[특허]Ultra-thin wafer handling system

[미국특허] Ultra-thin wafer handling system 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B66C-001/02 B66C-001/00
출원번호	US-0618091 (2003-07-11)
발명자 / 주소	Klein,Martin P. Keigler,Arthur Felsenthal,David
출원인 / 주소	NEXX Systems, Inc.
대리인 / 주소	Proskauer Rose LLP
인용정보	피인용 횟수 : 27 인용 특허 : 196

초록 ▼

An improved Bernoulli end effector for holding, handling, and transporting ultra-thin substrates includes edge guides to aid in the positioning of the substrate and may include friction pads that impede motion of the substrate lifted by the end effector. The Bernoulli end effector may be incorporated into an apparatus and method for supinating a substrate so that both surfaces of the substrate can be processed. In addition, the Bernoulli end effector may be used to place ultra-thin substrates on and retrieve substrates from a substrate handling structure that includes weights that prevent the substrates from bowing or flexing during processing and includes guides that prevent the ultra-thin substrates from moving or translating on the surface of the substrate handling structure.

대표청구항 ▼

What is claimed is: 1. A Bernoulli end effector comprising: a support member defining at least one passage for directing a fluid at a substrate to apply a holding force and a drag force on the substrate, wherein the hold force is first applied and the drag force is applied after a delay of between about 100 ms and 250 ms; at least one edge guide protruding from a first surface of the support member for contacting an edge of the substrate to oppose the drag force applied by the fluid; and at least one friction pad attached to the first surface of the support member for contacting a surface of the substrate to impede a rotational motion of the substrate. 2. A method for handling a substrate with a Bernoulli end effector, the method comprising: directing a fluid at the substrate to apply a holding force and a drag force to the substrate, the holding force creating a low pressure Bernoulli force to lift the substrate, wherein the hold force is first applied and the drag force is applied after a delay; applying a counter force to an edge of the substrate to oppose the drag force; and applying a frictional force to a surface of the substrate adjacent to the edge of the substrate to impede a rotational motion of the substrate. 3. The method of claim 2, wherein the delay is between about 100 ms and 250 ms. 4. A method for handling a substrate with a Bernoulli end effector, the method comprising: directing a fluid at the substrate to apply a holding force to the substrate, the holding force creating a low pressure Bernoulli force to lift the substrate; applying a drag force after applying the holding force; and applying a counter force to an edge of the substrate to oppose the drag force. 5. The method of claim 4, wherein the drag force is applied between about 100 ms and 250 ms after the holding force is applied. 6. The method of claim 4, further comprising applying a frictional force to a surface of the substrate adjacent to the edge of the substrate to impede a rotational motion of the substrate. 7. A Bernoulli end effector comprising: means for directing a fluid at a substrate to apply a hold force and a drag force to the substrate, the holding force creating a low pressure Bernoulli force to lift the substrate; means for first applying the hold force and then applying the drag force; means for applying a counter force to an edge of the substrate to oppose the drag force; and means for applying a frictional force to a surface of the substrate adjacent to the edge of the substrate to impede a rotational motion of the substrate. 8. The method of claim 2 further comprising contacting the edge of the substrate with an edge guide of the Bernoulli end effector to apply the counter force. 9. The method of claim 2 further comprising using a friction pad of the Bernoulli end effector to apply the frictional force. 10. The method of claim 2 further comprising using a first plurality of passages symmetrically arranged about an axis of a support member of the Bernoulli end effector to apply the hold force. 11. The method of claim 2 further comprising using a second plurality of passages asymmetrically arranged about an axis of a support member of the Bernoulli end effector to apply the drag force. 12. The method of claim 2 further comprising contacting the substrate within 2 mm of the edge of the substrate using a friction pad of the Bernoulli end effector to apply the frictional force. 