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Liquid cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0964344 (2004-10-13)
발명자 / 주소
  • Hamman,Brian A.
출원인 / 주소
  • QNX Cooling Systems Inc.
대리인 / 주소
    Patent Dominion LP
인용정보 피인용 횟수 : 43  인용 특허 : 9

초록

Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. In each embodiment a plurality of heat transfer systems capable of engaging a plurality heat generating components and each suc

대표청구항

What is claimed is: 1. A cooling system comprising: N heat exchange systems for receiving heated coolant and for cooling said coolant to provide a cooled coolant and where N is more than 1; a plurality of heat transfer systems for receiving cooled coolant from a heat exchange system, each heat tran

이 특허에 인용된 특허 (9)

  1. Porter Warren W. (Escondido CA), Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices.
  2. Lopez Roger (Louisville CO), Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor.
  3. Malhammar .ANG.ke,SEX ; Palm Bjorn,SEX, Cooling system for electronics.
  4. Hiroyuki Miki JP, Cooling/heating apparatus for semiconductor processing liquid.
  5. Kondo, Yoshihiro; Ohashi, Shigeo; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuji; Nakanishi, Masato; Sasaki, Yasuhiko; Nakagawa, Tsuyoshi; Suzuki, Osamu; Matsushita, Shinji; Yamada, Yasunori, Electronic equipment.
  6. Nori,Hitoshi; Wei,Jie, High efficiency cooling system and heat absorbing unit.
  7. Marsala, Joseph, Pumped liquid cooling system using a phase change refrigerant.
  8. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
  9. Garner, Scott D., Thermal management system and method for electronics system.

이 특허를 인용한 특허 (43)

  1. Graybill, David P.; Iyengar, Madhusudan K; Newcomer, Jeffrey A.; Schmidt, Roger R., Airflow recirculation and cooling apparatus and method for an electronics rack.
  2. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  3. Iyengar, Madhusudan K.; Kamath, Vinod; Matteson, Jason A.; Schmidt, Roger R.; Steinke, Mark E., Apparatus and method for facilitating cooling of an electronics system.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
  7. Pokhama,Himanshu; Mongia,Rajiv K.; DiStefano,Eric, Apparatus to use a refrigerator in mobile computing device.
  8. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  9. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  10. Rasmussen,Neil; Bean,John H.; Uhrhan,Greg R.; Buell,Scott D., Cooling system and method.
  11. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  12. Heydari,Ali; Yang,Ji L., Direct contact cooling liquid embedded package for a central processor unit.
  13. Chu, Richard C.; Iyengar, Madhusudan K.; Kamath, Vinod; Schmidt, Roger R., Energy efficient apparatus and method for cooling an electronics rack.
  14. Heydari,Ali; Gektin,Vadim, Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components.
  15. Tang, Xian-Xiu, Heat dissipation system and rack-mount server using the same.
  16. Bean, Jr., John H., Ice thermal storage.
  17. Bean, Jr., John H., Ice thermal storage.
  18. Wexler, Peter, In-row air containment and cooling system and method.
  19. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  20. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  21. Toftloekke, Mikkel Block; Lykke, Peter; Kristensen, Poul Hove, Liquid cooling system for an electronic system.
  22. Tutunoglu, Ozan, Method and apparatus for cooling.
  23. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  24. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  25. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  26. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  27. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  28. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  29. Rohr, Daniel J., Optically detected liquid depth information in a climate control unit.
  30. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  31. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  32. Bean, John H.; Lomas, Jonathan M., Sub-cooling unit for cooling system and method.
  33. Bean, John H; Lomas, Jonathan M, Sub-cooling unit for cooling system and method.
  34. Bean,John H.; Lomas,Jonathan M., Sub-cooling unit for cooling system and method.
  35. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  36. Rasmussen, Neil; VanGilder, James W.; Zhang, Xuanhang, System and method for assessing and managing data center airflow and energy usage.
  37. Belady, Christian; Tanksalvala, Darius; Gostin, Gary, System and method for cooling an electronic component.
  38. Brundridge, Michael A.; Artman, Paul T.; Krueger, Bryan; Mehta, Abhishek, System and method for indirect throttling of a system resource by a processor.
  39. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  40. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  41. Pflueger,John C., Thermal docking station for electronics.
  42. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  43. Clidaras, Jimmy; Stiver, David W., Water-based data center.
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