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Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28D-015/00
출원번호 US-0726347 (2003-12-03)
발명자 / 주소
  • Chu,Richard C.
  • Ellsworth, Jr.,Michael J.
  • Schmidt,Roger R.
  • Simons,Robert E.
  • Zoodsma,Randy J.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Heslin Rothenberg Farley &
인용정보 피인용 횟수 : 104  인용 특허 : 13

초록

A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The f

대표청구항

What is claimed is: 1. A cooling system comprising: multiple coolant conditioning units (CCUs), each CCU of at least some coolant conditioning units of the multiple CCUs providing system coolant to a different, associated electronics subsystem of multiple electronics subsystems to be cooled; and wh

이 특허에 인용된 특허 (13)

  1. Kawashima Hisashi (Yokohama JPX) Okada Tsuguo (Yokohama JPX) Yamamoto Haruhiko (Yokohama JPX), Apparatus for supplying cooling fluid.
  2. Iversen Arthur H. (15315 Sobey Rd. Saratoga CA 95070), Compact high power modular RF semi-conductor systems packaging.
  3. Takahashi Tatsuya,JPX ; Zushi Shizuo,JPX ; Ogata Tetsuo,JPX, Cooling apparatus for use in an electronic system.
  4. St.ang.hl Lennart ; Wallace ; Jr. John Francis ; Parraz John Carlenas ; Clark Montford Henry ; Winn David, Cooling system and method for distributing cooled air.
  5. Mizuno Tsukasa (Tokyo JPX) Okano Minoru (Tokyo JPX), Cooling system for electronic equipment.
  6. Go Hiroshi (Zama JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX), Electronic apparatus cooling system.
  7. Ekrot Alexander C. ; Shero James P., Electronic apparatus having removable processor/heat pipe cooling device modules therein.
  8. Stefani Gary G. (Endicott NY), Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system.
  9. Fouts Robert E. (Rancho Palos Verdes CA) Fouts Craig (Encinitas CA) Fouts Earl J. (Rolling Hills CA), Modular cooler.
  10. Ferchau Joerg (Morgan Hill CA) Trujillo Victor (Fremont CA), Modular power supply arrangement with cooling.
  11. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  12. Hileman Vince P., Spray cooled module with removable spray cooled sub-module.
  13. Lesley Arthur M. (Woodland Hills CA) Jaron William (Camarillo CA), Thermal stress screening system.

이 특허를 인용한 특허 (104)