13. The method of claim 2 further comprising: delivering the substrate using the Bernoulli end effector to a first substrate chuck; and receiving the substrate using the Bernoulli end effector from a second substrate chuck to which the substrate is transferred. 14. The method of claim 4 further comprising contacting the edge of the substrate with an edge guide of the Bernoulli end effector to apply the counter force. 15. The method of claim 4 further comprising using a first plurality of passages symmetrically arranged about an axis of a support member of the Bernoulli end effector to apply the hold force. 16. The method of claim 4 further comprising using a second plurality of passages asymmetrically arranged about an axis of a support member of the Bernoulli end effector to apply the drag force. 17. The method of claim 6 further comprising contacting the substrate within 2 mm of the edge of the substrate using a friction pad of the Bernoulli end effector to apply the frictional force. 18. The method of claim 4 further comprising: delivering the substrate using the Bernoulli end effector to a first substrate chuck; and receiving the substrate using the Bernoulli end effector from a second substrate chuck to which the substrate is transferred. 19. The method of claim 6 further comprising using a friction pad of the Bernoulli end effector to apply the frictional force. 20. The Bernoulli end effector of claim 7 wherein the means for directing the fluid at the substrate comprises a support member defining a first plurality of passages symmetrically arranged about an axis of the support member to apply the hold force. 21. The Bernoulli end effector of claim 7 wherein the means for directing the fluid at the substrate comprises a support member defining a second plurality of passages asymmetrically arranged about an axis of the support member to apply the drag force. 22. The Bernoulli end effector of claim 7 wherein the means for applying the counter force comprises at least one edge guide attached to a first surface of the support member. 23. The Bernoulli end effector of claim 7 wherein the means for applying the frictional force comprises at least one friction pad attached to a first surface of the support member. 24. The Bernoulli end effector of claim 20 wherein the first plurality of passages are arranged in a circular pattern for providing a Bernoulli force perpendicular to a surface of the substrate. 25. The Bernoulli end effector of claim 21 wherein the second plurality of passages are arranged in an arc for providing the drag force on the substrate. 26. The Bernoulli end effector of claim 19 wherein the at least one friction pad contacts the substrate within 2 mm of an edge of the substrate. 27. The Bernoulli end effector of claim 26 wherein the at least one friction pad comprises an elastomer. 28. The Bernoulli end effector of claim 26 wherein the at least one friction pad comprises alumina. 29. The Bernoulli end effector of claim 7 wherein the means for first applying the hold force and then applying the drag force is adapted to apply the drag force after a delay of between about 100 ms and 250 ms. 30. The Bernoulli end effector of claim 1 wherein the at least one passage comprises a first plurality of passages symmetrically arranged about an axis of the support member and a second plurality of passages asymmetrically arranged about the axis of the support member. 31. The Bernoulli end effector of claim 30 wherein the first plurality of passages are arranged in a circular pattern for providing a Bernoulli force perpendicular to a surface of the substrate. 32. The Bernoulli end effector of claim 30 wherein the second plurality of passages are arranged in an arc for providing the drag force on the substrate. 33. The Bernoulli end effector of claim 1 wherein an angle between a direction defined by the at least one passage and a surface of the support member is at least approximately thirty degrees. 34. The Bernoulli end effector of claim 1 wherein the at least one friction pad contacts the substrate within 2 mm of an edge of the substrate. 35. The Bernoulli end effector of claim 1 wherein the at least one friction pad comprises an elastomer. 36. The Bernoulli end effector of claim 1 wherein the at least one friction pad comprises alumina. 37. The Bernoulli end effector of claim 1 wherein the at least one edge guide is beveled.

