IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0405001
(2003-03-31)
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발명자
/ 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
Knobbe, Martens, Olson &
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인용정보 |
피인용 횟수 :
41 인용 특허 :
60 |
초록
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An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays.
An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.
대표청구항
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What is claimed is: 1. A thermoelectric system for use with at least one medium to be cooled or heated, comprising: a plurality of thermoelectric elements forming a thermoelectric array with a cooling side and a heating side, wherein at least one characteristic of at least some of the thermoelectri
What is claimed is: 1. A thermoelectric system for use with at least one medium to be cooled or heated, comprising: a plurality of thermoelectric elements forming a thermoelectric array with a cooling side and a heating side, wherein at least one characteristic of at least some of the thermoelectric elements is varied in the direction of medium movement; at least one heat exchanger on at least the cooling and/or the heating side in thermal communication with at least one thermoelectric element; and a substrate between at least one thermoelectric element and the at least one heat exchanger, wherein the substrate is configured to substantially thermally isolate the at least one thermoelectric element from other of the plurality of thermoelectric elements while maintaining good thermal contact between the at least one thermoelectric element and the at least one heat exchanger. 2. A thermoelectric system for use with at least one medium to be cooled or heated, comprising: a plurality of thermoelectric elements forming a thermoelectric array with a cooling side and a heating side, wherein at least one characteristic of at least some of the thermoelectric elements is varied in the direction of medium movement; at least one heat exchanger on at least the cooling and/or the heating side in thermal communication with at least one thermoelectric element; and a substrate between at least one thermoelectric element and the at least one heat exchanger, wherein the substrate is configured to substantially thermally isolate the at least one thermoelectric element from other of the plurality of thermoelectric elements; wherein the substrate has at least one gap forming a row of thermoelectric elements. 3. The thermoelectric system of claim 2, wherein the heat exchanger is in thermal communication with a row thermoelectric elements. 4. A thermoelectric system for use with at least one medium to be cooled or heated, comprising: a plurality of thermoelectric elements forming a thermoelectric array with a cooling side and a heating side, wherein at least one characteristic of at least some of the thermoelectric elements is varied in the direction of medium movement; at least one heat exchanger on at least the cooling and/or the heating side in thermal communication with at least one thermoelectric element; and a substrate between at least one thermoelectric element and the at least one heat exchanger, wherein the substrate is configured to substantially thermally isolate the at least one thermoelectric element from other of the plurality of thermoelectric elements, wherein the heat exchanger comprises a plurality of portions, at least some of the portions each in thermal communication with at least one thermoelectric element, at least some of the portions substantially thermally isolated from other of said portions in the direction of medium movement. 5. The thermoelectric system of claim 4, wherein at least some of the portions comprise heat pipes. 6. The thermoelectric system of claim 1, wherein the heat exchanger comprises a corrugation of thin metal fins that are in good thermal contact with the thermoelectric elements through the substrate. 7. The thermoelectric system of claim 1, wherein the heat exchanger is constructed of a conductive material. 8. The thermoelectric system of claim 7, wherein the conductive material is copper. 9. A thermoelectric system for use with at least one medium to be cooled or heated, comprising: a plurality of thermoelectric elements, wherein at least some of the thermoelectric elements are in thermal communication with a heat exchanger; and a substrate between at least some of the thermoelectric elements and the heat exchanger, wherein the substrate is configured to substantially thermally isolate at least one thermoelectric element from at least one other thermoelectric element while maintaining good thermal contact between the at least one thermoelectric element and the heat exchanger. 10. A thermoelectric system for use with at least one medium to be cooled or heated, comprising: a plurality of thermoelectric elements, wherein at least some of the thermoelectric elements are in thermal communication with a heat exchanger; and a substrate between at least some of the thermoelectric elements and the heat exchanger, wherein the substrate is configured to substantially thermally isolate at least one thermoelectric element from at least one other thermoelectric element, wherein the substrate has at least one gap that acts to substantially thermally isolate the thermoelectric element. 11. The thermoelectric system of claim 10, wherein the at least one gap is filled with an isolating medium. 