초록

The present invention discloses a cover over electrical contacts of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.

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What is claimed is: 1. A probe card assembly comprising: a mounting structure configured to allow the probe card assembly to be attached to and detached from a testing apparatus; a plurality of electrical contacts configured to contact an electronic device disposed in the testing apparatus; and a c

What is claimed is: 1. A probe card assembly comprising: a mounting structure configured to allow the probe card assembly to be attached to and detached from a testing apparatus; a plurality of electrical contacts configured to contact an electronic device disposed in the testing apparatus; and a cover covering the electrical contacts, wherein the cover is configured to cover the electrical contacts while the probe card assembly is attached by the mounting structure to the testing apparatus and to be moved by the testing apparatus while the probe card assembly is attached by the mounting structure to the testing apparatus to expose the electrical contacts. 2. The probe card assembly of claim 1, wherein the testing apparatus comprises a semiconductor wafer prober, and the electronic device comprises one or more semiconductor dies. 3. The probe card assembly of claim 1, wherein the cover is configured to be engaged and moved by an actuator composing the testing apparatus. 4. A probe card assembly comprising: a mounting structure configured to attach the probe card assembly to a testing apparatus; a plurality of electrical contacts configured to contact an electronic device disposed in the testing apparatus; and a cover covering the electrical contacts, wherein the cover is configured to be moved by the testing apparatus while the mounting structure is attached to the testing apparatus to expose the electrical contacts, wherein the cover is configured to be engaged and moved by an actuator composing the testing apparatus and the actuator comprises at least one of an actuator arm, a robotic mechanism, a gear, and an electric motor. 5. The probe card assembly of claim 3, wherein the cover is configured to be detached from the probe card assembly by the actuator. 6. A probe card assembly comprising: a mounting structure configured to attach the probe card assembly to a testing apparatus; a plurality of electrical contacts configured to contact an electronic device disposed in the testing apparatus; and a cover covering the electrical contacts, wherein the cover is configured to be moved by the testing apparatus while the mounting structure is attached to the testing apparatus to expose the electrical contacts, wherein the cover is configured to be engaged and moved by an actuator composing the testing apparatus and the cover is configured to be engaged and moved by the actuator from a first position covering the electrical contacts to a second position exposing the electrical contacts while remaining attached to the probe card assembly. 7. The probe card assembly of claim 6, wherein in the first position the cover is attached and in the second position the cover is detached. 8. The probe card assembly of claim 3, wherein the cover comprises a structure feature configured to be engaged by the actuator. 9. The probe card assembly of claim 8, wherein the structural feature comprises at least one of a recess in the cover and a bayonet mount. 10. A method of testing an electronic device, the method comprising: providing a probe card assembly comprising electrical contacts and a cover protecting the electrical contacts; mounting the probe card assembly in a testing apparatus; while the probe card assembly is mounted in the testing apparatus, actuating a mechanism within the testing apparatus to move the cover to expose the electrical contacts; bringing the electrical contacts and the electronic device into contact; and providing test signals to the electronic device through the electrical contacts. 11. A method of testing an electronic device, the method comprising: mounting a probe card assembly comprising electrical contacts and a cover protecting the electrical contacts in a testing apparatus; actuating a mechanism within the testing apparatus to move the cover to expose the electrical contacts; bringing the electrical contacts and the electronic device into contact; and providing test signals to the electronic device through the electrical contacts, further comprising: after testing the electronic device and while the probe card assembly is mounted in the testing apparatus, moving the cover to cover the electrical contacts; and removing the probe card assembly from the testing apparatus. 12. The method of claim 10, wherein the testing apparatus comprises a semiconductor wafer prober, and the electronic device comprises one or more semiconductor dies. 13. A method of testing an electronic device, the method comprising: mounting a probe card assembly comprising electrical contacts and a cover protecting the electrical contacts in a testing apparatus; actuating a mechanism within the testing apparatus to move the cover to expose the electrical contacts; bringing the electrical contacts and the electronic device into contact; and providing test signals to the electronic device through the electrical contacts, wherein the mechanism comprises at least one of an actuator arm, a robotic mechanism, a gear, and an electric motor. 14. The method of claim 10, wherein the actuating step comprises detaching the cover from the probe card assembly. 15. A method of testing an electronic device, the method comprising: mounting a probe card assembly comprising electrical contacts and a cover protecting the electrical contacts in a testing apparatus; actuating a mechanism within the testing apparatus to move the cover to expose the electrical contacts; bringing the electrical contacts and the electronic device into contact; and providing test signals to the electronic device through the electrical contacts, wherein the actuating step comprises moving the cover from a first position in which the cover covers the electrical contacts to a second position in which the electrical contacts are exposed, and the cover is attached to the probe card assembly in both the first position and the second position. 16. The method of claim 10, wherein the actuating step comprises causing the mechanism to engage a structural feature of the cover. 17. The method of claim 16, wherein the structural feature comprises at least one of a recess in the cover and a bayonet mount. 18. A method of testing an electronic device, the method comprising: providing a probe card assembly comprising electrical contacts and a cover protecting the electrical contacts; mounting the probe card assembly in a test position in a testing apparatus; while the probe card assembly is in the test position: moving the cover to expose the electrical contacts; bringing the electrical contacts and an electronic device into contact; and providing test signals to the electronic device through the electrical contacts. 19. The method of claim 18, wherein the moving step comprises actuating a mechanism within the testing apparatus to move the cover. 20. The method of claim 19, wherein the moving step further comprises causing the mechanism to engage a structural feature of the cover. 21. The method of claim 18, wherein the testing apparatus comprises a semiconductor wafer prober, and the electronic device comprises one or more dies. 22. The method of claim 18 further comprising: after testing the electronic device and while the probe card assembly is mounted in the testing apparatus, moving the cover to cover the electrical contacts; and removing the probe card assembly, including the cover, from the testing apparatus.