초록 ▼

A disk-shaped wafer is described which is based on an inorganic sorbent and a binder, with a thickness of less than 700 microns, which can be obtained by pressing a mixture of the inorganic sorbent, about 20 to 60% by weight of the binder and about 10 to 15% by weight water at a pressure of at least

A disk-shaped wafer is described which is based on an inorganic sorbent and a binder, with a thickness of less than 700 microns, which can be obtained by pressing a mixture of the inorganic sorbent, about 20 to 60% by weight of the binder and about 10 to 15% by weight water at a pressure of at least 70 MPa; and calcining the resulting green wafer at temperatures of at least about 500째 C. until the water content is substantially removed.

대표청구항 ▼

The invention claimed is: 1. A disk-shaped wafer which is obtained by a process comprising the steps of compressing a mixture, comprised of an inorganic sorbent, about 20 to about 60 percent on a dry weight basis of a binder and about 10 to about 15 percent by weight water, wherein the quantity of

The invention claimed is: 1. A disk-shaped wafer which is obtained by a process comprising the steps of compressing a mixture, comprised of an inorganic sorbent, about 20 to about 60 percent on a dry weight basis of a binder and about 10 to about 15 percent by weight water, wherein the quantity of the water is based on its overall content in the mixture at a pressure of at least 70 MPa to form a green wafer, and calcining the resulting green wafer at a temperature of at least about 500째 C. until the water present in the calcined wafer comprises less than about 2 percent of the calcined wafer, by weight, wherein the thickness of the calcined wafer is less than about 700 microns. 2. The disk-shaped wafer of claim 1 wherein the weight ratio of the sorbent to the binder on a dry weight basis in the mixture is from about 3.2:1 to about 0.4:1. 3. The disk-shaped wafer of claim 1 wherein the green wafer is calcined until the wafer has a substantially constant weight. 4. The disk-shaped wafer of claim 1 wherein the inorganic sorbent comprises a natural or synthetic zeolite or mixtures thereof. 5. The disk-shaped wafer of claim 1 wherein the binder comprises a smectite clay. 6. The disk-shaped wafer of claim 1 wherein the binder comprises bentonite. 7. The disk-shaped wafer of claim 1 wherein the thickness of the calcined wafer is from about 200 to about 400 microns. 8. The disk-shaped wafer of claim 1 wherein the binder comprises from about 40 to about 50 percent by weight of the mixture prior to compressing. 9. The disk-shaped wafer of claim 1 wherein the pressure placed on the mixture is from about 100 to about 1300 MPa. 10. The disk-shaped wafer of claim 1 wherein the mixture further comprises a pressing aid. 11. The disk-shaped wafer of claim 10 wherein the pressing aid comprises a fatty acid salt of a divalent or trivalent metal. 12. The disk-shaped wafer of claim 1 wherein the binder comprises a tannin-containing binder. 13. The disk-shaped wafer of claim 1 wherein the binder comprises quebracho. 14. The disk-shaped wafer of claim 1 wherein the green wafer is calcined substantially under a vacuum. 15. The disk-shaped wafer of claim 1 wherein the mixture further comprises a dyeing pigment. 16. The disk-shaped wafer of claim 1 wherein the water content of the mixture determined at a 160째 C. prior to compressing is from about 12 to about 22 percent by weight. 17. The disk-shaped wafer of claim 1 wherein the water content of the mixture determined at a 160째 C. prior to compressing is from about 8 to about 22 percent by weight. 18. A process for producing a disk-shaped wafer comprising preparing a mixture containing at least one inorganic sorbent, about 20 to 60 percent by weight of at least one binder and about 10 to about 15 percent by weight water, compressing the mixture at a pressure at least 70 MPa to produce a green wafer, and calcining the green wafer at a temperature of at least about 500째 C. until the water content of the resulting disk-shaped wafer is less than about 2 percent by weight and its thickness is less than 700 microns. 19. The process of claim 18 wherein the weight ratio of the sorbent to the binder in the mixture on a dry weight basis is from about 3.2:1 to about 0.4:1. 20. The process of claim 18 wherein the calcination step is continued until the green wafer has a substantially constant weight. 21. The process of claim 18 wherein the water content of the mixture determined at 160째 C. prior to compressing is from about 12 to about 22 percent by weight. 22. The process of claim 18 wherein the water content of the mixture determined at 160째 C. prior to compressing is from about 8 to about 22 percent by weight. 23. A process for sorbing inorganic and organic gases or vapors from an electroluminescent device comprising placing the calcined, disk-shaped wafer of claim 1 within the electroluminescent device and closing the electroluminescent device.