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Ting Chiu H. ; Holtkamp William H. ; Ko Wen C. ; Lowery Kenneth J. ; Cho Peter, Process chamber and method for depositing and/or removing material on a substrate.
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Wang David N. (Cupertino CA) White John M. (Hayward CA) Law Kam S. (Union City CA) Leung Cissy (Union City CA) Umotoy Salvador P. (Pittsburgh CA) Collins Kenneth S. (San Jose CA) Adamik John A. (San , Process for PECVD of silicon oxide using TEOS decomposition.
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Moslehi Mehrdad M. ; Lee Yong Jin, Programmable ultraclean electromagnetic substrate rotation apparatus and method for microelectronics manufacturing equip.
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Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
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Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
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de Masi Amerigo (Brandenburgerstr. 62-6073 Egelsbach DEX), Rack or transport tool for the manufacturing of printed wired boards.
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Fisk Robert Walter (Sunnyvale CA), Reactor loading apparatus.
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Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup anode and conductor assembly.
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Fairbairn Kevin ; Ponnekanti Hari K. ; Cheung David ; Tanaka Tsutomu,JPX ; Kelka Malcal, Remote plasma source.
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Talieh Homayoun, Reverse linear polisher with loadable housing.
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Grunes Howard (Santa Cruz CA) Tepman Avi (Cupertino CA) Lowrance Robert (Los Gatos CA), Robot assembly.
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Grunes Howard (Santa Cruz CA) Tepman Avi (Cupertino CA) Lowrance Robert (Los Gatos CA), Robot assembly.
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Grunes Howard ; Lowrance Robert B. ; Tepman Avi, Robot assembly.
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Edwards Alan T. (Corvallis OR) Smith Steven A. (Corvallis OR), Robotic gripper for disk-shaped objects.
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Grandia Johannes (San Jose CA) O\Kane Daniel F. (Morgan Hill CA) Santini Hugo A. E. (San Jose CA), Rotary electroplating cell with controlled current distribution.
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Ritzdorf Thomas L. ; Turner Jeffrey I. ; Graham Lyndon W., Semiconductor plating bowl and method using anode shield.
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Maydan Dan (Los Altos CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco CA) R, Semiconductor processing system with robotic autoloader and load lock.
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Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
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Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
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Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G. ; Byle Darryl S., Semiconductor processing system with wafer container docking and loading station.
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Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor processing systems.
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Bleck, Martin C.; Reardon, Timothy J.; Bergman, Eric J., Semiconductor processor with wafer face protection.
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Grunes Howard E. (Santa Cruz CA), Semiconductor wafer cassette transfer system.
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Kobayashi Norio (Yokosuka JPX), Semiconductor wafer processing apparatus having a Bernoulli chuck.
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Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor wafer processing system with immersion module.
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Tanaka Yoichiro,JPX, Shield for a physical vapor deposition chamber.
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Freerks Fred (Cupertino CA), Slit valve door.
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Deligi Mario (Newton NJ) Derbinsky Senia (River Edge NY), Spiral magnetic linear translating mechanism.
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Hughes John L. (Rodeo CA) Lawson Eric C. (Sunnyvale CA), Substrate handling and processing system.
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Doley, Allan; Goodwin, Dennis; O'Neill, Kenneth; Vrijburg, Gerben; Rodriguez, David; Aggarwal, Ravinder, Substrate handling chamber.
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Brinket Oscar J. (3816 Montego Dr. Huntington Beach CA 92649) Brinket Brian C. (3816 Montego Dr. Huntington Beach CA 92649), Substrate plating device having laminar flow.
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Takahashi Nobuyuki (Fuchu JPX) Sugimoto Ryuji (Fuchu JPX) Shirai Yasuyuki (Fuchu JPX), Substrate processing apparatus including wafer transporting and substrate cooling mechanisms.
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Klein, Martin P.; Felsenthal, David; Sferlazzo, Piero, Substrate processing pallet and related substrate processing method and machine.
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Klein, Martin P.; Felsenthal, David; Sferlazzo, Piero, Substrate processing pallet and related substrate processing method and machine.
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Sumnitsch Franz (Klagenfurt ATX), Support for disk-shaped articles.
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Sumnitsch Franz (Universitatsstrasse 25 A-9020 Klagenfurt (Karnten) ATX), Support for disk-shaped articles using the Bernoulli principle.
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Pirker Willibald,ATX, Support for wafer-like objects.
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Sumnitsch Franz,ATX, Support for wafer-shaped objects, in particular silicon wafers.
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Cheng David (San Jose CA) Zhang Wesley W. (Burlingame CA), System and method for detecting the center of an integrated circuit wafer.
