Method and device for cooling and electrically insulating a high-voltage, heat-generating component such as an x-ray tube for analyzing fluid streams
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01J-035/10
H01J-035/00
출원번호
US-0859818
(2004-06-03)
발명자
/ 주소
Radley,Ian
Bievenue,Thomas J.
Burdett, Jr.,John H.
Gallagher,Brian W.
Shakshober,Stuart M.
Chen,Zewu
출원인 / 주소
X Ray Optical Systems, Inc.
대리인 / 주소
Heslin Rothenberg Farley &
인용정보
피인용 횟수 :
15인용 특허 :
9
초록▼
A method and device for cooling and electrically-insulating a high-voltage, heat-generating component, for example, an x-ray tube ( 1105) for analyzing fluids by means of x-ray fluorescence. The device includes an x-ray source (1100) including an x-ray tube ( 1105) having improved heat-dissipating p
A method and device for cooling and electrically-insulating a high-voltage, heat-generating component, for example, an x-ray tube ( 1105) for analyzing fluids by means of x-ray fluorescence. The device includes an x-ray source (1100) including an x-ray tube ( 1105) having improved heat-dissipating properties due to the thermal coupling of the x-ray tube with a thermally-conductive, dielectric material (1150). The device may include a base assembly ( 1135) mounted to the component for conducting heat away from the component while electrically isolating the component. In one aspect of the invention, the base assembly includes two copper plates (1140, 1145) separated by a dielectric plate (1150). The dielectric plate minimizes or prevents the leakage of current through the base assembly (1135). One aspect of the disclosed invention is most amenable to the analysis of sulfur in petroleum-based fuels.
대표청구항▼
The invention claimed is: 1. An x-ray tube assembly comprising: a permanently vacuum sealed x-ray tube comprising a stationary, high-voltage, heated anode/cathode emerging therefrom at one end of the tube; and a heat dissipating device coupled to the anode/cathode outside of the x-ray tube, the hea
The invention claimed is: 1. An x-ray tube assembly comprising: a permanently vacuum sealed x-ray tube comprising a stationary, high-voltage, heated anode/cathode emerging therefrom at one end of the tube; and a heat dissipating device coupled to the anode/cathode outside of the x-ray tube, the heat dissipating device comprising: a first thermally conducting plate having a first side in thermal communication with the anode/cathode and a second side, the first plate thermally spreading the heat from the anode/cathode; and a thermally-conductive dielectric material plate having a first side in thermal communication with the second side of the first metal plate and a second side; wherein heat in the anode/cathode is conducted away from the anode/cathode through the device while current loss across the device is minimized. 2. The x-ray tube assembly as recited in claim 1, further comprising a second thermally conducting plate having a first side in thermal communication with the second side of the thermally-conductive dielectric material plate. 3. The x-ray tube assembly as recited in claim 2, wherein the heat dissipating device provides structural support for the anode/cathode. 4. The x-ray tube assembly as recited in claim 3, wherein the heat dissipating device provides essentially all the structural support for the anode/cathode. 5. The x-ray tube assembly as recited in claim 1, further comprising a high voltage cable coupled with the first thermally conducting plate which powers the x-ray tube. 6. The x-ray tube assembly as recited in claim 1, wherein the first thermally conducting plate comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 7. The x-ray tube assembly as recited in claim 1, wherein the thermally-conductive dielectric material plate comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 8. The x-ray tube assembly as recited in claim 1, further comprising a housing for holding the x-ray tube assembly. 9. The x-ray tube assembly as recited in claim 8, wherein the heat dissipating device provides support for the x-ray tube in the housing. 10. The x-ray tube assembly as recited in claim 9, wherein the heat dissipating device provides essentially all the support for the x-ray tube in the housing. 11. The x-ray tube assembly as recited in claim 1, wherein the thermally-conductive dielectric material comprises one of aluminum nitride, beryllium oxide, and diamond-like carbon. 12. The x-ray tube assembly as recited in claim 1, wherein the first thermally conducting plate comprises at least one of copper, aluminum, iron, silver, and gold. 13. The x-ray tube assembly as recited in claim 1 in combination with an apparatus for analyzing a sample using x-rays, the apparatus comprising: means for exposing the sample to x-rays to cause at least one component of the sample to x-ray fluoresce; and means for analyzing the x-ray fluorescence from the sample to determine at least one characteristic of the sample. 