12. The thermoelectric system of claim 11, wherein the isolating medium is air. 13. The thermoelectric system of claim 11, wherein the isolating medium is a thermally insulative material. 14. The thermoelectric system of claim 9, wherein the substrate is comprised of a layer of insulation. 15. The thermoelectric system of claim 14, wherein the layer of insulation has gaps that act to thermally isolate the thermoelectric element. 16. The thermoelectric system of claim 15, wherein at least one gap is filled with an isolating medium. 17. The thermoelectric system of claim 16, wherein the isolating medium is air. 18. The thermoelectric system of claim 16, wherein the isolating medium is a thermally insulative material. 19. The thermoelectric system of claim 14, wherein the layer of insulation has a thickness that provides good heat transfer normal to the plane of the layer. 20. The thermoelectric system of claim 14, wherein the layer of insulation is anisotropic allowing a higher thermal conductivity in the direction from the thermoelectric element to the heat exchanger than iii the direction along the substrate. 21. The thermoelectric system of claim 9, wherein the substrate has an electrically conductive cladding. 22. The thermoelectric system of claim 21, wherein the cladding is made from a copper material. 23. The thermoelectric system of claim 9, wherein the substrate has a thickness of less than about 0.05 mm. 24. The thermoelectric system of claim 9, wherein the substrate has a layer consisting of a printed circuit material. 25. The thermoelectric system of claim 24, wherein the printed circuit material is electrically insulative. 26. The thermoelectric system of claim 24, wherein the printed circuit material is flexible. 27. The thermoelectric system of claim 24, wherein the printed circuit material consists of Kapton MT. 28. The thermoelectric system of claim 27, wherein the printed circuit material has a thickness of about 0.025 mm. 29. The thermoelectric system of claim 28, wherein the Kapton MT has a thermal conductivity of about 0.5 W/mk. 30. The thermoelectric system of claim 27, wherein the substrate has a thickness of less than 0.05 mm. 31. The thermoelectric system of claim 30, wherein the Kapton MT has a thermal conductivity of about 20 W/mk. 32. A method of making an improved thermoelectric system for use with at least one medium to be cooled or heated, comprising the steps of: forming a substrate between at least one of a plurality of thermoelectric elements and a heat exchanger, wherein the substrate is configured to substantially thermally isolate the at least one thermoelectric element from other of the plurality of thermoelectric elements in at least one direction of the system while maintaining good thermal contact between the at least one thermoelectric element and the heat exchanger; and exchanging heat from at least one side of the system in a manner that significantly maintains the thermal isolation. 33. The method of claim 32, wherein the step of forming the substrate comprises adding a layer of insulation between the thermoelectric element and the heat exchanger. 34. A method of making an improved thermoelectric system for use with at least one medium to be cooled or heated, comprising the steps of: forming a substrate between at least one of a plurality of thermoelectric elements and a heat exchanger, wherein the substrate is configured to substantially thermally isolate the at least one thermoelectric element from other of the plurality of thermoelectric elements in at least one direction of the system; adding at least one gap in the substrate; and exchanging heat from at least one side of the system in a manner that significantly maintains the thermal isolation. 35. The method of claim 34, further comprising the step of filling the at least one gap with an isolating medium. 36. The method of claim 35, further comprising the step of choosing the isolating medium that has thermally insulative properties. 37. The thermoelectric system of claim 1, wherein the substrate has at least one gap forming a row of thermoelectric elements. 38. The thermoelectric system of claim 37, wherein the heat exchanger is in thermal communication with a row of thermoelectric elements. 39. The thermoelectric system of claim 1, wherein the at least one heat exchanger comprises a plurality of portions, at least some of the portions each in thermal communication with at least one thermoelectric element, at least some of the portions substantially thermally isolated from other of said portions in the direction of medium movement. 40. The thermoelectric system of claim 39, wherein at least some of the portions comprise heat pipes. 41. The thermoelectric system of claim 9, wherein the substrate has at least one gap that acts to substantially thermally isolate the thermoelectric element. 42. The thermoelectric system of claim 41, wherein the at least one gap is filled with an isolating medium. 43. The thermoelectric system of claim 42, wherein the isolating medium is air. 44. The thermoelectric system of claim 42, wherein the isolating medium is a thermally insulative material. 45. The method of claim 32, further comprising the step of adding at least one gap in the substrate. 46. The method of claim 45, further comprising the step of filling the at least one gap with an isolating medium. 47. The method of claim 46, wherein the isolating medium has thermally insulative properties.
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