초록 ▼

The present invention uses plastic film in vacuum sealing an OLED. Inorganic insulating films which can prevent oxygen or water from being penetrated therein and an organic insulating film which has a smaller internal stress than that of the inorganic insulating films are laminated on an inside of t

The present invention uses plastic film in vacuum sealing an OLED. Inorganic insulating films which can prevent oxygen or water from being penetrated therein and an organic insulating film which has a smaller internal stress than that of the inorganic insulating films are laminated on an inside of the plastic film. By sandwiching the organic insulating film between the inorganic insulating films, a stress can be relaxed. Further, by laminating a plurality of inorganic insulating films, even if one of the inorganic insulating films has a crack, the other inorganic insulating films can effectively prevent oxygen or water from being penetrated into an organic light emitting layer. Further, the stress of the entire sealing film can be relaxed and cracking due to the stress takes place less often.

대표청구항 ▼

What is claimed is: 1. A method of manufacturing a light-emitting device, comprising: putting a first plastic substrate and a second plastic substrate in which a light emitting element is formed there between into a plastic film, an inside of the plastic film covered with a plurality of insulating

What is claimed is: 1. A method of manufacturing a light-emitting device, comprising: putting a first plastic substrate and a second plastic substrate in which a light emitting element is formed there between into a plastic film, an inside of the plastic film covered with a plurality of insulating films; placing a drying agent in the plastic film; exhausting the plastic film; and closing a mouth of the plastic film, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films, and wherein the drying agent is in contact with an flexible printed circuit and with an end face of the substrate. 2. A method of manufacturing a light-emitting device, comprising: putting a plastic substrate having a light emitting element formed over the plastic substrate into a plastic film, an inside of the plastic film covered with a plurality of insulating films; placing a drying agent in the plastic film; exhausting the plastic film; and closing the mouth of the plastic film, wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films, and wherein the drying agent is in contact with an flexible printed circuit and with an end face of the substrate. 3. A method of manufacturing a light-emitting device according to any one of claims 1 and 2, wherein the plastic substrate comprises one selected from the group consisting of polyether sulfone, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate. 4. A method of manufacturing a light-emitting device according to any one of claims 1 and 2, wherein the plastic film comprises one selected from the group consisting of polyester, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, polyacrylonitrile, polyethylene terephthalate, and nylon. 5. A method of manufacturing a light-emitting device, comprising: forming a first adhesive layer on a first substrate; forming a first insulating film on the first adhesive layer; forming a light emitting element over the first insulating film; forming a second insulating film so as to cover the light emitting element; bonding a second substrate to the second insulating film using a second adhesive layer; removing the first adhesive layer to remove the first substrate and expose the first insulating film; bonding a third substrate to the first insulating film using a third adhesive layer; providing a plastic film, in which a plurality of insulating films are laminated on an inside of the plastic film such that the laminated plurality of insulating films cover the second substrate and the third substrate; exhausting the plastic film; and closing a mouth of the plastic film, wherein the second substrate and the third substrate comprise plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. 6. A method of manufacturing a light-emitting device, comprising: forming a first adhesive layer on a first substrate; forming a first insulating film on the first adhesive layer; forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film; forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line; bonding a second substrate to the second insulating film using a second adhesive layer; removing the first adhesive layer to remove the first substrate and expose the first insulating film; bonding a third substrate to the first insulating film using a third adhesive layer; removing a part of the second substrate, the second insulating film, and the second adhesive layer to expose a part of the wiring line; electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin; providing a plastic film, in which a plurality of insulating films are laminated on an inside of the plastic film such that the laminated plurality of insulating films cover the second substrate and the third substrate; exhausting the plastic film; and closing a mouth of the plastic film, wherein the second substrate and the third substrate comprise plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. 7. A method of manufacturing a light-emitting device, comprising: forming a first adhesive layer on a first substrate; forming a first insulating film on the first adhesive layer; forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film; forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line; bonding a second substrate to the second insulating film using a second adhesive layer; removing the first adhesive layer to remove the first substrate and expose the first insulating film; bonding a third substrate to the first insulating film using a third adhesive layer; removing a part of the third substrate, the first insulating film, and the third adhesive layer to expose a part of the wiring line; electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin; providing a plastic film, in which a plurality of insulating films are laminated on an inside of the plastic such that the laminated plurality of insulating films cover the second substrate and the third substrate; exhausting the plastic film; and closing a mouth of the plastic film, wherein the second substrate and the third substrate comprise plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. 8. A method of manufacturing a light-emitting device according to any one of claims 5 to 7, wherein the first adhesive layer is removed by spraying a fluid on the first adhesive layer. 9. A method of manufacturing a light-emitting device according to any one of claims 5 to 7, wherein the first adhesive layer contains silicon. 10. A method of manufacturing a light-emitting device according to claim 9, wherein halogen fluoride is used to remove the first adhesive layer. 11. A method of manufacturing a light-emitting device according to any one of claims 5 to 7, wherein the first adhesive layer contains SOG. 12. A method of manufacturing a light-emitting device according to claim 11, wherein hydrogen fluoride is used to remove the first adhesive layer. 13. A method of manufacturing a light-emitting device according to any one of claims 5 to 7, wherein a laser light is used to remove the first adhesive layer. 