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Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), System providing multiple processing of substrates.
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Van Gogh James (Sunnyvale CA) Dorleans Fernand (San Francisco CA) Hagerty Christopher (Pleasanton CA) Lloyd Mark (Fremont CA) Tang Howard (San Jose CA) Yang Siyaun (Cupertino CA) West R. Steve (Bould, Target and dark space shield for a physical vapor deposition system.
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Wang David N. (Cupertino) White John M. (Hayward) Law Kam S. (Union City) Leung Cissy (Union City) Umotoy Salvador P. (Pittsburg) Collins Kenneth S. (San Jose) Adamik John A. (San Ramon) Perlov Ilya , Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planar.
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Wang David N-K. (Cupertino CA) White John M. (Hayward CA) Law Kam S. (Union City CA) Leung Cissy (Union City CA) Umotoy Salvador P. (Pittsburg CA) Collins Kenneth S. (San Jose CA) Adamik John A. (San, Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process.
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Nulman Jaim (Palo Alto CA) Ngan Kenny K. (Fremont CA), Titanium nitride/titanium silicide multiple layer barrier with preferential (111) crystallographic orientation on titani.
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Rahn ; Oskar ; Krause ; Hermann, Tool for the contact-free support of discs.
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Frey Helmut,ATX, Tool for the contact-free support of plate-like substrates.
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Norman Arthur E. (Northridge CA), Transport system for inline vacuum processing.
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Lowrance Robert B., Two-axis magnetically coupled robot.
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Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
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Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
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Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
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Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
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Maydan Dan ; Somekh Sasson ; Sinha Ashok ; Fairbairn Kevin ; Lane Christopher ; Colborne Kelly ; Ponnekanti Hari K. ; Taylor W. N.(Nick), Ultra high throughput wafer vacuum processing system.
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Gupta Anand ; Ponnekanti Srihari ; Rimple Gana A. ; Murugesh Laxman, Using ceramic wafer to protect susceptor during cleaning of a processing chamber.
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Toshima Masato (Campbell CA), Vacuum chamber slit valve.
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Kato Shigekazu (Kudamatsu JPX) Nishihata Kouji (Tokuyama JPX) Tsubone Tsunehiko (Hikari JPX) Itou Atsushi (Kudamatsu JPX), Vacuum processing apparatus and operating method therefor.
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Turner Norman L. (Mountain View CA) White John M. (Hayward CA), Vacuum processing apparatus having improved throughput.
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Andricacos Panayotis C. (Croton-on-Hudson NY) Berridge Kirk G. (Fishkill NY) Dukovic John O. (Pleasantville NY) Flotta Matteo (Yorktown Heights NY) Ordonez Jose (Pleasant Valley NY) Poweleit Helmut R, Vertical paddle plating cell.
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Goodwin Dennis L. (Tempe AZ) Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Ferro Armand P. (Scottsdale AZ), Wafer handling system with Bernoulli pick-up.
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Goodwin Dennis L. (Tempe AZ) Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Ferro Armand P. (Scottsdale AZ), Wafer handling system with bernoulli pick-up.
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Somekh Sasson R. (Los Altos Hills CA) Salzman Philip M. (San Jose CA) Vierny Oskar U. (Palo Alto CA), Wafer handling within a vacuum chamber using vacuum.
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Berken Lloyd M. (Fremont CA) Freerks Frederik W. (Cupertino CA) Jarvi William H. (San Jose CA) Sahin Hatice (Cupertino CA), Wafer positioning system.
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Berken Lloyd M. ; Freerks Frederik W. ; Jarvi William H. ; Sahin Hatice, Wafer positioning system.
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Blake Julian G. (211 Hart St. Beverly Farms MA 01915) Tu Weilin (6 Oak St. Natick MA 01760), Wafer release method and apparatus.
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Somekh Sasson (Los Altos Hills CA) Fairbairn Kevin (Saratoga CA) Kolstoe Gary M. (Fremont CA) White Gregory W. (San Carlos CA) Faraco ; Jr. W. George (Saratoga CA), Wafer tray and ceramic blade for semiconductor processing apparatus.
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Somekh Sasson (Los Altos Hills CA) Fairbairn Kevin (Saratoga CA) Kolstoe Gary M. (Fremont CA) White Gregory W. (San Carlos CA) Faraco ; Jr. W. George (Saratoga CA), Wafer tray and ceramic blade for semiconductor processing apparatus.
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Somekh Sasson (Los Altos Hills CA) Fairbairn Kevin (Saratoga CA) Kolstoe Gary M. (Fremont CA) White Gregory W. (San Carlos CA) Faraco ; Jr. W. George (Saratoga CA), Wafer tray and ceramic blade for semiconductor processing apparatus.
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Somekh Sasson (Los Altos Hills CA) Fairbairn Kevin (Saratoga CA) Kolstoe Gary M. (Fremont CA) White Gregory W. (San Carlos CA) Faraco ; Jr. W. George (Saratoga CA), Wafer tray and ceramic blade for semiconductor processing apparatus.
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Garrett Charles B. (San Jose CA), Workpiece lifting and holding apparatus.
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Sturm Anton (Denkendorf DEX), Workpiece mounting pallet.
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이 특허를 인용한 특허 (27) 인용/피인용 타임라인 분석

