that of the first voltage potential so as to produce a plasma discharge, said secondary electrode permitting passage of the plasma discharge therethrough, wherein said secondary electrode is a plurality of unidirectional conductive slats disposed substantially parallel to one another and secured within a frame; and a secondary dielectric, associated with the secondary electrode, so that said secondary electrode is not exposed. 45. A method for producing a plasma discharge using a plasma emitter apparatus including a primary dielectric; a primary electrode disposed proximate said primary dielectric, the primary dielectric associated with the primary electrode; a secondary electrode formed by a plurality of unidirectional conductive wires disposed substantially parallel to one another and secured within a frame, the primary and secondary electrodes being at different voltages; and a secondary dielectric, associated with the secondary electrode, so that said secondary electrode is not exposed, said method comprising the step of: producing a plasma discharge that passes through said secondary electrode. 46. A method for producing a plasma discharge using a plasma emitter apparatus including a primary dielectric; a primary electrode disposed proximate said primary dielectric, the primary dielectric associated with the primary electrode; a secondary electrode formed by a plurality of unidirectional conductive slats disposed substantially parallel to one another and secured within a frame, the primary and secondary electrodes being at different voltages; and a secondary dielectric, associated with the secondary electrode, so that said secondary electrode is not exposed, said method comprising the step of: producing a plasma discharge that passes through said secondary electrode. 47. A method of producing plasma discharge using a plasma emitter apparatus including a housing; a primary dielectric disposed within said housing; a primary electrode disposed proximate said primary dielectric, said primary dielectric associated with the primary electrode; a secondary electrode having a first surface facing said primary electrode and a secondary opposing surface forming at least a portion of one surface of said housing, the primary and second electrodes being at different voltages so as to generate a plasma discharge that is emitted from the secondary opposing surface of said secondary electrode; and a secondary dielectric, associated with the secondary electrode, so that said secondary electrode is not exposed, said method comprising the step of producing a plasma discharge that passes through said secondary electrode. 48. The method in accordance with claim 47, wherein said secondary electrode is a plurality of bidirectional conductive wires interwoven in a substantially perpendicular configuration to form a grid, said bidirectional conductive wires being secured within a frame. 49. The method in accordance with claim 47, wherein said secondary electrode is a plurality of bidirectional conductive slats interwoven in a substantially perpendicular configuration to form a grid, said bidirectional conductive slats being secured within a frame.
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