  1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  2. Barringer, Wayne A.; Graybill, David P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Steffes, James J.; Weber, Jr., Gerard V., Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s).
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  8. Helbig, Joerg Burkhard; Gizzi, Steven Thomas, Apparatus and methods for cooling rejected heat from server racks.
  9. Barringer, Wayne A.; Graybill, David P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Steffes, James J.; Weber, Jr., Gerard V., Apparatus for adjusting coolant flow resistance through liquid-cooled electronics racks.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kemink, Randall G.; Simons, Robert E., Automatically reconfigurable liquid-cooling apparatus for an electronics rack.
  11. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system.
  12. Arimilli, Ravi K.; Ellsworth, Jr., Michael J.; Seminaro, Edward J., Convergence of air water cooling of an electronics rack and a computer room in a single unit.
  13. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  14. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  15. Moore, David Allen; Franz, John P.; Cader, Tahir; Sabotta, Michael Lawrence, Cooling assembly.
  16. Carlson, Andrew B.; Clidaras, Jimmy; Hamburgen, William, Cooling diversity in data centers.
  17. Carlson, Andrew B.; Clidaras, Jimmy; Hamburgen, William, Cooling diversity in data centers.
  18. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  19. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  20. Rasmussen,Neil; Bean,John H.; Uhrhan,Greg R.; Buell,Scott D., Cooling system and method.
  21. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks.
  22. Spearing, Ian; Schrader, Timothy J., Cooling system and method of use.
  23. McDonnell, Gerald; Keisling, Earl, Cooling systems and methods incorporating a plural in-series pumped liquid refrigerant trim evaporator cycle.
  24. McDonnell, Gerald; Zhang, Ming; Costakis, John; Keisling, Earl, Cooling systems and methods using two cooling circuits.
  25. Keisling, Earl; Costakis, John; McDonneli, Gerald, Cooling systems for electrical equipment.
  26. Arimilli, Ravi K.; Ellsworth, Jr., Michael J.; Seminaro, Edward J., Environmental control of liquid cooled electronics.
  27. Cheng, Bruce C. H., Expandable data center.
  28. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Heat dissipating system.
  29. Morimoto, Hiroyuki; Yamashita, Koji; Motomura, Yuji, Heat medium relay unit and air-conditioning apparatus equipped with same.
  30. El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rubio, Juan C., Heatsink allowing in-situ maintenance in a stackable module.
  31. El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rubio, Juan C., Heatsink allowing in-situ maintenance in a stackable module.
  32. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center.
  33. Bean, Jr., John H., Ice thermal storage.
  34. Bean, Jr., John H., Ice thermal storage.
  35. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  36. Wexler, Peter, In-row air containment and cooling system and method.
  37. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M.; Bailey, Edmond I., Information handling system having fluid manifold with embedded heat exchanger system.
  38. Miyazaki, Hiroyuki, Information processing system and control method for information processing system.
  39. Schultz, Mark D., Information technology equipment cooling method.
  40. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M., Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem.
  41. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  42. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  43. Iyengar, Madhusudan K.; Schmidt, Roger R., Liquid cooled data center with alternating coolant supply lines.
  44. Iyengar, Madhusudan K.; Schmidt, Roger R., Liquid cooled data center with alternating coolant supply lines.
  45. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M.; Curlee, James Don; Huang, Chin-An, Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation.
  46. Franz, John P; Cader, Tahir; Sabotta, Michael L; Moore, David A, Liquid cooling.
  47. Novotny, Shlomo, Liquid cooling circuits and method for electrical cabinets, drawers, bays, modules, circuit boards and electrical components using quick-disconnect fittings for interfacing to a host cooling source.
  48. El-Essawy, Wael R.; Keller, Jr., Thomas W.; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  49. El-Essawy, Wael R.; Keller, Thomas W; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  50. El-Essawy, Wael R; Keller, Thomas W; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  51. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M., Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature.
  52. Franz, John P.; Sabotta, Michael L.; Cader, Tahir; Moore, David A., Liquid temperature control cooling.
  53. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  54. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  55. Tutunoglu, Ozan, Method and apparatus for cooling.
  56. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  57. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  58. Artman, Paul; Berke, Stuart, Method and system for managing the power consumption of an information handling system.
  59. Artman, Paul; Berke, Stuart Allen, Method and system for managing the power consumption of an information handling system.
  60. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations.
  61. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  62. Belady, Christian L; Murakami, Vance; Pereira, Robert Allen, Methods for cooling computers and electronics.
  63. Keisling, Earl; Costakis, John; McDonnell, Gerald, Modular IT rack cooling assemblies and methods for assembling same.
  64. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  65. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  66. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Modular rack system.
  67. Mondal, Subrata K., Multi-level medium voltage data center static synchronous compensator (DCSTATCOM) for active and reactive power control of data centers connected with grid energy storage and smart green distributed energy sources.
  68. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly method with shared cooling unit.
  69. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling apparatus.
  70. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling apparatus.
  71. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling unit.
  72. Goth, Gary F.; Kostenko, William P.; Mullady, Robert K.; Vandeventer, Allan C., Multimodal cooling apparatus for an electronic system.
  73. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  74. Rohr, Daniel J., Optically detected liquid depth information in a climate control unit.
  75. Mondal, Subrata K.; Carnemark, Jakob, Power sources and systems utilizing a common ultra-capacitor and battery hybrid energy storage system for both uninterruptible power supply and generator start-up functions.
  76. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Pressure control unit and method facilitating single-phase heat transfer in a cooling system.
  77. Scofield, William H.; Baube, Scott H., Refrigerant line electrical ground isolation device for data center cooling applications.
  78. Shelnutt, Austin Michael; Vancil, Paul W.; Stuewe, John R.; Bailey, Edmond I., Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance.
  79. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M.; Bailey, Edmond I., Scalable rack-mount air-to-liquid heat exchanger.
  80. Carter, John B.; El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Li, Jian; Rajamani, Karthick; Rubio, Juan C.; Speight, William E.; Zhang, Lixin, Scalable space-optimized and energy-efficient computing system.
  81. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  82. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  83. Carter, John B.; El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Felter, Wesley M.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rajamani, Karthick; Rubio, Juan C.; Speight, William E.; Zhang, Lixin, Stackable module for energy-efficient computing systems.
  84. Bean, John H.; Lomas, Jonathan M., Sub-cooling unit for cooling system and method.
  85. Bean, John H; Lomas, Jonathan M, Sub-cooling unit for cooling system and method.
  86. Bean,John H.; Lomas,Jonathan M., Sub-cooling unit for cooling system and method.
  87. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  88. Rasmussen, Neil; VanGilder, James W.; Zhang, Xuanhang, System and method for assessing and managing data center airflow and energy usage.
  89. Ellsworth, Jr., Michael J.; Krug, Jr., Francis R.; Mullady, Robert K.; Schmidt, Roger R.; Seminaro, Edward J., System and method for facilitating cooling of a liquid-cooled electronics rack.
  90. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., System and method for facilitating parallel cooling of liquid-cooled electronics racks.
  91. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  92. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  93. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., System of facilitating cooling of electronics racks of a data center employing multiple cooling stations.
  94. Whitted, William H., Systems and methods for close coupled cooling.
  95. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  96. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  97. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  98. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  99. Mondal, Subrata K, Systems and methods for controlling multi-level diode-clamped inverters using space vector pulse width modulation (SVPWM).
  100. Konshak,Michael V., Thermal caching for liquid cooled computer systems.
  101. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
  102. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
  103. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  104. Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable performance server system and method of operation.
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