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A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module is connected to a heat dissipating plate configured to mount to an electrical junction box. Thus, heat from the LEDs

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module is connected to a heat dissipating plate configured to mount to an electrical junction box. Thus, heat from the LEDs is conducted to the heat dissipating plate and to the junction box. A sensor is configured to detect environmental parameters and a driver is configured to illuminate the LEDs in response to the environmental parameters, thereby selectively configuring the LEDs to function in a wide variety of useful applications.

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What is claimed is: 1. A lighting apparatus, comprising: a light emitting diode (LED) module having: at least one LED; a dielectric member; and a plurality of electrically conductive contacts disposed on the dielectric member, the contacts configured to mount the at least one LED to supply electric

What is claimed is: 1. A lighting apparatus, comprising: a light emitting diode (LED) module having: at least one LED; a dielectric member; and a plurality of electrically conductive contacts disposed on the dielectric member, the contacts configured to mount the at least one LED to supply electrical current to the LED; a heat conductive member; and an electrical junction box, the junction box having a plurality of sides defining a cavity therewithin, at least one of the sides having a knockout port configured to selectively provide access to the cavity; wherein the LED module is in thermal communication with the heat conductive member, and the heat conductive member is attached to and in thermal communication with the junction box so that heat from the LED flows through the heat conductive member to the junction box. 2. The lighting apparatus of claim 1, wherein the junction box is formed of a heat conductive material. 3. The lighting apparatus of claim 2, wherein the junction box has a heat conductivity greater than or equal to about 100 W/mK. 4. The lighting apparatus of claim 1, wherein the junction box is formed of metal. 5. The lighting apparatus of claim 1, wherein the module comprises a plurality of LEDs. 6. The lighting apparatus of claim 5, wherein the plurality of LEDs are electronically arranged in series. 7. The lighting apparatus of claim 5, wherein the plurality of LEDs are electronically arranged in parallel. 8. The lighting apparatus of claim 1, wherein the module has main body and a dielectric layer is disposed on the main body. 9. The lighting apparatus of claim 8, wherein the main body is in thermal communication with a heat conducting member. 10. The lighting apparatus of claim 9, wherein the main body is in thermal communication with a heat conducting member through threaded fasteners. 11. The lighting apparatus of claim 9, wherein the main body is in thermal communication with a heat conducting member through an adhesive. 12. The lighting apparatus of claim 1, wherein the junction box has a plurality of sides, each of said sides sharing a common front edge, the plurality of sides defining a cavity. 13. The lighting apparatus of claim 12, wherein the junction box is rectangular. 14. The lighting apparatus of claim 12, wherein the junction box has an open front permitting access to the cavity. 15. The lighting apparatus of claim 12, wherein the heat conducting member is shaped generally complementary to the junction box front edge such that the heat conducting member is in thermal communication with at least a portion of the front edge. 16. The lighting apparatus of claim 1, further comprising a driver configured to drive the LEDs according to a desired lighting strategy. 17. The lighting apparatus of claim 16, wherein the desired lighting strategy comprises pulsing electrical current at a desired duty cycle. 18. The lighting apparatus of claim 17, further comprising a sensor for detecting a desired environmental parameter and generating a corresponding signal, the driver configured to receive the signal and drive the LEDs according to a desired lighting strategy in response to the signal. 19. The lighting apparatus of claim 18, wherein the sensor is configured to detect motion. 20. The lighting apparatus of claim 19, wherein the sensor is configured to detect heat. 21. The lighting apparatus of claim 19, wherein the sensor is configured to detect environmental light. 22. The lighting apparatus of claim 1, further comprising a power converter configured to convert electricity from a provided voltage to a desired voltage. 23. The lighting apparatus of claim 1, wherein the LED module is coformed with the heat conductive member. 24. The lighting apparatus of claim 1, comprising a plurality of LED modules. 25. A method of making a lighting apparatus, comprising: providing a light emitting diode (LED) module comprising: at least one LED; a dielectric member; and a plurality of electrically conductive contacts disposed on the dielectric member, the contacts configured to mount the at least one LED to supply electrical current to the LED; providing a heat conductive member in thermal communication with the LED module; providing an electrical junction box having a plurality of sides defining a cavity and a front edge; and mounting the heat conductive member onto the electrical junction box so that the heat conductive member is in thermal communication with the junction box. 26. The method of claim 25 additionally comprising providing a driver configured to control the at least one LED of the LED module. 27. The method of claim 26 additionally comprising providing a sensor adapted to sense an environmental condition and correspondingly signal the driver, and the driver is adapted to vary control of the LED module in response to a signal received from the sensor. 28. The method of claim 25 additionally comprising providing a cover and fitting the cover over the heat conductive member and LED module so that the cover selectively directs light from the LED module. 29. The method of claim 28, wherein the cover comprises a heat conductive material. 30. The method of claim 29, wherein the cover comprises a material having a heat conductivity greater than about 75 W/mK.