14. The combination as recited in claim 13, wherein the sample comprises a fluid or a fluid stream. 15. The combination as recited in claim 14, wherein the sample comprises a petroleum product and the at least one characteristic of the fluid comprises a concentration of sulfur. 16. The combination as recited in claim 13, wherein the means for exposing and/or the means for analyzing comprises at least one x-ray optic for focusing x-rays on the sample. 17. The combination as recited in claim 16, wherein the x-ray optic comprises an x-ray focusing crystal or an x-ray focusing capillary optic. 18. The x-ray source assembly as recited in claim 1, wherein sufficient heat is removed from the x-ray tube by means of the heat dissipating device whereby the x-ray tube assembly may be air cooled. 19. The x-ray source assembly as recited in claim 1, wherein sufficient heat is removed from the x-ray tube by means of the heat dissipating device whereby the x-ray tube is not contacted with a fluid coolant. 20. The x-ray source assembly as recited in claim 1, wherein sufficient heat is removed from the x-ray tube by means of the heat dissipating device, and wherein the x-ray tube is surrounded with an encapsulant which is not a good conductor of heat. 21. The x-ray source assembly as recited in claim 20, wherein the encapsulant is an elastomer. 22. The x-ray tube assembly of claim 1, wherein the first thermally conducting plate comprises radiused edges. 23. A device for cooling and electrically-insulating a high-voltage, heat-generating component, the device comprising: a first thermally-conductive material having a first side in thermal communication with the component and a second side; a thermally-conductive dielectric material having a first side in thermal communication with the second side of the first thermally-conductive material and a second side; a second thermally-conductive material having a first side in thermal communication with the second side of the thermally-conductive, dielectric material; and wherein heat generated by the component is conducted away from the component through the device while current loss across the device is minimized; wherein the first thermally-conductive material comprises an electrically-conductive material, and further comprising: a high voltage cable coupled with the first thermally-conductive, electrically-conductive material which powers the component. 24. The device as recited in claim 23, wherein the thermal communication between the component and the first thermally-conductive material is through an area of contact between the component and the first thermally-conductive material, the area of contact having a first outer dimension, and wherein the first thermally-conductive material comprises a periphery having a second outer dimension, greater than the first outer dimension, wherein at least some heat from the component is conducted in the first thermally-conductive material in a direction from the area of contact toward the periphery of the first thermally-conductive material. 25. The device as recited in claim 24, wherein the first thermally-conductive material comprises a first plate, wherein at least some heat is conducted in the first plate in a direction from the area of contact toward the periphery of the first plate, and hence through the thermally-conductive dielectric material to the second thermally-conductive material. 26. The device as recited in claim 25, further comprising means for facilitating removal of heat from the second thermally-conductive material. 27. The device as recited in claim 23, wherein the device further provides structural support for the component. 28. The device as recited in claim 27, wherein the device provides essentially all the structural support for the component. 29. The device as recited in claim 23, wherein the first thermally-conductive material comprises at least one of copper, aluminum, iron, silver, and gold. 30. The device as recited in claim 23, wherein the thermally-conductive dielectric material comprises one of aluminum nitride, beryllium oxide, and diamond-like carbon. 31. The device as recited in claim 23, wherein the high-voltage, heat-generating component comprises one of an x-ray generator, an electron-beam generator, a high-voltage lead, a high voltage power source, and a microwave generator. 32. The device as recited in claim 23, further comprising a housing containing the device and the component. 33. The device as recited in claim 32, wherein the only structural connection between the component and the housing comprises the device. 34. The device as recited in claim 23, wherein the first thermally-conductive material comprises a thermal spreader. 