초록 ▼

An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinu

An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a "patch" of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer. In one embodiment, the conductive material is deposited over the catalytic layer by electroless deposition. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or followed by chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.

대표청구항 ▼

The invention claimed is: 1. An electroless substrate processing apparatus, comprising: a liquid impermeable evaporation shield having a plenum coupled to a low partial pressure source and adapted to be positioned over a substrate positioned on a substrate support, the liquid impermeable evaporatio

The invention claimed is: 1. An electroless substrate processing apparatus, comprising: a liquid impermeable evaporation shield having a plenum coupled to a low partial pressure source and adapted to be positioned over a substrate positioned on a substrate support, the liquid impermeable evaporation shield having a liquid retaining surface that is fluidly coupled to the low partial pressure source through the plenum and adapted to form a gap with respect to the substrate, wherein the thickness of the gap is between about 0.5 millimeters and about 4 millimeters. 2. The apparatus of claim 1, wherein the liquid impermeable evaporation shield is sized to have an outer diameter that is greater than or equal to an outer diameter of the substrate. 3. The apparatus of claim 1, wherein the gap is adapted to be filled with a fluid layer. 4. The apparatus of claim 3, wherein the liquid impermeable evaporation shield further comprises at least one port to deliver a liquid to form the liquid layer. 5. The apparatus of claim 3, wherein the liquid impermeable evaporation shield further comprises at least one port to reclaim a liquid on the substrate. 6. The apparatus of claim 3, wherein the liquid impermeable evaporation shield further comprises at least one port to deliver a liquid to form the liquid layer and to reclaim the liquid on the substrate. 7. The apparatus of claim 1, wherein the liquid impermeable evaporation shield comprises a degassing membrane. 8. The apparatus of claim 3, wherein the liquid impermeable evaporation shield further comprises a seal adapted to contact the substrate support. 9. The apparatus of claim 3, wherein the substrate support further comprises a seal adapted to contact the liquid impermeable evaporation shield. 10. The apparatus of claim 3, wherein the liquid impermeable evaporation shield further comprises liquid agitation components selected from the group consisting of channels, veins, and protrusions, the liquid agitation components being disposed on a lower surface of the liquid impermeable evaporation shield. 11. The apparatus of claim 1, wherein the liquid impermeable evaporation shield comprises a material selected from the group consisting of polymers, ceramics, quartz, and coated metals. 12. The apparatus of claim 1, wherein the liquid impermeable evaporation shield comprises a polymer material. 13. An electroless substrate processing apparatus, comprising: a moveable evaporation shield adapted to be positioned over a substrate contacting a substrate support, the moveable evaporation shield comprising a degassing membrane positioned substantially parallel to a processing surface and in communication with a plenum in communication with a low partial pressure source, wherein the moveable evaporation shield forms an adjustable gap between the degassing membrane and the substrate. 14. The apparatus of claim 13, wherein the moveable evaporation shield further comprises a plenum port coupled to the plenum. 15. An electroless substrate processing apparatus, comprising: an evaporation shield adapted to be positioned over a substrate disposed on a substrate support, the evaporation shield comprising a degassing membrane positioned substantially parallel to a processing surface and a plenum in communication with the degassing membrane, wherein a gap is formed between the degassing membrane and the substrate; and a vacuum source coupled to the plenum. 16. An electroless substrate processing apparatus, comprising: an evaporation shield adapted to be positioned over a substrate disposed on a substrate support, the evaporation shield comprising a degassing membrane positioned substantially parallel to a processing surface and a plenum in communication with the degassing membrane, wherein a gap is formed between the degassing membrane and the substrate; and a low partial pressure source coupled to the plenum. 17. The apparatus of claim 3, wherein the liquid impermeable evaporation shield is adapted to provide heat to the liquid layer. 18. The apparatus of claim 3, wherein the liquid impermeable evaporation shield is adapted to rotate. 19. The apparatus of claim 13, wherein the moveable evaporation shield is adapted to be vertically moveable. 20. The apparatus of claim 1, wherein the liquid impermeable evaporation shield is adapted to be vertically moveable. 21. The apparatus of claim 7, wherein the degassing membrane is in communication with the liquid retaining surface and the plenum. 22. The apparatus of claim 1, wherein the low partial pressure source contains a low partial pressure of a defined gas. 23. The apparatus of claim 1, wherein the low partial pressure source is a vacuum. 24. The apparatus of claim 13, wherein the substrate support further comprises a heating element that is adapted to heat a substrate positioned on the substrate support. 25. The apparatus of claim 15, wherein the substrate support further comprises a heating element that is adapted to heat a substrate positioned on the substrate support. 26. The apparatus of claim 16, wherein the substrate support further comprises a heating element that is adapted to heat a substrate positioned on the substrate support. 27. The apparatus of claim 13, wherein the moveable evaporation shield further comprises a liquid port that is in liquid communication with one or more liquid sources and is adapted to deliver a liquid to the substrate contacting the substrate support. 28. The apparatus of claim 13, wherein the low partial pressure source is adapted to apply a vacuum pressure to the plenum. 29. The apparatus of claim 15, wherein a chemical processing solution positioned in the gap is in fluid communication with the degassing membrane and the substrate, wherein the chemical processing solution is selected from a group consisting of a Group IV metal containing solution, a copper containing solution, a reducing agent solution, and combinations thereof. 30. The apparatus of claim 16, wherein a chemical processing solution positioned in the gap is in fluid communication with the degassing membrane and the substrate, wherein the chemical processing solution is selected from a group consisting of a Group IV metal containing solution, a copper containing solution, a reducing agent solution, and combinations thereof. 31. The apparatus of claim 13, wherein the substrate support has a substrate supporting surface that is adapted to support and align the substrate relative to the degassing membrane during processing. 32. The apparatus of claim 1, wherein the evaporation shield support further comprises an embedded heating element that is adapted to heat a liquid an the substrate. 33. The apparatus of claim 13, wherein the evaporation shield support further comprises an embedded heating element that is adapted to heat a liquid on the substrate. 34. The apparatus of claim 15, wherein the evaporation shield support further comprises an embedded heating element that is adapted to heat a liquid on the substrate. 35. The apparatus of claim 16, wherein the evaporation shield support further comprises an embedded heating element that is adapted to heat a liquid on the substrate. 36. The apparatus of claim 16, wherein the degassing membrane comprises a first surface and a second surface, wherein the first surface is in liquid communication with the plenum. 37. The apparatus of claim 13, wherein the degassing membrane is adapted to remove a gaseous component from a liquid in contact with one surface of the degassing membrane. 38. The apparatus of claim 13, wherein the gap is sized to retain a fixed amount of liquid.