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A transistor includes a semiconductor channel disposed nearby a gate and in an electrical path between a source and a drain, wherein the channel and at least one of the source or the drain are separated by an interface layer so as to form a channel-interface layer-source/drain junction in which a Fe

A transistor includes a semiconductor channel disposed nearby a gate and in an electrical path between a source and a drain, wherein the channel and at least one of the source or the drain are separated by an interface layer so as to form a channel-interface layer-source/drain junction in which a Fermi level of the semiconductor channel is depinned in a region near the junction and the junction has a specific contact resistance of less than approximately 1000 Ω-μm2 . The interface layer may include a passivating material such as a nitride, a fluoride, an oxide, an oxynitride, a hydride and/or an arsenide of the semiconductor of the channel. In some cases, the interface layer consists essentially of a monolayer configured to depin the Fermi level of the semiconductor of the channel, or an amount of passivation material sufficient to terminate all or a sufficient number of dangling bonds of the semiconductor channel to achieve chemical stability of the surface. Also, the interface layer may include a separation layer of a material different than the passivating material. Where used, the separation layer has a thickness sufficient to reduce effects of metal-induced gap states in the semiconductor channel.

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What is claimed is: 1. A method comprising: forming an interface layer on one or more surfaces of a semiconductor channel of a transistor, the semiconductor channel formed by removing a portion of a semiconductor substrate that is not protected by a mask created at least in part by a gate structure

What is claimed is: 1. A method comprising: forming an interface layer on one or more surfaces of a semiconductor channel of a transistor, the semiconductor channel formed by removing a portion of a semiconductor substrate that is not protected by a mask created at least in part by a gate structure formed above the semiconductor channel; and forming, on one or more surfaces of the interface layer opposite the semiconductor channel, a source or drain terminal for the transistor so as to create a channel-interface layer-source/drain junction in which a Fermi level of the semiconductor channel is depinned in a region near the junction. 2. The method of claim 1 wherein the interface layer comprises an amount of a passivation material sufficient to terminate all or a sufficient number of dangling bonds of the one or more surfaces of the semiconductor channel to achieve chemical stability of the one or more surfaces. 3. A method comprising: forming an interface layer on one or more surfaces of a semiconductor channel of a transistor, the semiconductor channel made of one of Si, Ge, SiGe, SiGeC, or SiC; and forming, on one or more surfaces of the interface layer opposite the semiconductor channel, a source or drain terminal for the transistor so as to create a channel-interface layer-source/drain junction in which a Fermi level of the semiconductor channel is depinned in a region near the junction. 4. The method of claim 3 wherein the gate is formed on an oxide layer disposed over the semiconductor channel. 5. The method of claim 4 wherein the oxide layer comprises a dielectric layer sufficiently thick enough to provide only capacitive coupling between the gate and the semiconductor channel. 6. The method of claim 5 wherein the source or drain terminal is formed from a seed layer created by anisotropically depositing seed layer material on the semiconductor substrate. 7. The method of claim 4 wherein the oxide layer is formed over the semiconductor substrate by oxidizing the substrate. 8. The method of claim 7 wherein the gate is formed on the oxide layer by depositing a layer of metal on the oxide layer and removing a portion of the deposited layer of metal based on a lithographic exposure. 9. The method of claim 8 wherein the interface layer is formed by covalently bonding at least a monolayer of a passivation material to the semiconductor channel. 10. The method of claim 9 wherein the passivation material comprises one or more of a nitride of the semiconductor channel, a fluoride of the semiconductor channel, an oxide of the semiconductor channel, an oxynitride of the semiconductor channel, a hydride of the semiconductor channel and/or an arsenide of the semiconductor channel. 11. The method of claim 9 wherein the interface layer includes a separation layer comprising a material different than the passivation material. 12. The method of claim 11 wherein the material that makes up the separation layer comprises an oxide of the semiconductor channel. 13. The method of claim 3 wherein the interface layer comprises an amount of a passivation material sufficient to terminate all or a sufficient number of dangling bonds of the one or more surfaces of the semiconductor channel to achieve chemical stability of the one or more surfaces.