35. The device as recited in claim 23, wherein the first thermally-conductive material comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 36. The device as recited in claim 23, wherein the thermally-conductive dielectric material comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 37. The device as recited in claim 23, wherein sufficient heat is removed from the heat-generating component by means of the thermally-conductive, dielectric material whereby the heat-generating component may be air cooled. 38. The device as recited in claim 23, wherein sufficient heat is removed from the heat-generating component by means of the thermally-conductive, dielectric material whereby the heat-generating component is not contacted with a fluid coolant. 39. The device as recited in claim 23, wherein sufficient heat is removed from the heat-generating component by means of the thermally-conductive, dielectric material, and wherein the heat-generating component is surrounded with an encapsulant which is not a good conductor of heat. 40. The device as recited in claim 39, wherein the encapsulant is an elastomer. 41. The device of claim 23, wherein the first and/or second thermally-conductive materials comprise radiused edges. 42. A method for cooling an x-ray tube assembly comprising: providing a permanently vacuum sealed x-ray tube comprising a stationary, high-voltage, heated anode/cathode emerging therefrom at one end of the tube; and using a heat dissipating device coupled to the anode/cathode outside of the x-ray tube, the heat dissipating device, including: using a first thermally conducting plate having a first side in thermal communication with the anode/cathode and a second side, the first plate thermally spreading the heat from the anode/cathode; and using a thermally-conductive dielectric material plate having a first side in thermal communication with the second side of the first metal plate and a second side; wherein heat in the anode/cathode is conducted away from the anode/cathode through the device while current loss across the device is minimized. 43. The method as recited in claim 42, further comprising: using a second thermally conducting plate having a first side in thermal communication with the second side of the thermally-conductive dielectric material plate. 44. The method as recited in claim 43, further comprising: using the heat dissipating device for structural support of the anode/cathode. 45. The method as recited in claim 44, wherein the heat dissipating device provides essentially all the structural support for the anode/cathode. 46. The method as recited in claim 42, further comprising using a high voltage cable coupled with the first thermally conducting plate for powering the x-ray tube. 47. The method as recited in claim 42, wherein the first thermally conducting plate comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 48. The method as recited in claim 42, wherein the thermally-conductive dielectric material plate comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 49. The method as recited in claim 42, further comprising: providing a housing for holding the x-ray tube assembly. 50. The method as recited in claim 49, further comprising: using the heat dissipating device for structural support of the anode/cathode in the housing. 51. The method as recited in claim 50, wherein the heat dissipating device provides essentially all the support for the x-ray tube in the housing. 52. The method as recited in claim 42, wherein the thermally-conductive dielectric material comprises one of aluminum nitride, beryllium oxide, and diamond-like carbon. 53. The method as recited in claim 42, wherein the first thermally conducting plate comprises at least one of copper, aluminum, iron, silver, and gold. 54. The method as recited in claim 42 in combination with a method for analyzing a sample using x-rays, the method for analyzing comprising: exposing the sample to x-rays to cause at least one component of the sample to x-ray fluoresce; and analyzing the x-ray fluorescence from the sample to determine at least one characteristic of the sample. 55. The combination as recited in claim 54, wherein the sample comprises a fluid or a fluid stream. 56. The combination as recited in claim 55, wherein the sample comprises a petroleum product and the at least one characteristic of the fluid comprises a concentration of sulfur. 57. The combination as recited in claim 54, wherein the exposing and/or the analyzing comprises using at least one x-ray optic for focusing x-rays on the sample. 58. The combination as recited in claim 57, wherein the x-ray optic comprises an x-ray focusing crystal or an x-ray focusing capillary optic. 59. The method as recited in claim 42, wherein sufficient heat is removed from the x-ray tube by means of the heat dissipating device whereby the x-ray tube assembly may be air cooled. 60. The method as recited in claim 42, wherein sufficient heat is removed from the x-ray tube by means of the heat dissipating device whereby the x-ray tube is not contacted with a fluid coolant. 