14. A method of manufacturing a light-emitting device according to claim 13, wherein the laser light is emitted from one selected from the group consisting of an excimer laser, YAG laser, and YVO4 laser of a pulse oscillation type or a continuous wave type. 15. A method of manufacturing a light-emitting device according to claim 13, wherein the laser light is one selected from the group consisting of a fundamental wave, a second harmonic wave, and a third harmonic wave of YAG laser. 16. A method of manufacturing a light-emitting device according to any one of claims 5 to 7, wherein at least one of the second substrate and the third substrate comprises one selected from the group consisting of polyether sulfone, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate. 17. A method of manufacturing a light-emitting device according to any one of claims 5 to 7, wherein the plastic film comprises one selected from the group consisting of polyester, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, polyacrylonitrile, polyethylene terephthalate, and nylon. 18. A method of manufacturing a light-emitting device, comprising: forming a first adhesive layer on a first substrate; forming a first insulating film on the first adhesive layer; forming a light emitting element over the first insulating film; forming a second insulating film so as to cover the light emitting element; bonding a second substrate to the second insulating film using a second adhesive layer; removing the first adhesive layer to remove the first substrate and expose the first insulating film; bonding a third substrate to the first insulating film using a third adhesive layer; removing the second adhesive layer to remove the second substrate and expose the second insulating film; providing a plastic film, in which a plurality of insulating films are laminated on an inside of the plastic film such that the laminated plurality of insulating films cover the second insulating film and the third substrate; exhausting the plastic film; and closing a mouth of the plastic film, wherein the third substrate comprises plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. 19. A method of manufacturing a light-emitting device, comprising: forming a first adhesive layer on a first substrate; forming a first insulating film on the first adhesive layer; forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film; forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line; bonding a second substrate to the second insulating film using a second adhesive layer; removing the first adhesive layer to remove the first substrate and expose the first insulating film; bonding a third substrate to the first insulating film using a third adhesive layer; removing the second adhesive layer to remove the second substrate and expose the second insulating film; removing a part of the second insulating film to expose a part of the wiring line; electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin; providing a flexible plastic film, in which a plurality of insulating films are laminated on an inside such that the laminated plurality of insulating films cover the second insulating film and the third substrate; exhausting the plastic film; and closing a mouth of the plastic film, wherein the third substrate comprises plastic, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. 20. A method of manufacturing a light-emitting device, comprising: forming a first adhesive layer on a first substrate; forming a first insulating film on the first adhesive layer; forming a light emitting element, a thin film transistor, and a wiring line over the first insulating film; forming a second insulating film so as to cover the light emitting element, the thin film transistor, and the wiring line; bonding a second substrate to the second insulating film using a second adhesive layer; removing the first adhesive layer to remove the first substrate and expose the first insulating film; bonding a third substrate to the first insulating film using a third adhesive layer; removing the second adhesive layer to remove the second substrate and expose the second insulating film; removing the third substrate, the first insulating film, and a part of the third adhesive layer to expose a part of the wiring line; electrically connecting the exposed part of the wiring line with a terminal of an FPC using an anisotropic conductive resin; providing a flexible plastic film, in which a plurality of insulating films are laminated on an inside of the plastic film such that the laminated plurality of insulating films cover the second insulating film and the third substrate; exhausting the plastic film; and closing a mouth of the plastic film, wherein the third substrate comprises, and wherein an internal stress of at least one of the plurality of insulating films is smaller than that of the other insulating films. 21. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein at least one of the first adhesive layer and the second adhesive layer is removed by spraying a fluid thereto. 22. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein the first adhesive layer contains silicon. 23. A method of manufacturing a light-emitting device according to claim 22, wherein halogen fluoride is used to remove the first adhesive layer. 24. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein the first adhesive layer contains SOG. 25. A method of manufacturing a light-emitting device according to claim 24, wherein hydrogen fluoride is used to remove the first adhesive layer. 26. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein at least one of the first adhesive layer and the second adhesive layer is removed by irradiating a laser light. 27. A method of manufacturing a light-emitting device according to claim 26, wherein the laser light is emitted from one selected from the group consisting of an excimer laser, YAG laser, and YVO4 laser of a pulse oscillation type or a continuous wave type. 28. A method of manufacturing a light-emitting device according to claim 26, wherein the laser light is one selected form the group consisting of a fundamental wave, a second harmonic wave, and a third harmonic wave of YAG laser. 29. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein the third substrate comprises one selected from the group consisting of polyether sulfone, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate. 30. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein the plastic film comprises one selected from the group consisting of polyester, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, polyacrylonitrile, polyethylene terephthalate, and nylon. 31. A method of manufacturing a light-emitting device according to any one of claims 18 to 20, wherein at least one of the plurality of insulating films comprises one selected from the group consisting of polyimide, acrylic, polyamide, polyimideamide, an epoxy resin, polyethylene, polytetrafluoroethyelen, polystyrene, benzocyclobutene, poly(p-phenylene vinylene), polyvinyl chloride, and a polyparaxylylene-based resin. 32. A method of manufacturing a light-emitting device according to any one of claims 1, 2, 5 to 7, and 18 to 20, wherein the light-emitting device is incorporated in at least one selected from the group consisting of a video camera, a digital camera, a goggle-type display, a personal computer, and a portable telephone. 33. A method of manufacturing a light-emitting device according to any one of claims 1 and 2, wherein the plurality of insulating films comprise two inorganic insulating films with an organic insulating film interposed therebetween.