May, Michael; Brockman, Phillip Daniel, Assembly operable to mix or sparge a liquid.
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Englhardt, Eric A.; Rice, Michael R.; Hudgens, Jeffrey C.; Hongkham, Steve; Pinson, Jay D.; Salek, Mohsen; Carlson, Charles; Weaver, William T; Armer, Helen R., Cartesian cluster tool configuration for lithography type processes.
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Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Cartesian robot cluster tool architecture.
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Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lu, Brian, Cluster tool architecture for processing a substrate.
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Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
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Zahraoui, Said; Descours, Francis; Raynal, Frederic, Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate.
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Osada, Hideyuki, Holding pad for transferring a wafer.
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Osada, Hideyuki, Holding pad for transferring a wafer.
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Rice,Mike; Hudgens,Jeffrey; Carlson,Charles; Weaver,William Tyler; Lowrance,Robert; Englhardt,Eric; Hruzek,Dean C.; Silvetti,Mario David; Kuchar,Michael; Van Katwyk,Kirk; Hoskins,Van; Shah,Vinay, Method of retaining a substrate during a substrate transferring process.
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Keigler, Arthur; Goodman, Daniel L.; Guarnaccia, David G., Parallel single substrate marangoni module.
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Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L., Parallel single substrate processing system.
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Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L.; Haynes, Jonathan, Parallel single substrate processing system.
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Keigler, Arthur, Parallel single substrate processing system with alignment features on a process section frame.
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Takizawa, Masahiro; Suwada, Masaei, Position sensor system for substrate transfer robot.
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Hamano, Manabu; Pitney, John A.; Hellwig, Lance G., Semiconductor wafer carrier blade.
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Takizawa, Masahiro; Nishino, Teruhide, Semiconductor-processing apparatus equipped with robot diagnostic module.
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Rice,Michael; Hudgens,Jeffrey; Carlson,Charles; Weaver,William Tyler; Lowrance,Robert; Englhardt,Eric; Hruzek,Dean C.; Silvetti,Mario David; Kuchar,Michael; Katwyk,Kirk Van; Hoskins,Van; Shah,Vinay, Substrate gripper for a substrate handling robot.
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Goodman, Daniel; Keigler, Arthur; Fisher, Freeman; Guarnaccia, David G., Substrate loader and unloader having a Bernoulli support.
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Goodman, Daniel; Keigler, Arthur; Fisher, Freeman, Substrate loader and unloader having an air bearing support.
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Goodman, Daniel; Keigler, Arthur; Golovato, Stephen; Felsenthal, David, Substrate processing pallet with cooling.
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Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
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Kimura, Ren, Wafer holder for ion implantation.
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Tamaso, Hideto, Wafer holder for stepper.
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Iida, Naruaki; Kajiwara, Hideki, Wafer holding member.
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Kajiwara, Hideki, Wafer holding member.
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Palm, Troy, Wafer inversion mechanism.
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Lester, Paul; Meyer, Scott; Atkins, Wyland L.; Richards, Douglas; Predoaica, Constantin; Hudgens, Jeffrey; Carlson, Charles; Kankanala, Penchala; Rice, Mike; Papanu, James S.; Baiya, Evanson G.; Rosato, John J., Wet clean system design.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

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이 특허에 인용된 특허 (196) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (27) 인용/피인용 타임라인 분석

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