61. The method as recited in claim 42, wherein sufficient heat is removed from the x-ray tube by means of the heat dissipating device, and further comprising: surrounding the x-ray tube is with an encapsulant which is not a good conductor of heat. 62. The method as recited in claim 61, wherein the encapsulant is an elastomer. 63. The method of claim 42, wherein the first thermally conducting plate comprises radiused edges. 64. A method for cooling and electrically-insulating a high-voltage, heat-generating component, the method comprising: using a first thermally-conductive material having a first side in thermal communication with the component and a second side; using a thermally-conductive dielectric material having a first side in thermal communication with the second side of the first thermally-conductive material and a second side; using a second thermally-conductive material having a first side in thermal communication with the second side of the thermally-conductive, dielectric material; and wherein heat generated by the component is conducted away from the component through the device while current loss across the device is minimized; wherein the first thermally-conductive material comprises an electrically-conductive material, and further comprising: using a high voltage cable coupled with the first thermally-conductive, electrically-conductive material to power the component. 65. The method as recited in claim 64, wherein the thermal communication between the component and the first thermally-conductive material is through an area of contact between the component and the first thermally-conductive material, the area of contact having a first outer dimension, and wherein the first thermally-conductive material comprises a periphery having a second outer dimension, greater than the first outer dimension, wherein at least some heat from the component is conducted in the first thermally-conductive material in a direction from the area of contact toward the periphery of the first thermally-conductive material. 66. The method as recited in claim 65, wherein the first thermally-conductive material comprises a first plate, wherein at least some heat is conducted in the first plate in a direction from the area of contact toward the periphery of the first plate, and hence through the thermally-conductive dielectric material to the second thermally-conductive material. 67. The method as recited in claim 66, further comprising: removing heat from the second thermally-conductive material. 68. The method as recited in claim 64, further comprising: using said materials to provide structural support for the component. 69. The method as recited in claim 68, wherein the materials provide essentially all the structural support for the component. 70. The method as recited in claim 64, wherein the first thermally-conductive material comprises at least one of copper, aluminum, iron, silver, and gold. 71. The method as recited in claim 64, wherein the thermally-conductive dielectric material comprises one of aluminum nitride, beryllium oxide, and diamond-like carbon. 72. The method as recited in claim 64, wherein the high-voltage, heat-generating component comprises one of an x-ray generator, an electron-beam generator, a high-voltage lead, a high voltage power source, and a microwave generator. 73. The method as recited in claim 64, further comprising: using a housing to contain the component. 74. The method as recited in claim 73, wherein the only structural connection between the component and the housing comprises the materials. 75. The method as recited in claim 64, wherein the first thermally-conductive material comprises a thermal spreader. 76. The method as recited in claim 64, wherein the first thermally-conductive material comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 77. The method as recited in claim 64, wherein the thermally-conductive dielectric material comprises a plate having a surface area to thickness ratio of at least about 5 to 1. 78. The method as recited in claim 64, wherein sufficient heat is removed from the heat-generating component by means of the thermally-conductive, dielectric material whereby the heat-generating component may be air cooled. 79. The method as recited in claim 64, wherein sufficient heat is removed from the heat-generating component by means of the thermally-conductive, dielectric material whereby the heat-generating component is not contacted with a fluid coolant. 80. The method as recited in claim 64, wherein sufficient heat is removed from the heat-generating component by means of the thermally-conductive, dielectric material, and further comprising: surrounding the heat-generating component with an encapsulant which is not a good conductor of heat. 81. The method as recited in claim 80, wherein the encapsulant is an elastomer. 82. The method of claim 64, wherein the first and/or second thermally-conductive materials comprise radiused edges.
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